Technical Program

Program Sessions: Wednesday May 31st 2:00 PM – 5:05 PM

Session 10: Packaging Interconnects
Committee: Thermal/Mechanical Simulation & Characterization
Room: Mediterranean 1

Session Co-Chairs:

Suresh K. Sitaraman
Georgia Institute of Technology
Email: [email protected]

Jiamin Ni
IBM Corporation
Email: [email protected]

Papers:

1. Finite Element Analysis of Shock and Vibration of a Printed Circuit Board With Multiple Ball-Grid-Array Packages Using Beam Elements to Model the Solder Joints to Achieve Design-for-Reliability
Tieyu Zheng – Microsoft Corporation
Babu Aminjikarai – ANSYS, Inc.

2. Modeling and Optimization of Mechanical Performance for Cu Wire Bonding Process
Liangbiao Chen – ON Semiconductor
Yong Liu – ON Semiconductor

3. High-Temperature Creep Properties of Solder Interconnects (SnBiAgCu) and Its Thermal Fatigue Properties Under Different Potting Compounds
Leiming Du – Delft University of Technology
Xiujuan Zhao – Signify
Rene Poelma – Nexperia
Willem Van Driel – Signify
Guoqi Zhang – Delft University of Technology

4. A Novel Stacked-Via Cu/ELK Interconnection Design Configuration to Enhance Advanced Si Package Reliability Performance
Kuo-Chin Chang – Taiwan Semiconductor Manufacturing Company, Ltd.
Mirng-Ji Lii – Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh-Hao Hsu – Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hsiang Tu – Taiwan Semiconductor Manufacturing Company, Ltd.
Tai-Shen Yang – Taiwan Semiconductor Manufacturing Company, Ltd.

5. Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment
Pradeep Lall – Auburn University
Jinesh Narangaparambil – Auburn University
Ved Soni – Auburn University
Shriram Kulkarni – Auburn University
Kartik Goyal – Auburn University
Scott Miller – NextFlex

6. New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-Level Random Vibrations for Automotive Applications
Valeriy Khaldarov – ASONIKA, LLC
Andy Zhang – Texas Instruments, Inc.
Dongji Xie – Nvidia Corporation
Jeffrey Lee – iST-Integrated Service Technology, Inc.
Xue Shi – Bosch Automotive Products Co., Ltd.
Romuald Roucou – NXP Semiconductor, Inc.
Sushil Doranga – Lamar University
Minghong Jian – Nvidia Corporation
Alexander Shalumov – ASONIKA, LLC

7. Physics-Driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages
Faxing Che – Micron Semiconductor Asia Operations Pte. Ltd
Yeow Chon Ong – Micron Semiconductor Asia Operations Pte. Ltd
Hong Wan Ng – Micron Semiconductor Asia Operations Pte. Ltd
Ling Pan – Micron Semiconductor Asia Operations Pte. Ltd
Koustav Sinha – Micron Technology, Inc.
Christopher Glancey – Micron Semiconductor Asia Operations Pte. Ltd
Gokul Kumar – Micron Semiconductor Asia Operations Pte. Ltd