Technical Program

Program Sessions: Wednesday May 31st 2:00 PM – 5:05 PM

Session 11: Additive Manufacturing and Packaging for Flexible Electronics
Committee: Emerging Technologies
Room: Mediterranean 6

Session Co-Chairs:

Tengfei Jiang
University of Central Florida
Email: [email protected]

Dishit Parekh
Intel Corporation
Email: [email protected]

Papers:

1. Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications
El Mehdi Abbara – Binghamton University
Mohammed Alhendi – Binghamton University
Riadh Al-haidari – Binghamton University
Nathaniel Gee – Binghamton University
Mark Poliks – Binghamton University
Emily Boggs – GE Research
Tan Yewteck – GE Research
Deepak Trivedi – GE Research
Christopher Tabor – AFRL

2. Electrochemical Additive Manufacturing: A Novel Approach to Thermal Management of Electronics
Ian Winfield – Fabric8Labs
Joseph Madril – Fabric8Labs
Madeline Frank – Fabric8Labs
Michael Matthews – Fabric8Labs

3. Additively Manufactured Flexible Material Characterization and On-Demand Smart Packaging Topologies for 5G/mmWave Wearable Applications
Kexin Hu – Georgia Institute of Technology
Yi Zhou – Georgia Institute of Technology
Suresh Sitaraman – Georgia Institute of Technology
Manos Tentzeris – Georgia Institute of Technology

4. Advanced Packaging Methods Used for Energy Storage From Intermittent Renewable Sources
Takafumi Fukushima – Tohoku University
Tianyu Xiang – University of California, Los Angeles
Harshit Ranjan – University of California, Los Angeles
Niharika Tripathi – University of California, Los Angeles
Randall Irwi – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles

5. Advances in Conductive Features in Digitally Manufactured Electronics
Bryce Gray – Sciperio
Jason Benoit – Sciperio
Mark Kloza – Sciperio
Kenneth Church – Sciperio

6. Adhesion and Reliability Studies of the Homogeneous Integration of Conductive L.S.R. and Other Components on SIP for Bio Sensing Applications
ChihLung (Steven) Lin – Advanced Semiconductor Engineering, Inc.
Pang Yuan Lee – Advanced Semiconductor Engineering, Inc.
Kueihao Tseng – Advanced Semiconductor Engineering, Inc.
Jenjun Chen – Advanced Semiconductor Engineering, Inc.
Harrison Chang – Advanced Semiconductor Engineering, Inc.

7. Evaluation of Screen Printing Process in Fabrication of Small Profile Conductive Ink-Based Contact Force Sensor
Maria Ramona Ninfa Bautista Damalerio – Institute of Microelectronics A*STAR
Ruiqi Lim – Institute of Microelectronics A*STAR
Ven Wee James Yap – Institute of Microelectronics A*STAR
Ran Young Lim – Kalos Medical, Inc.
Ming-Yuan Cheng – Institute of Microelectronics A*STAR