Technical Program

Wednesday, May 31, 2017

Session 6: 5G, mmWave and Beyond
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components
Room: Americas Seminar

Session Co-Chairs:

Kemal Aygun
Intel Corporation
T +1-480-552-1740
Lih-Tyng Hwang
National Sun Yat-Sen University
T +886-7-5252000 ext. 4485


1. 8:00 AM - First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules
Atom O. Watanabe - Georgia Institute of Technology
Muhammad Ali - Georgia Institute of Technology
Bijan Tehrani - Georgia Institute of Technology
Jimmy Hester - Georgia Institute of Technology
Hiroyuki Matsuura - NGK Spark Plug
Tomonori Ogawa - Asahi Glass Co., Ltd.
P. Markondeya Raj - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Manos M. Tentzeris - Georgia Institute of Technology
Rao R. Tummala - Georgia Institute of Technology

2. 8:25 AM - Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications
Cheng-Yu Ho - Advanced Semiconductor Engineering, Inc.
Ming-Fong Jhong - Advanced Semiconductor Engineering, Inc.
Po-Chih Pan - Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang - Advanced Semiconductor Engineering, Inc.
Chun-Yen Ting - Advanced Semiconductor Engineering, Inc.
Chih-Yi Huang - Advanced Semiconductor Engineering, Inc.

3. 8:50 AM - Aerosol-Jet Printed Quasi-Optical Terahertz Filters
Christopher Oakley - Michigan State University
Amanpreet Kaur - Michigan State University
Jennifer A. Byford - Michigan State University
Premjeet Chahal - Michigan State University

4. 10:00 AM - High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL
Che-Wei Hsu - Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Hao Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shien Hsieh - Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Chung Yee - Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

5. 10:25 AM - Directional Through Glass Via (TGV) Antennas for Wireless Point-to-Point Interconnects in 3D Integration and Packaging
Seahee Hwangbo - University of Florida
Hyowon An - University of Florida
Sheng-Po Fang - University of Florida
Aric B. Shorey - Corning, Inc.
Abbas M. Kazmi - Corning, Inc.
Yong-Kyu Yoon - University of Florida

6. 10:50 AM - RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer
Hélène Jacquinot - CEA-Leti
L. Arnaud - CEA-Leti
A. Garnier - CEA-Leti
F. Bana - CEA-Leti
J.C. Barbe - CEA-Leti
S. Cheramy - CEA-Leti

7. 11:15 AM - Miniature 2.4-GHz Switched Beamformer Module in IPD and its Application to Very-Low-Profile 1D and 2D Scanning Antenna Arrays
Chia-Hao Chen - National Central University
Wei-Ting Fang - National Central University
Yo-Shen Lin - National Central University