Technical Program

Program Sessions: Thursday June 1st 9:30 AM – 12:35 PM

Session 18: Advanced Photonic Packaging and Interconnect
Committee: Photonics
Room: Palazzo E

Session Co-Chairs:

Richard Pitwon
Resolute Photonics, Ltd.
Email: [email protected]

Soon Jang
ficonTEC USA
Email: [email protected]


1. Backside Optical Coupler: A Novel I/O for Mechanically Stable High Efficiency Fiber Coupling
Sugeet Sunder – University of Southern California
Akhilesh Jaiswal – University of Southern California
Ajey Jacob – University of Southern California

2. QPSK Transmitter Photonics Integrated Circuit (PIC) with Integrated Micro-Transfer-Printed EAMs and Custom Driver Compatible with 3D Integration
Roshanak Shafiiha – Rockley Photonics
Clint Schow – University of California, Santa Barbara
Xinhong Du – University of California, Santa Barbara
Viviana Arrunategui-Norvick – University of California, Santa Barbara
Yujie Xia – University of California, Santa Barbara
Aaron Zilkie – Rockley Photonics

3. Low-Cost, HVM Singulation of Silicon Photonic ICs for Low-Loss Waveguide-to-Fiber Array Edge Coupling
Hiren Thacker – Cisco Systems, Inc.
Tong Wang – Cisco Systems, Inc.
Steve Moyer – Cisco Systems, Inc.
Mary Nadeau – Cisco Systems, Inc.
Sandeep Razdan – Cisco Systems, Inc.
Ginni Chadha – Cisco Systems, Inc.

4. Packaging of Ultra-Dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-Systems
Geert Van Steenberge – imec/Ghent University
Gunther Roelkens – imec/Ghent University
Peter Ossieur – imec/Ghent University
Jeroen Missinne – imec/Ghent University
Joris Van Campenhout – imec
Milan M. Milosevic – PHIX Photonics Assembly
Paraskevas Bakopoulos – NVIDIA
Igor Krestnikov – Innolume
Stefano Stracca – Ericsson Research
Tanja Joerg – AT&S AG
Tanja Braun – Fraunhofer IZM
Qixiang Cheng – Cambridge University

5. Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy
Shengtao Yu – Georgia Institute of Technology
Muhannad S. Bakir – Georgia Institute of Technology
Thomas Gaylord – Georgia Institute of Technology

6. Realization, Multi-Field Coupled Simulation and Characterization of a Thermo-Mechanically Robust LiDAR Front End on a Copper Coated Glass Substrate
Marcel Kettelgerdes – Technical University of Applied Science Ingolstadt
Peter Meszmer – Chemnitz University of Technology
Michael J. Haeussler – Fraunhofer IZM
Gunnar Bottger – Fraunhofer IZM
Majid Tavakolibasti – Chemnitz University of Technology
Amit Pandey – Technical University of Applied Science Ingolstadt
Huseyin Erdogan – Continental AG
Gordon Elger – Technical University of Applied Science Ingolstadt
Ralph Schacht – Brandenburg University of Technology
Bernhard Wunderle – Chemnitz University of Technology

7. Cavity-Resonator-Integrated Guided-Mode-Resonance Mirrors for Hybrid Integration of Wavelength-Multiplexed Light Source
Akari Watanabe – Kyoto Institute of Technology
Shunsuke Teranishi – Kyoto Institute of Technology
Keisuke Ozawa – Kyoto Institute of Technology
Aika Taniguchi – Kyoto Institute of Technology
Junichi Inoue – Kyoto Institute of Technology
Kenji Kintaka – National Institute of Advanced Industrial Science and Technology
Shogo Ura – Kyoto Institute of Technology