Technical Program

Program Sessions: Thursday June 1st 9:30 AM – 12:35 PM

Session 14: Advances in Heterogeneous Integration Bonding Technology
Committee: Materials & Processing
Room: Palazzo A & B

Session Co-Chairs:

Jae Kyu Cho
GlobalFoundries, Inc.
Email: [email protected]

Qianwen Chen
IBM Research
Email: [email protected]


1. Characterization of 300 mm Low Temperature SiCN PVD Films for Hybrid Bonding Application
Xavier Brun – Intel Corporation
Md M. Hasan – Intel Corporation
Patrick Carazzetti – Evatec AG
Carl Drechsel – Evatec AG
Ewald Strolz – Evatec AG

2. Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding
Fumihiro Inoue – Yokohama National University
Shunsuke Teranishi – DISCO Corporation
Tomoya Iwata – Yokohama National University
Koki Onishi – Yokohama National University
Naoko Yamamoto – DISCO Corporation
Akihito Kawai – DISCO Corporation
Shimpei Aoki – Toray Engineering Co., Ltd.
Takashi Hare – Toray Engineering Co., Ltd.
Akira Uedono – University of Tsukuba

3. Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking Using Cu-Cu Hybrid Bonding
Nagendra Sekhar Vasarla – Institute of Microelectronics A*STAR
Dileep Kumar Mishra – Institute of Microelectronics A*STAR
Prayudi Lianto – Applied Materials Singapore
Ser Choong Chong – Institute of Microelectronics A*STAR
Srinivasa Rao Vempati – Institute of Microelectronics A*STAR

4. A New Adhesive for CoW Cu-Cu Hybrid Bonding With High Throughput and Room Temperature Pre-Bonding
Yasuhisa Kayaba – Mitsui Chemicals, Inc.
Yuzo Nakamura – Mitsui Chemicals, Inc.
Wataru Okada – Mitsui Chemicals, Inc.
Takuo Shikama – Mitsui Chemicals, Inc.
Kahori Tamura – Mitsui Chemicals, Inc.
Satoshi Inada – Mitsui Chemicals, Inc.

5. Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating Using Microfluidic System
Po-Shao Shih – National Taiwan University
Jeng-Hau Huang – National Taiwan University
Chang-Hsien Shen – National Taiwan University
Yu-Chun Lin – National Taiwan University
Simon Johannes Graefner – National Taiwan University
Vengudusamy Renganathan – National Taiwan University
Chin-Li Kao – Advanced Semiconductor Engineering, Inc.
Yung-Sheng Lin – Advanced Semiconductor Engineering, Inc.
Yun-Ching Hung – Advanced Semiconductor Engineering, Inc.
Chun-Wei Chiang – Advanced Semiconductor Engineering, Inc.
C. Robert Kao – National Taiwan University

6. Volume-Controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-Pitch Flip Chip
Toyohiro Aoki – IBM Research, Tokyo
Katsuyuki Sakuma – IBM Research
Hiroyuki Mori – IBM Research, Tokyo
Koki Nakamura – IBM Research, Tokyo
Takashi Hisada – IBM Research, Tokyo

7. Effects of Room Temperature Laser-Assisted Bonding (LAB) Process on Microstructure and Reliability of Solder Joints
Yoon Hwan Moon – Electronics Telecommunications Research Institute
Jiho Joo – Electronics Telecommunications Research Institute
Gwang-Mun Choi – Electronics Telecommunications Research Institute
Chanmi Lee – Electronics Telecommunications Research Institute
Ki-Seok Jang – Electronics Telecommunications Research Institute
Jin-Hyuk Oh – Electronics Telecommunications Research Institute
In-Seok Kye – Electronics Telecommunications Research Institute
Yong-Sung Eom – Electronics Telecommunications Research Institute
Yong-Jun Oh – Hanbat National University
Kwang-Seong Choi – Electronics Telecommunications Research Institute