Session 13 – ECTC

Technical Program

Program Sessions: Thursday May 30th 9:30 AM – 12:35 PM

Session 13: Next-Generation Substrate Manufacturing Technologies
Committee: Packaging Technologies
Room:

Session Co-Chairs:

Markus Leitgeb
AT&S
Email: [email protected]

Kuldip Johal
MKS Instruments- MSD
Email: [email protected]

Papers:

1. Development of Next Generation Chemical Mechanical Planarization Processes for Panel-Level Heterogeneous Integration
Francoise Angoua — Intel Corporation
Aaditya Candadai — Intel Corporation
Daniel Rosales-Yeomans — Intel Corporation
Yosef Kornbluth — Intel Corporation
Dilan Seneviratne — Intel Corporation
Rahul Manepalli — Intel Corporation

2. Dry Processes to Form Fine Via/Trench and Seed Layer on Advanced Substrate
Wen Xiao — Applied Materials, Inc.
Qin Zhong — Applied Materials, Inc.
Cindy Mora — Applied Materials, Inc.
Anindarupa Chunder — Applied Materials, Inc.
Nicholas Loo — Applied Materials, Inc.
Sik Hin Chi — Applied Materials, Inc.
Cheng Sun — Applied Materials, Inc.
Weihua Qing — Applied Materials, Inc.
Harish V Penmethsa — Applied Materials, Inc.
Craig Rosslee — Applied Materials, Inc.
Jeff Turner — Applied Materials, Inc.

3. Direct Laser Patterning Using Excimer Laser on Polyimide Compositions With Low Dielectric Properties and Good Flexibility for Re-Distribution Layer
Kanta Wataji — Gigaphoton Inc
Akira Suwa — Gigaphoton Inc
Junichi Fujimoto — Gigaphoton Inc
Yasuhumi Kawasuji — Gigaphoton Inc
Takashi Yamaguchi — Arakawa Chemical Industries, Ltd.
Taiyo Nakamura — Arakawa Chemical Industries, Ltd.
Takashi Tazaki — Arakawa Chemical Industries, Ltd.
Masaru Sasago — ba2.so-net.ne.jp

4. New Power Delivery Network(PDN) Approach for Extremely Large FC-BGA With Organic Substrate Based on Over 1mm-Thick Core
Kyojin Hwang — Samsung Electronics Co., Ltd.
Woobin Jung — Samsung Electronics Co., Ltd.
Junghwa Kim — Samsung Electronics Co., Ltd.
Heeseok Lee — Samsung Electronics Co., Ltd.
Jisoo Hwang — Samsung Electronics Co., Ltd.
Heejung Choi — Samsung Electronics Co., Ltd.

5. X-Ray Photoelectron Spectroscopy (XPS) Investigations to Monitor the Surface Chemistry During Palladium-Free Colloidal Copper Activation
Ibbi Ahmet — Atotech (MKS Instruments)
André Beyer — Atotech (MKS Instruments)
Laurence J. Gregoriades — Atotech (MKS Instruments)
Julia Lehmann — Atotech (MKS Instruments)
Yvonne Welz — Atotech (MKS Instruments)

6. Development of Glass Core Substrate With the Stress Analysis, Transmission Characteristics and Reliability
Koji Fujimoto — DNP Co., Ltd.
Yashuhiro Okawa — DNP Co., Ltd.
Takahiro Tai — DNP Co., Ltd.
Satoru Kuramochi — DNP Co., Ltd.

7. High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High Density 3D Advanced Packaging Applications
Venugopal Govindarajulu — Yield Engineering Systems
Coby Tao — Yield Engineering Systems
Zia Karim — Yield Engineering Systems
Aneelman Brar — Yield Engineering Systems
Sung Jin Kim — Absolics