Technical Program

Thursday, June 02, 2022

Session 16: Hybrid & Direct Bonding Innovation, Optimization & Yield Improvement
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Coral 1&2

Session Co-Chairs:

Xin Yan
Intel Corporation
[email protected]
Kangwook Lee
SK Hynix
[email protected]


1. The Wafer Bonding Yield Improvement Through Control of SiCN Film Composition and Cu Pad Shape
Dail Rim - SK Hynix
Byungho Lee - SK Hynix
Jinwon Park - SK Hynix
Changhyun Cho - SK Hynix
Jiho Kang - SK Hynix
Ilseop Jin - SK Hynix

2. Low Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper
Wei-Lan Chiu - Industrial Technology Research Institute
Ou-Hsiang Lee - Industrial Technology Research Institute
Chia-Wen Chiang - Industrial Technology Research Institute
Hsiang-Hung Chang - Industrial Technology Research Institute

3. Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement
M Mariappan - Global INTegration Initiative
K Mori - T-Micro
M Sawa - JCU
E Sone - JCU
M Koyanagi - T-Micro
T Fukushima - Global INTegration Initiative

4. A Holistic Development Platform for Hybrid Bonding
Liu Jiang - Applied Materials, Inc.
Srikrishna Sitaraman - Applied Materials, Inc.
Sefa Dag - Applied Materials, Inc.
Mohammad Masoomi - Applied Materials, Inc.
Kwangwon Choi - Applied Materials, Inc.
Ying Wang - Applied Materials, Inc.
Prayudi Linato - Applied Materials, Inc.
Gilbert See - Applied Materials, Inc.
El Mehdi Bazizi - Applied Materials, Inc.
Blessy Alexander - Applied Materials, Inc.

5. Low Temperature Fine-Pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate
Jun-Peng Fang - Tsinghua University
Jian Cai - Tsinghua University
Qian Wang - Tsinghua University
Xiu-Yu Shi - Tsinghua University
Kai Zheng - Semiconductor Technology Innovation Center (Beijing) Corporation
Yi-Kang Zhou - Semiconductor Technology Innovation Center (Beijing) Corporation

6. Wet Atomic Layer Etching of Copper Structures for Highly Scaled Copper Hybrid Bonding and Fully Aligned Vias
Christopher Netzband - TEL Technology Center, America, LLC
Sitaram Arkalgud - TEL Technology Center, America, LLC
Paul Abel - Tokyo Electron America, Inc.
Jacques Faguet - Tokyo Electron America, Inc.

7. A Study on Bonding Pad Structure and Layout for Fine Pitch Hybrid Bonding
SeonKyeong Seo - Samsung Electronics Co., Ltd.
HyoEun Kim - Samsung Electronics Co., Ltd.
YeongSeon Kim - Samsung Electronics Co., Ltd.
Chaje Cho - Samsung Electronics Co., Ltd.
DaeWoo Kim - Samsung Electronics Co., Ltd.