Technical Program

Wednesday, May 30, 2018

Session 6: Emerging Flexible Hybrid Electronics
8:00 AM - 11:40 AM
Committee: Emerging Technologies

Session Co-Chairs:

Jong-Hoon Kim
Washington State University Vancouver
T +1-360 546-9250
jh.kim@wsu.edu
Hongqing Zhang
IBM Corporation
T 484-896-8709
zhangh@us.ibm.com

Papers:

1. 8:00 AM - Stretchable and Printable Medical Dry Electrode Arrays on Textile for Electrophysiological Monitoring
Yougen Hu - Shenzhen Institutes of Advanced Technology, Chinese Academy
Hui Wang - Shenzhen Institutes of Advanced Technology, CAS
Yaoxu Xiong - Shenzhen Institutes of Advanced Technology, CAS
Han Gu - Shenzhen Institutes of Advanced Technology, CAS
Pengli Zhu - Shenzhen Institutes of Advanced Technology, CAS
Guanglin Li - Shenzhen Institutes of Advanced Technology, CAS
Rong Sun - Shenzhen Institutes of Advanced Technology, CAS
Ching-Ping Wong - Georgia Institute of Technology

2. 8:25 AM - Screen-Printed Flexible Coplanar Waveguide Transmission Lines: Multi-Physics Modeling and Measurement
Nahid Aslani Amoli - Georgia Institute of Technology
Sridhar Sivapurapu - Georgia Institute of Technology
Rui Chen - Georgia Institute of Technology
Yi Zhou - Georgia Institute of Technology
Mohamed L. F. Bellaredj - Georgia Institute of Technology
Paul A. Kohl - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology

3. 8:50 AM - Inkjet-Printed Filtering Antenna on a Textile for Wearable Applications
Hsuan-Ling Kao - Chang Gung University
Chun-Hsiang Chuang - Chang Gung University
Cheng-Lin Cho - National Tsing Hua University

4. 10:00 AM - Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
Yuki Susumago - Tohoku University
Hisashi Kino - Tohoku University
Tetsu Tanaka - Tohoku University
Takafumi (Tak) Fukushima - Tohoku University

5. 10:25 AM - A wearable Fingernail Deformation Sensor and Three-Dimensional Finite Element Model of Fingertip
Katsuyuki Sakuma - IBM T.J. Watson Research Center
Bucknell Webb - IBM T.J. Watson Research Center
Jeff Rogers - IBM T.J. Watson Research Center

6. 10:50 AM - Heterogeneous Integration of a Fan-Out Wafer-Level Packaging Based Foldable Display on Elastomeric Substrate
Arsalan Alam - University of California, Los Angeles
Amir Hanna - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Goutham Ezhilarasu - University of California, Los Angeles
Hyunpil Boo - University of California, Los Angeles
Yuan Hu - University of California, Los Angeles
Chee Wei Wong - University of California, Los Angeles
Timothy Fisher - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

7. 11:15 AM - A Study on the Flexible Chip-on-Fabric (COF) Assembly using Anisotropic Conductive Films (ACFs) Materials
Seung-Yoon Jung - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology