Technical Program

Session 45: Student Session
Committee: Interactive Presentations

Session Co-Chairs:

Alan Huffman
Micross Advanced Interconnect Technology
T +1-919-248-9216
ectc.exhibits@gmail.com
Ibrahim Guven
Virginia Commonwealth University
T +1-804-827-3652
iguven@vcu.edu

Papers:

1. A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Ming-Yu Huang - National Chiao Tung University
Hung-Ming Chen - National Chiao Tung University
Kuan-Neng Chen - National Chiao Tung University
Shih-Hsien Wu - Industrial Technology Research Institute
Yu-Min Lee - National Chiao Tung University
An-Yu Su - National Chiao Tung University

2. Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics
Cheol Kim - Seoul National University
Hai-shan Shen - Sungkyunkwan University
Jeonglim Yoon - Soonchunhyang University
Min-Woo Jeong - Seoul National University
Sungtae Kim - Seoul National University
Seung-Hyun Oh - Seoul National University
So-Yeon Lee - Seoul National University
Hoojeong Lee - Sungkyunkwan University
Youngcheol Joo - Soonchunhyang University
Young-Chang Joo - Seoul National University

3. Preparation of Autonomously Self-Healing Electrode Based on Double Network Supramolecular Elastomer
Miao Tang - Fudan University
Jianing Wu - Fudan University
Mingliang Ying - State Grid Zhejiang Electric Power Research Institute
Kaiqing Wang - Fudan University
Hongkun Lv - State Grid Zhejiang Electric Power Research Institute
Zhuo Li - Fudan University

4. Investigation of Underfilling BGAs Packages-Thermal Fatigue
Vanlai Pham - Binghamton University
Jiefeng Xu - Binghamton University
Huayan Wang - Xilix Inc.
Ke Pan - Binghamton University
Charandeep Singh - Corning Inc.
Seungbae Park - Binghamton University

5. Design and Fabrication of an Ultra-Thin Silicon Vapor Chamber for Compact Electronic Cooling
Quentin Struss - STMicroelectronics
Perceval Coudrain - CEA
Jean-Philippe Colonna - CEA
Abdelkader Souifi - INSA - Lyon
Christian Gontrand - INSA - Lyon
Édouard , Deschaseaux - Université de Sherbrooke
Gaëlle Mauguen - CEA
Vincent Mathieu - CEA
Thomas Magis - CEA
Gilles Simon - CEA
Luc G. Fréchette - Université de Sherbrooke

6. Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages under Drop Test
Akshay Boovanahally Lakshminarayana - University of Texas at Arlington
Abel Misrak - University of Texas at Arlington
Rabin Bhandari - University of Texas at Arlington
ASM Raufur R Chowdhury - University of Texas at Arlington
Tushar Jashvanthbhai Chauhan - University of Texas at Arlington
Dereje Agonafer - University of Texas at Arlington

7. Design of 4-Channel 25 Gbaud/s PAM-4 Optical Transmitter Module for Short Reach Applications
I-Cheng Hou - National Kaohsiung University of Science and Technology
Chung-Han Chang - National Kaohsiung University of Science and Technology
Jau-Ji Jou - National Kaohsiung University of Science and Technology
Pei-Hao Tseng - Teratech Optical Communication Inc.
Tien-Tsorng Shih - National Kaohsiung University of Science and Technology
Ting-Jen Hsueh - National Kaohsiung University of Science and Technology
Po-Jui Chiang - National Kaohsiung University of Science and Technology
Yaw-Dung Wu - National Kaohsiung University of Science and Technology

8. First Principle Analysis of Li-Doped Armchair Graphene Nanoribbons for Nanoscale Metal Interconnect Applications
Vipul Nishad - IIT Ropar
Atul Nishad Rohit Sharma

9. A Semi-Hemispherical High Q-Factor Resonators Fabricated using a Hybrid Rigid-Flex Process
Vincens Gjokaj - Michigan State University
Premjeet Chahal - Michigan State University

10. A Wireless Battery-Less Seat Sensor for Autonomous Vehicles
Saikat Mondal - Michigan State University
Saranraj Karuppuswami - Michigan State University
Kanishka Wajiwardena - Michigan State University
Deepak Kumar - Michigan State University
Mahmoud Ghannam - Ford Motor Company
Mark Cuddihy - Ford Motor Company
Premjeet Chahal - Michigan State University

11. Deep Trench Capacitors in Silicon Interconnect Fabric
Kannan Kalappurakal Thankappan - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

12. Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction
Todd Houghton - Arizona State University
Hongbin Yu - Arizona State University

13. Inverse Design of Substrate from Warpage Surrogate Model Using Global Optimisation Algorithms in Ultra-Thin Packages
Cheryl Selvanayagam - Singapore University of Technology and Design
Pham Luu Trung Duong - Singapore University of Technology and Design
Nagarajan Raghavan - Singapore University of Technology and Design

14. Identification of Polymer Materials in Electronic Packages Including Counterfeit Prevention
Junbo Yang - Binghamton University
Jiefeng Xu - Binghamton University
Seungbae Park - Binghamton University

15. Screen-Printed Inductive Silver Ink Strain Sensor on Stretchable TPU Substrate
Connor Smith - University of Florida
Kartik Sondhi - University of Florida
Beatriz Jimenez - University of Florida
Z. Hugh Fan - University of Florida
Toshikazu Nishida - University of Florida
David Arnold - University of Florida