Technical Program

Program Sessions: Thursday June 1st 9:30 AM – 12:35 PM

Session 16: Sintering and Soldering for High-Power, High-Reliability, and RF Devices
Committees: Assembly and Manufacturing Technology and Materials & Processing
Room: Mediterranean 1

Session Co-Chairs:

Mark Poliks
Binghamton University
Email: [email protected]

Omkar Gupte
Advanced Micro Devices, Inc.
Email: [email protected]

Papers:

1. Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance
Tamira Stegmann – Heraeus Germany GmbH & Co. KG
Andre Schwoebel – Heraeus Germany GmbH & Co. KG
Wolfgang Schmitt – Heraeus Germany GmbH & Co. KG
Stefan Gunst – Heraeus Germany GmbH & Co. KG
Karsten Durst – Technical University Darmstadt
Nils Neugebauer – Justus Liebig University of Giessen
Peter Klar – Justus Liebig University of Giessen

2. Mechanical, Electrical and Thermal Reliability Analysis of Cu Sintered Die-Attach SiC Power Device
Xu Liu – Delft University of Technology
Shaogang Wang – Delft University of Technology
Hai Chi – Southern University of Science and Technology
Dong Hu – Delft University of Technology
Qian-Ming Huang – Southern University of Science and Technology
Huaiyu Ye – Southern University of Science and Technology
Guoqi Zhang – Delft University of Technology

3. Functional Thermal Imaging and Effect of Temperature on Liquid Thermal Interface Material (LTIM) for Solid State Drive
Vigneshwarram Kumaresan – Western Digital Corporation
Mutharasu Devarajan – Western Digital Corporation

4. Risk Assessment of Hybrid Low Temperature Solder on Surface Mount Technology and Board Level Reliability for BGA Packages
Jihyun Lee – Samsung Electronics Co., Ltd.
Yongsung Park – Samsung Electronics Co., Ltd.
Junho Lee – Samsung Electronics Co., Ltd.
Hansung Ryu – Samsung Electronics Co., Ltd.
JeeHyun Jung – Samsung Electronics Co., Ltd.
Kangjoon Lee – Samsung Electronics Co., Ltd.
Kilsoo Kim – Samsung Electronics Co., Ltd.

5. An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
Hongwen Zhang – Indium Corporation
Tyler Richmond – Indium Corporation
Huaguang Wang – Indium Corporation

6. High Performance Gallium 68.5-Indium 21.5-Tin 10 Eutectic Alloy Based Thermal Interface Material Incorporating Porous Cu Layer
Jang Baeg Kim – Sungkyunkwan University
Dong Gil Kang – Sungkyunkwan University
Tae Joon Noh – Sungkyunkwan University
Sea Hwan Kim – Sungkyunkwan University
Seung-Boo Jung – Sungkyunkwan University

7. Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints With Reduced Processing Parameters
Steffen Hadeler – Leibniz University
Yangyang Long – Leibniz University
Rico Ottermann – Leibniz University
Folke Dencker – Leibniz University
Jens Twiefel – Leibniz University
Marc Christopher Wurz – Leibniz University