Technical Program

Wednesday, May 29, 2019

Session 5: Bonding Manufacturing Technologies
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Paul Houston
Engent
T +1-770-280-4238
paul.houston@engentaat.com

Papers: