Technical Program

Wednesday, May 29, 2019

Session 5: Bonding Manufacturing Technologies
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Paul Houston
Engent
T +1-770-280-4238
paul.houston@engentaat.com

Papers:

1. 8:00 AM - Comprehensive Study of Copper Nano-Paste for Cu-Cu Bonding
Ser Choong Chong - Institute of Microelectronics A*STAR
Pei Siang Lim - Institute of Microelectronics A*STAR

2. 8:25 AM - Enhanced Performance of Laser-Assisted Compression Bonding (LACB) Compared With Thermal Compression Bonding (TCB) Technology
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Seok Hwan Moon - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
leeseul Jeong - Electronics and Telecommunications Research Institute
Kwangjoo Lee - LG Chem
Jung Hak Kim - LG Chem
Ju hyeon Kim - LG Chem
Gil-Sang Yoon - KITECH
Kwang-Hee Lee - Inha University
Chul-Hee Lee - Inha University

3. 8:50 AM - A Study of 3D Packaging Interconnection Performance Affected by Thermal Diffusivity and Pressure Transmission
Jinsan Jung - Samsung Electronics Company, Ltd.
Hyeong Gi Lee - Samsung Electronics Company, Ltd.
Ji-Min Kim - Samsung Electronics Company, Ltd.
Yongjin Park - Samsung Electronics Company, Ltd.
Jiin Yu - Samsung Electronics Company, Ltd.
Yong Sung Park - Samsung Electronics Company, Ltd.
Junsu Lim - Samsung Electronics Company, Ltd.
Hyun-Seok Choi - Samsung Electronics Company, Ltd.
Sungill Cho - Samsung Electronics Company, Ltd.
Dong wook Kim - Samsung Electronics Company, Ltd.
SangHo An - Samsung Electronics Company, Ltd.

4. 10:00 AM - Vertical Laser Assisted Bonding for Advanced “3.5D” Chip-Packaging
Andrej Kolbasow - Pac Tech – Packaging Technologies GmbH
Timo Kubsch - Pac Tech – Packaging Technologies GmbH
Matthias Fettke - Pac Tech – Packaging Technologies USA
Georg Friedrich - Pac Tech – Packaging Technologies USA
Thorsten Teutsch - Pac Tech – Packaging Technologies USA

5. 10:25 AM - Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
Matthias Wietstruck - Innovations for High Performance Microelectronics
Sebastian Schulze - Innovations for High Performance Microelectronics
Mirko Fraschke - Innovations for High Performance Microelectronics
Peter Kerepesi - EV Group, Inc.
Helmut Kurz - EV Group, Inc.
Bernhard Rebhan - EV Group, Inc.
Mehmet Kaynak - Innovations for High Performance Microelectronics

6. 10:50 AM - Self-Assembly Process for 3D Die-to-Wafer Using Direct Bonding: A Step Forward Toward Process Automatisation
Amandine Jouve - CEA-LETI
Loïc Sanchez - CEA-LETI
Clement Castan - CEA-LETI
Maxence Laugier - CEA-LETI
Emmanuel Rolland - CEA-LETI
Brigitte Montmayeul - CEA-LETI
Rémi Franiatte - CEA-LETI
Frank Fournel - CEA-LETI
Severine Cheramy - CEA-LETI

7. 11:15 AM - A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices
Tilo Hongwei Yang - National Taiwan University
Yu-Shan Chiu - National Taiwan University
Hai-Yang Yu - National Taiwan University
Akitsu Shigetou - National Institute for Materials Science
C. Robert Kao - National Taiwan University