Technical Program

Wednesday, May 30, 2018

Session 5: Bonding Manufacturing Technologies
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Paul Houston
Engent
T +1-770-280-4238
paul.houston@engentaat.com

Papers:

1. 8:00 AM - Comprehensive Study of Copper Nano-paste for Cu-Cu Bonding
Ser Choong Chong - Institute of Microelectronics
Pei Siang Lim - Institute of Microelectronics

2. 8:25 AM - Enhanced Performance of Laser-Assisted Compression Bonding (LACB) Compared with Thermal Compression Bonding (TCB) Technology
Kwang-Seong Choi - ETRI
Yong-Sung Eom - ETRI
Seok Hwan Moon - ETRI
Kwangjoo Lee - LG Chem
Jung Hak Kim - LG Chem
Ju hyeon Kim - LG Chem
Gil-Sang Yoon - KITECH
Kwang-Hee Lee - Inha University
Chul-Hee Lee - Inha University
Geun-Sik Ahn - Protec

3. 8:50 AM - A study of 3D packaging interconnection performance affected by thermal diffusivity and pressure transmission
Jinsan Jung - Samsung Electronics Company, Ltd.
Junsu Lim - Samsung Electronics Company, Ltd.
Yongjin Park - Samsung Electronics Company, Ltd.
Jiin Yu - Samsung Electronics Company, Ltd.
Sungill Cho - Samsung Electronics Company, Ltd.
Dong W Kim - Samsung Electronics Company, Ltd.
SangHo An - Samsung Electronics Company, Ltd.

4. 10:00 AM - Vertical laser assisted bonding for advanced “3.5D” chip packaging
Andrej Kolbasow - Pac Tech GmbH
Matthias Fettke - PacTech GmbH
Thorsten Teutsch - Pac Tech USA

5. 10:25 AM - Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
Sebastian Schulze - IHP
Matthias Wietstruck - IHP
Mirko Fraschke - IHP
Peter Kerepesi - EVGroup
Helmut Kurz - EVGroup
Bernhard Rebhan - EVGroup
Mehmet Kaynak - IHP

6. 10:50 AM - Self-Assembly process for 3D Die-to-Wafer using direct bonding: A step forward toward process automation
Amandine Jouve - CEA, LETI
Loïc Sanchez - CEA, LETI
Clement Castan - CEA, LETI
Emmanuel Rolland - CEA, LETI
Frank Fournel - CEA, LETI
Rémi Franiatte - CEA, LETI
Brigitte Montmayeul - CEA, LETI
Severine Cheramy - CEA, LETI

7. 11:15 AM - Sandwich Package for Advanced HV-MCM
Jason Chien - Texas Instruments, Inc.