Technical Program

Wednesday, May 30, 2018

Session 8: Material and Process Trends in FOWLP
1:30 PM - 5:10 PM
Committee: Materials & Processing

Session Co-Chairs:

Tanja Braun
Fraunhofer IZM
T +46 30 46403244
tanja.braun@izm.fraunhofer.de
Yi (Grace) Li
Intel Corporation
T +1-480-554-1657
yi.li@intel.com

Papers:

1. 1:30 PM - Fan Out Panel Level Packaging Manufacturing Process - Challenge and Solution
Nan-Chun Lin - Powertech Technology Inc. (PTI)
Shang-Yu Chang Chien - Powertech Technology Inc. (PTI)
Chun-Te Lin - Powertech Technology Inc. (PTI)
Tsung-Lin Chou - Powertech Technology Inc. (PTI)
Ji-Cheng Lin - Powertech Technology Inc. (PTI)
Li-Chih Fang - Powertech Technology Inc. (PTI)

2. 1:55 PM - Design and Demonstration of 1┬Ám Low Resistance RDL Using Panel Scale Processes for High Performance Computing Applications
Bartlet DeProspo - Packaging Research Center at Georgia Institute of Technology
Chandra Nair - Packaging Research Center at Georgia Institute of Technology
Emanuel Torres - Packaging Research Center at Georgia Institute of Technology
Fuhan Liu - Packaging Research Center at Georgia Institute of Technology
Mohan Kathaperumal - Packaging Research Center at Georgia Institute of Technology
Rao Tummala - Packaging Research Center at Georgia Institute of Technology
Frank Wei - DISCO Corporation
Ye Chen - DISCO Corporation
Aya Momozawa - Tokyo Ohka Kogyo Co., LTD
Atsushi Kubo - Tokyo Ohka Kogyo Co., LTD

3. 2:20 PM - Advances in Temporary Carrier Technology for High Density Fan-Out Device Build-up
Arnita Podpod - IMEC
Alain Phommahaxay - IMEC
Alice Guerrero - Brewer Science
Pieter Bex - IMEC
John Slabbekoorn - IMEC
Julien Bertheau - IMEC
Adbellah Salahouelhadj - IMEC
Kim Yess - Brewer Science
Kim Arnold - Brewer Science
Gerald Beyer - IMEC
Eric Beyne - IMEC

4. 3:30 PM - Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Reliability
Yutaro Koyama - Toray Industries, Inc.
Yuki Masuda - Toray Industries, Inc.
Yu Shoji - Toray Industries, Inc.
Keika Hashimoto - Toray Industries, Inc.
Masao Tomikawa - Toray Industries, Inc.

5. 3:55 PM - Highly Reliable Photosensitive Negative-tone Polyimide with Low Cure Shrinkage
Daisaku Matsukawa - Hitachi Chemical DuPont MicroSystems,Ltd.
Hiroko Yotsuyanagi Shiori Sakakibara Noriyuki Yamazaki Tetsuya Enomoto Takeharu Motobe

6. 4:20 PM - Advanced pre cleaning method of seed layer sputtering for fan out panel level packaging
Tetsushi Fujinaga - ULVAC, Inc.

7. 4:45 PM - Investigation and Methods using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB chip-First Processes
Michelle Fowler - Brewer Science, Inc.
John P. Massey - Brewer Science, Inc.
Tanja Braun - Fraunhofer IZM
Steve Voges - Fraunhofer IZM
Robert Gernhardt - Fraunhofer IZM
Markus Wohrmann - Fraunhofer IZM