74th ECTC Highlights
Note: We will provide links to the presentations as they become available.
Best Papers
1) Best Session Paper
To be announced at next ECTC
2) Best Interactive Presentation Paper
To be announced at next ECTC
3) Outstanding Session Paper
To be announced at next ECTC
4) Outstanding Interactive Presentation Paper
To be announced at next ECTC
5) Intel Best Student Paper
To be announced at next ECTC
6) Intel Outstanding Student Paper Award
To be announced at next ECTC
7) TI Best IP Student Award
To be announced at next ECTC
Best Papers (73rd ECTC)
1) Best Session Paper
Fine Pitch Die-to-Wafer Hybrid Bonding
Thomas Workman, Jeremy Theil, Gill Fountain, Dominik Suwito, Cyprian Uzoh, Guilian Gao, K. M. Bang, Bongsub Lee, Laura Mirkarimi – Adeia
2) Best Interactive Presentation Paper
50 nm Overlay Accuracy for Wafer-to-Wafer Bonding by High-Precision Alignment Technologies
Hajime Mitsuishi, Hiroshi Mori, Hidehiro Maeda, Mikio Ushijima, Atsushi Kamashita, Masashi Okada, Masanori Aramata, Takashi Shiomi, Shinya Sakamoto, Kishou Takahata, Tomohiro Chiba, Minoru Fukuda, Masahiro Kanbayashi, Toshimasa Shimoda, Isao Sugaya – Nikon Corporation
3) Outstanding Session Paper
A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature Pre-Bonding
Yasuhisa Kayaba, Yuzo Nakamura, Wataru Okada, Takuo Shikama, Kahori Tamura, Satoshi Inada – Mitsui Chemicals, Inc.
4) Outstanding Interactive Presentation Paper
Optimization of the Cu Microstructure to Improve Copper-to-Copper Direct Bonding for 3D Integration
Ralf Schmidt, Christian Schwarz – Atotech (MKS Instruments)
5) Intel Best Student Paper
Thermal-Aware SoC Macro Placement and Multichip Module Design Optimization with Bayesian Optimization
Michael Molter, University of Illinois Urbana-Champaign, Rahul Kumar, Sonja Koller, Osama Waqar Bhatti, Nikita Ambasana, Elyse Rosenbaum and Madhavan Swaminathan
6) Intel Outstanding Student Paper Award
Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy
Shengtao Yu, Georgia Institute of Technology, Thomas K. Gaylord, Muhannad S. Bakir
7) TI Best IP Student Award
Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications
Xinyue Wang, Fudan University, Zhoudong Yang, Fudan University, Guoqi Zhang, TU Delft, Jing Zhang, Heraeus Materials Technology, Pan Liu, Fudan University
Special Events Presentations
1) 2024 ECTC Special Session on Industry-Government Co-Investments
Tuesday, May 28, 2024, 8:30 a.m. – 10:00 a.m. (MDT)
Topic: “Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe”
Chairs: Przemyslaw Gromala, Robert Bosch GmbH, and Erik Jung, Fraunhofer IZM
Speakers: Elisabeth Steimetz, EPoSS, Europe, Rao Tummala, Advisor to the Government of India, Eric Lin, CHIPS R&D, USA, David Lynch, CMC Microsystems, Canada, and Kwang-Seong Choi, Electronics and Telecommunications Research Institute, Korea.
2) 2024 ECTC Special Session on Metrology
Tuesday, May 28, 2024, 10:30 a.m. – 12:00 p.m. (MDT)
Topic: “Challenges and Opportunities in Advancing Metrology for Next-Generation Microelectronics”
Chairs: Ran Tao (NIST) and Benson Chan (Binghamton University); Moderator: Jan Vardaman (TechSearch International)
Speakers: Paul Hale, NIST, Gaurang Choksi, Intel Corporation, Zhihua Zou, TSMC, CP Hung, ASE, and Chet Lenox, KLA Corporation
3) 2024 ECTC Special Session on Thermal Management for AI
Tuesday, May 28, 2024, 1:30 p.m. – 3:00 p.m. (MDT)
Topic: “Efficient and Innovative Thermal Management for Power Hungry AI/ML Applications: Challenges and Opportunities”
Chairs: Zhi Yang, Groq, and Sevket Yuruker, Tesla
Speakers: Ki Wook Jung, Samsung, Igor Arsovski, Groq, Mudasir Ahmad, Google, Tiwei Wei, Purdue University, and Christopher Ortiz, Ansys
4) 2024 ECTC Special Session on RF Packaging for above 100 GHz
Tuesday, May 28, 2024, 3:30 p.m. – 5:00 p.m. (MDT)
Topic: “RF Packaging for Communication and Sensing Applications above 100 GHz – Technologies, Design Challenges and Emerging Solutions”
Chairs: Maciej Wojnowski, Infineon Technologies AG, and Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology
Speakers: Swaminathan Sankaran, Texas Instruments, Martin Letz, Schott AG, Madhavan Swaminathan, Penn State University, and Uwe Maass, Fraunhofer IZM
5) 2024 ECTC Young Professionals Networking Event
Tuesday, May 28, 2024, 7:00 p.m. – 7:45 p.m. (MDT)
Chairs: Aakrati Jain, IBM, Rui Chen Eastern Michigan University, and Zhangming Zhou, Auburn University
6) 2024 IEEE EPS Seminar on Substrates for Chiplets
Tuesday, May 28, 2024, 7:45 p.m. – 9:15 p.m. (MDT)
Topic: “Substrate-Scaling Challenges in Chiplet Integration”
Chairs: Takashi Hisada, Rapidus Corporation, Yasumitsu Orii, Rapidus Corporation, and co-moderated by Rich Graff, Marvell Inc.
Speakers: Gang Duan, Intel, Kinya Ichikawa, TSMC, Kenneth Larsen, Synopsys, Masahisa Ose, Resonac, Harish Penmenthsa, AMAT, Yu-Po Wang, SPIL, and Rozalia Beica, LQDX
7) ECTC Keynote: Petascale Photonic Chip Connectivity for Energy Efficient AI Computing
Wednesday, May 29, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Chairs: Karlheinz Bock, TU Dresden
Speakers: Prof. Keren Bergman, the Charles Batchelor Professor of Electrical Engineering at Columbia University in the City of New York
8) ECTC/iTherm Diversity and Career Growth Panel and Reception
Wednesday, May 29, 2024, 6:30 p.m. – 7:30 p.m. (MDT)
Topic: “Effective Practices to Attract, Promote and Retain a Diverse Workforce”
Chairs: Cristina Amon, University of Toronto, for iTherm, and Vidya Jarayam, Intel, for ECTC
Speakers: Ramona Prioleau, CHIPS, Allyson Stewart, Marvell Inc., Al Ortega, Villanova University, Tina Herrera, NREL, and Ravi Mahajan, Intel
9) 2024 ECTC Plenary Session on Future of Semiconductor Industry
Thursday, May 30, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Topic: “Emerging Start-ups and Material Innovations in Advanced Packaging”
Chairs: Rozalia Beica, LQDX, and Farhang Yazdani, BroadPak, and the Chair of Jury Panel, Jeffrey Perkins, Yole Group
Speakers: Victor Chiriac, Global Cooling Technology Group, Wayne Rickard, Terecircuits, and Luc Beauvillier, Thintronics
10) 2024 IEEE EPS President’s Panel Session on Workforce
Friday, May 31, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Topic: “Challenges in Education and Workforce Development in the New Chips Economy”
Chairs: Patrick Thompson, Texas Instruments, Mark Poliks, Binghamton University, Jeff Suhling, Auburn University, and Kitty Pearsall, Boss Precision Inc.
Speakers: John Oakley, Semiconductor Research Corporation, Toni Mattila, Business Finland, Robert Geer, SUNY Polytechnic University, Wenhui Zhu, Central South University (pre-recorded), and Jim Wieser, Texas Instruments
HIR Presentations
1) HIR Session 1: Challenges and Innovations in Thermal Engineering from Fan-out to 2.5D and 3D Stacking
Moderators: Weihua Tang, Yin Hang
Speakers:
“Thermal Management of HI Micro-Systems”: Ravi Mahajan
“Thermal challenges for stacked die systems: Need for multi-scale thermal analysis”: Herman Oprins
“Thermal modelling and simulation for heterogeneous integration”: Chris Bailey
“Realtime Thermal Predictions through Image-to-Image Translation for Electrical-Thermal Design Exploration”: Ganesh Subbarayan
2) HIR Session 2: Engineering Chiplets for the AI Era
Moderator: John Shalf
Speakers:
“Chiplet Trends, Choices, and Directions for the AI Data Center”: Eric Fetzer
“Future of AI Hardware Enabled by Advanced Packaging”: Sam Naffziger
“Engineering Chiplets for AI”: Jose Schutt-Aine
3) HIR Session 3: CHIPS Roundtable Chat: Pilot Line Fireside Chat
Moderators: Bill Chen, Ravi Mahajan
Speakers:
“Design, Semiconductor, Packaging and Systems R&D in India”: Rao Tummala
“European Chips Act and the AHSI – FMD Pilot Line”: Tanja Braun
“Collaboration in Advanced Packaging Pilot Line with Industries and Universities”: Wei-Chung Lo
“Rapidus Packaging Pilot Line”: Yasumitsu Orii
“ECTC Roundtable Pilot Line Discussion AIM Photonics”: David Harame
“Advanced Packaging Prototype Line at Arizona State University”: Chris Bailey
4) HIR Session 4: Packaging Challenges and Innovation for Future Communication Systems
Moderator: Tim Lee
Speakers:
“Packaging Technology for Next Generation mmWave Communications: Scalable Heterogeneous AiP Modules and the Future Role of Chiplets”: Atom Watanabe
“Design and Analysis Challenges in Chiplet-Based Systems”: Jaemin Shin
“Packaging Challenges and Innovation for Future Communication Systems”: Harrison Chang
“Frontend Packaging and Integration Trends for mmWave and Sub-THz Phased Array”: Kevin Gu
Media Coverage
Electronics Weekly: Semiconductor skills shortages highlighted at ECTC
Coverage of the panel session on workforce challenges.
EE Times: Rapid AI and HPC Requires Collaboration and Co-optimization
Post-conference article that gives a comprehensive overview of the conference, focusing on the keynote talk, papers on hybrid bonding and high-density substrates, and the startup competition in the Plenary session.
PC Watch: AMD and Intel's cutting-edge "3.5D" packaging technology
A detailed report on papers given by AMD and Intel on new “3.5D” packaging technology.
IEEE Spectrum: Hybrid Bonding Plays Starring Role in 3D Chips
Article explains the growing importance of hybrid bonding, and details papers presented by various organizations at ECTC on the topic.
Circuits Assembly: Panel at 2024 IEEE Electronic Components and Technology Conference
A news story on the panel session on government/industry co-investment programs.
3D InCites: ECTC 2024: Advanced Packaging Engineers to the Rescue!
Post-conference article with detailed descriptions of many of the events and panels that occurred at ECTC ‘24.
Laser Focus World: Co-packaging photonics and electronics poses challenges
Interview with ECTC 2024 keynote speaker Dr. Keren Bergman of Columbia University.
Photonics Spectra: Photonic Tech Lights Up IEEE Electronic Components and Technology Conference
News article previewing the conference, with emphasis on photonics content.
SemiWiki: Podcast EP224: An Overview of the Upcoming 2024 Electronic Components and Technology Conference with Dr. Michael Mayer
Podcast in which ECTC ’24 program chair Dr. Michael Mayer previews the upcoming ECTC conference, with a focus on hybrid bonding, the professional development courses, and the networking and job-hunting activities that take place behind the scenes.
3D InCites: Member Preview – ECTC 2024
Pre-conference article that details all major elements of the ECTC ‘24 program.
Semiconductor Digest: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies
News article previewing the conference program.
Chip Scale Review: ECTC 2024: New, Larger Venue
Two-page preview of ECTC 2024 by Dr. Michael Mayer, ECTC ’24 program chair (p. 50).
