Technical Program

Session 43: Reliability and Failure Analyses of Emerging Materials
Committee: Interactive Presentations

Session Co-Chairs:

Jeffrey Lee
iST-Integrated Service Technology Inc.
T +886-3-5799909 ext 3000
jeffrey_lee@istgroup.com
Mark Eblen
Kyocera International SC
T +1-858-614-2537
mark.eblen@kyocera.com

Papers:

1. The Board Level Reliability Performance and Process Challenges of Ultra-Thin WLP (Package Height < 250 µm)
Kuei Hsiao Kuo - Siliconware Precision Industries Co., Ltd.
Chun Yi Chiang - Siliconware Precision Industries Co., Ltd.
Kuang Hsin Chen - Siliconware Precision Industries Co., Ltd.
Stan Chen - Siliconware Precision Industries Co., Ltd.
Feng Lung Chien - Siliconware Precision Industries Co., Ltd.

2. Moisture Effect on Physical Failure of Plastic Molded SiP Module
Jeffrey Lee - iST-Integrated Service Technology Inc
Cheng Chih Chen - iST-Integrated Service Technology Inc
Dem Lee - iST-Integrated Service Technology Inc
Jess Chen - iST-Integrated Service Technology Inc

4. Outstanding Reliability Performances of Silicon Capacitors for 200°C Automotive Applications
Sébastien Jacqueline - Murata Manufacturing Co., Ltd.
Laurent Lengignon - Murata Manufacturing Co., Ltd.
Catherine Bunel - Murata Manufacturing Co., Ltd.

5. Robustness of Carbon Nanofiber-Based MIM Capacitors with Ultra-High Capacitance Density to Electrical and Thermal Stress
Maria Bylund - Smoltek
Rickard Andersson - Smoltek
Sascha Krause - Smoltek
Victor Marknas - Smoltek
Mohammad Kabir - Smoltek
Amin Saleem - Smoltek
Elisa Passalacqua - Smoltek
Vincent Desmaris - Smoltek

7. Assembly Technologies for Piezoelectric Sensors up to 1000 °C
Fabian Kohler - IMTEK
Jürgen Wilde - IMTEK

8. 45RFSOI WLCSP Board Level Package Risk Assessment and Solder Joint Reliability Performance Improvement
Haojun Zhang - GLOBALFOUNDRIES
Zhuo-Jie Wu - GLOBALFOUNDRIES
John Malinowski - GLOBALFOUNDRIES
Millete Carino - GLOBALFOUNDRIES
Kristina Young-Fisher - GLOBALFOUNDRIES
Jean Trewhella - GLOBALFOUNDRIES
Patrick Justison - GLOBALFOUNDRIES

9. A Study of the Electrical Behaviors of Printed Conductive Leads on Stretchable Textiles for Smart Clothing
Kankanige Udara Somarathna - Binghamton University
Behnam Garakani - Binghamton University
Mohammed Alhendi - Binghamton University
Azar Alizadeh - GE Global Research
E. Enakerakpo - Binghamton University
Peter Borgesen - Binghamton University
Mark Poliks - Binghamton University

10. Effects of Process Parameters and Isothermal Fatigue Cycling on Electromechanical Properties of Screen-printed Interconnect on Nonwovens for Wearable Electronics
Behnam Garakani - Binghamton University
K. Udara S. Somarathna - Binghamton University
G.S. Khinda - Binghamton University
E. Enakerakpo - Binghamton University
Mohammed Alhendi - Binghamton University
Mark Poliks - Binghamton University
Peter Borgesen - Binghamton University
Azar Alizadeh - GE Global Research

11. Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation
Mohammad Alam - Auburn University
KM Rafidh Hassan - Auburn University
Abdullah Fahim - Auburn University
Jing Wu - Auburn University
Sudan Ahmed - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University