Technical Program
Program Sessions: Wednesday May 31st 2:00 PM – 5:05 PM
Session 10: Packaging Interconnects
Committee: Thermal/Mechanical Simulation & Characterization
Room: Mediterranean 1
Session Co-Chairs:
Suresh K. Sitaraman
Georgia Institute of Technology
Email: [email protected]
Jiamin Ni
IBM Corporation
Email: [email protected]
Papers:
1. Finite Element Analysis of Shock & Vibration of a Printed Circuit Board Assembly Using the Beam Elements to Model the Solder Joints
Tieyu Zheng – Microsoft Corporation
Babu Aminjikarai – ANSYS, Inc.
Ming-An Yang – Quanta Computer Co.
2. Modeling and Optimization of Mechanical Performance for Cu Wire Bonding Process
Liangbiao Chen – ON Semiconductor
Yong Liu – ON Semiconductor
3. High-Temperature Creep Properties of a Novel Solder Material and Its Thermal Fatigue Properties Under Potting Material
Leiming Du – Delft University of Technology
Xiujuan Zhao – Signify
Rene Poelma – Nexperia
Willem Van Driel – Signify
Guoqi Zhang – Delft University of Technology
4. A Novel Stacked-Via Cu/ELK Interconnection Design Configuration to Enhance Advanced Si Packages Reliability Performance
Kuo-Chin Chang – Taiwan Semiconductor Manufacturing Company, Ltd.
Mirng-Ji Lii – Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh-Hao Hsu – Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hsiang Tu – Taiwan Semiconductor Manufacturing Company, Ltd.
Tai-Shen Yang – Taiwan Semiconductor Manufacturing Company, Ltd.
5. Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment
Pradeep Lall – Auburn University
Jinesh Narangaparambil – Auburn University
Ved Soni – Auburn University
Shriram Kulkarni – Auburn University
Kartik Goyal – Auburn University
Scott Miller – NextFlex
6. New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-Level Random Vibrations for Automotive Applications
Valeriy Khaldarov – ASONIKA, LLC
Andy Zhang – Texas Instruments, Inc.
Dongji Xie – Nvidia Corporation
Jeffrey Lee – iST-Integrated Service Technology, Inc.
Xue Shi – Bosch Automotive Products Co., Ltd.
Romuald Roucou – NXP Semiconductor, Inc.
Sushil Doranga – Lamar University
Minghong Jian – Nvidia Corporation
Alexander Shalumov – ASONIKA, LLC
Brian Kelly – Advanced Micro Devices, Inc.
7. Physics-Driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages
Faxing Che – Micron Semiconductor Asia Operations Pte. Ltd
Yeow Chon Ong – Micron Semiconductor Asia Operations Pte. Ltd
Hong Wan Ng – Micron Semiconductor Asia Operations Pte. Ltd
Ling Pan – Micron Semiconductor Asia Operations Pte. Ltd
Koustav Sinha – Micron Technology, Inc.
Christopher Glancey – Micron Technology, Inc.
Gokul Kumar – Micron Technology, Inc.
