Technical Program

Wednesday, June 01, 2022

Session 12: Manufacturing and Assembly Process Modeling
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Coral 5

Session Co-Chairs:

Pradeep Lall
Auburn University
[email protected]
Yong Liu
ON Semiconductor
[email protected]


1. Multi-physics Simulation of Wafer-to-Wafer Bonding Dynamics
Nathan Ip - Tokyo Electron America, Inc.
Nima Nejadsadeghi - Tokyo Electron America, Inc.
Carlos Fonseca - Tokyo Electron America, Inc.
Norifumi Kohama - Tokyo Electron Kyushu, Ltd.
Kimio Motoda - Tokyo Electron Kyushu, Ltd.

2. Simulation and Verification of Ag-Cu Core-shell Sintered Paste for Power Semiconductor Die-attach Applications
xinyue wang - Fudan University
Zejun Zeng - Fudan University
Jing Zhang - Heraeus Materials Technology, Ltd.
Guoqi Zhang - Delft University of Technology
Pan Liu - Fudan University

3. Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package
Yangming Liu - Western Digital
Ning Ye - Western Digital
Bo Yang - Western Digital
Xu Wang - Western Digital
Jacky Liu - Western Digital
Shenghua Huang - Western Digital
Chin-Tien Chiu - Western Digital

4. Novel Method for NCF Flow Simulation in HBM Thermal Compression Bonding Process to Optimize the NCF Shape
Jong Pa Hong - Samsung Electronics Co., Ltd.
Su Chang Lee - Samsung Electronics Co., Ltd.
Sun Woo Han - Samsung Electronics Co., Ltd.
Sang Kun Oh - Samsung Electronics Co., Ltd.
Sang Sik Park - Samsung Electronics Co., Ltd.
Hyeong Mun Kang - Samsung Electronics Co., Ltd.
Won Keun Kim - Samsung Electronics Co., Ltd.
Kil Soo Kim - Samsung Electronics Co., Ltd.
Dan Oh - Samsung Electronics Co., Ltd.

5. Numerical Evaluation on SiO2 Based Chip to Wafer Hybrid Bonding Performance by Finite Element Analysis
Lin Ji - Institute of Microelectronics (IME), A*STAR
Sasi Kumar Tippabhotla - Institute of Microelectronics (IME), A*STAR

6. A Novel Equivalent Model for Underfill Molding Process on 2.2D Structure for High Performance Applications
Yu-En Liang - CoreTech System (Moldex3D)
Chia-Peng Sun - CoreTech System (Moldex3D)
Chih Chung Hsu - CoreTech System (Moldex3D)
Dyi-Chung Hu - SiPlus Co., Ltd.
EH Chen - SiPlus Co., Ltd.
Jeffrey(Chang-Bing) Lee - iST-Integrated Service Technology, Inc.

7. Key Steps from Laboratory Towards Mass Production: Optimization of Electroless Plating Process Through Numerical Simulation
Simon Johannes Gräfner - National Taiwan University
Jeng-Hau Huang - National Taiwan University
Yu-An Chen - National Taiwan University
Po-Shao Shih - National Taiwan University
Ching-Han Huang - National Taiwan University
C. Robert Kao - National Taiwan University