Technical Program
Wednesday, June 01, 2022
Session 10: Novel Photonics Packaging Technology
1:30 PM - 5:10 PM
Committee: Photonics
Room: Coral 1&2
Session Co-Chairs:
|
Ajey Jacob University of Southern California (USC) [email protected] |
Vivek Raghuraman Broadcom Corporation [email protected] |
Papers:
1. Demonstration of Fan-Out Silicon Photonics Module for Next Generation Co-Packaged Optics (CPO) Application
Bruce Chou - Rockley Photonics
Brett M. Sawyer - Rockley Photonics
Gap Lyu - Rockley Photonics
Erman Timurdugan - Rockley Photonics
Cyriel Minkenberg - Rockley Photonics
Aaron Zilkie - Rockley Photonics
David McCann - Rockley Photonics
2. Optical Performance and Reliability Assessment from Self-Aligned Single Mode Fiber Attach for O-Band Silicon Photonics Platform
Jae Kyu Cho - GlobalFoundries
Benjamin Fasano - GlobalFoundries
Vaishnavi Karra - GlobalFoundries
Alberto Cestero - GlobalFoundries
Norman Robson - GlobalFoundries
George Wu - GlobalFoundries
Thomas Houghton - GlobalFoundries
Takako Hirokawa - GlobalFoundries
Yusheng Bian - GlobalFoundries
Koushik Ramachandran - GlobalFoundries
3. Optical Fiber Pigtail Integration for Co-Package
Alexander Janta-Polczynski - IBM Corporation
Martin Robitaille - LXsim
4. A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications
Sajay Bhuvanendran Nair Gourikutty - Institute of Microelectronics (IME), A*STAR
Ming Chinq Jong - Institute of Microelectronics (IME), A*STAR
Chockanathan Vinoth Kanna - Institute of Microelectronics (IME), A*STAR
David Soon Wee Ho - Institute of Microelectronics (IME), A*STAR
Seit Wen Wei - Institute of Microelectronics (IME), A*STAR
Sharon Lim Pei Siang - Institute of Microelectronics (IME), A*STAR
Jiaqi Wu - Institute of Microelectronics (IME), A*STAR
Teck Guan Lim - Institute of Microelectronics (IME), A*STAR
Rathin Mandal - Institute of Microelectronics (IME), A*STAR
Jason Tsung-Yang Liow - Rain Tree Photonics Pte. Ltd.
Surya Bhattacharya - Institute of Microelectronics (IME), A*STAR
5. Advanced 2.5D and 3D Packaging Technologies for Next Generation Silicon Photonics in High Performance Networking Applications
Sandeep Razdan - Cisco Systems, Inc.
Jie Xue - Cisco Systems, Inc.
Peter De Dobbelaere - Cisco Systems, Inc.
Aparna Prasad - Cisco Systems, Inc.
Vipul Patel - Cisco Systems, Inc.
6. 90-Degree Bent Core Polymer Optical Waveguide Coupler for Low Loss Lens-Less Light Coupling Between Laser/Photodetector and Fiber
Daiki Suemori - Keio University
Maho Ishii - Keio University
Naohiro Kohmu - Keio University
Takaaki Ishigure - Keio University
7. Lossless High-Speed Silicon Photonic MZI Switch with a Micro-Transfer-Printed III-V Amplifier
Jing Zhang - Ghent University
Clemens J. Kruckel - Ghent University
Bahawal Haq - Ghent University
Laurens Bogaert - Ghent University
Johanna Rimböck - EV Group
Bozena Matuskova - EV Group
Stefan Ertl - EV Group
Agnieszka Gocalinska - Tyndall National Institute
Emanuele Pelucchi - Tyndall National Institute
Brian Corbett - Tyndall National Institute
