72nd ECTC Highlights
Note: We will provide links to the presentations as they become available.
Best Papers (will be announced later)
1) Best Session Paper
Advanced Fan-Out Packaging Technology for Hybrid Substrate Integration
Lihong Cao, Teck Chong Lee; Rick Chen; Yung-Shun Chang; Hsingfu Lu; Nicholas Chao; Yen-Liang Huang; Chen-Chao Wang; Chih-Yi Huang — ASE Group
2) Best Interactive Presentation Paper
Novel Zero Side-Etch Process for <1μm Package Redistribution Layers
Pratik Nimbalkar, Pragna Bhaskar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, and Rao Tummala — Georgia Institute of Technology
3) Outstanding Session Paper
Organic Interposer CoWoS-R+ (plus) Technology
M. L. Lin, M. S. Liu, H. W. Chen, S. M. Chen, M. C. Yew, C. S. Chen, and Shin-Puu Jeng — Taiwan Semiconductor Manufacturing Company
4) Outstanding Interactive Presentation Paper
Scalable through Mold Interconnection Realization for Advanced Fan Out Wafer Level Packaging Applications
Aurélia Plihon, Edouard Déschaseaux, Rémi Franiatte, Jérome Dechamp, Simon Vaudaine, Jennifer Guillaume, Catherine Brunet-Manquat, Stéphane Moreau, and Perceval Coudrain — CEA-LETI
5) Intel Best Student Session Paper
Co-Design of Thermal Management with System Architecture and Power Management for 3D Ics.
Rishav Roy, Purdue University — School of Mechanical Engineering (G077); co-authors: Shidhartha Das, Benoit Labbe, Rahul Mathur, Supreet Jeloka — ARM,Inc.
Event Presentations
1) ECTC Luncheon Keynote: Accelerating the Power of Data Infrastructure with Cloud-Optimized Silicon
Chris Koopmans - Chief Operations Officer, Marvell
2) 2022 ECTC Heterogenous Integration Roadmap (HIR) Workshop
Chairs: William Chen – ASE, Bill Bottoms – 3MTS, and Ravi Mahajan – Intel
Heterogeneous Integration Workshop • HIR Shared Vision
Future Networks & Beyond, Tim Lee
HIR Selected Topics, Amr Helmy
Packaging for HPC & Data Center, Kanad Ghose
Medical Health & Wearables, Mark Poliks
3) 2022 ECTC Special Session: MicroLED Display Technology: High Volume Manufacturing (HVM) Progress and Challenges
Chairs: Chukwudi Okoro – Corning Inc, USA and Benson Chan – Binghamton University, USA
John Kymissis - Principal Engineer - Lumiode
Eugene Chow - Principal Scientist - Palo Alto Research Center (PARC)
Falcon Liu - Marketing Director - Playnitride
Chris Bower – CTO - XDisplay
Sean Garner - Principal Scientist - Corning Inc
Eric Virey - Senior Market and Technology Analyst - Yole Developpement
4) 2022 ECTC Special Session: How Will IC Substrate Technology Evolve to Enable Next Generation Heterogeneous Integration Schemes for High Performance Applications
Chairs: Kuldip Johal – Atotech Group and Bora Baloglu – Amkor Technology
Rahul Manepalli - Intel Fellow & Director of Substrate TD Module Engineering – Intel Corporation
Jin Young Khim - (Sr VP R&D) – Amkor Technology
Markus Leitgeb - R&D Manager - AT&S
Habib Hichri - Senior Fellow, Global Applications and Business Development - Ajinomoto Fine-Techno Corporation
Frank Bruening - Global Product Director Mentalizations
5) 2022 ECTC IEEE EPS HIR Session: Selected Topics of IEEE EPS Heterointegration Roadmap
Chair: Amr Helmy - University of Toronto
Seoung Wook Yoon - VP Corporate R&D - Samsung
6) 2022 Young Professionals Networking Panel & Reception
Chair: Yan Liu - Medtronic and Adeel Bajwa - Kulicke and Soffa
7) 2022 ECTC Special Session: Meeting Next Generation Packaging Challenges: Chiplets to Co-Packaged Optics
Chair: E. Jan Vardaman, TechSearch International, Inc.
Presentation
Ravi Mahajan – Intel Corporation, Meeting Next Generation Packaging Challenges: Chiplets to Co-Packaged Optics
Sandeep Razdan – Cisco
Kevin O’Buckley – Marvell Technology
Raja Swaminathan – AMD, Enabling Moor’s Law’s Next Frontier Through Heterogenous Integration
Ming Zhang – Synopsys, Electronic-Photonic System Co-Design
8) 2022 EPS President’s Panel Session: State-of-the-Art Heterogeneous Integrated Packaging Program
Chairs: Kitty Pearsall, EPS President –Boss Precision, Inc. and Christopher Riso, Booz Allen Hamilton
Darren Crum -Technical Lead of the SOTA Heterogeneous Integrated Packaging (SHIP) program for OUSD(R&E) - Modernization Microelectronics
John Sotir - SHIP Program Director - Intel Corporation
Ted Jones - Sr. Product Line Director High Performance Solutions Services - Qorvo Inc.
9) 2022 ECTC/ITherm Diversity & Career Growth Panel & Reception: Solving Diversification Challenges and Workforce Retention Issues
Chairs: Kim Yess - Brewer Science/ECTC) and Christina Amon - Univ. of Toronto/ITherm
Bina Hallman - VP System Client Advocacy and Head of D&I System business -IBM
Antoinette Hamilton - Head of DEI - Lam Research
Najwa Khazal - General Manager, Service Technology Centres Americas - Edwards
KT Moore - VP Corporate Marketing - Cadence
10) 2022 IEEE EPS Seminar: Interconnect Technologies for Chiplets
Chairs: Yasumitsu Orii - Nagase and Shigenori Aoki – Lintec
Ravi Mahajan – Intel
Akihiro Horibe - IBM Research Tokyo
Yu-Hua Chen – Unimicron
Shin-Puu Jeng – TSMC
Yu-Po Wang – SPIL
Hideyuki Nasu - Furukawa Electric
11) 2022 Plenary Session: Digital Transformation – The Cornerstone of Future Semiconductor and Advanced Packaging Growth
Chair: Rozalia Beica - AT&S
Carolyn Evans - Chief Economist - Intel
Doug Yu - VP Pathfinding and System Integration - TSMC
Jean Christophe Eloy - Yole Developpement
Mike Rosa – CMO, SVP Strategy - Onto Innovation
Seoung Wook Yoon - VP Corporate R&D - Samsung
Media Coverage
EEE/EPS:
State of the Art (SOTA) Heterogenous Integrated Packaging (SHIP) Program
Semianalysis:
3D InCites:
