Technical Program

Session 42: Thermo-Mechanical Effects in Packaging
Committee: Interactive Presentations

Session Co-Chairs:

Mark Eblen
Kyocera International SC
T +1-858-614-2537
mark.eblen@kyocera.com
Pavel Roy Paladhi
IBM Corporation
T +1-512-286-9677
rpaladhi01@gmail.com

Papers:

1. Turbulent Flows Impingement on High Power Multi-Chip Bare Die Package
Prabhakar Subrahmanyam - Intel Corporation
Ying-Feng Pang - Intel Corporation

2. Warpage and Void Simulation of System in Packages (SiP)
Eric Ouyang - JCET
Yonghyuk Jeong - JCET
JaeMyong Kim - JCET
Susan Lin - Moldex3D
Jay Vang - Moldex3d
Anthony Yang - Moldex3D

3. Thermal and Power Delivery Aware Floorplanning for Heterogeneous Multi-Core Design
Yunhyeok Im - Samsung Electronics Company, Ltd.
Young-Sang Cho - Samsung Electronics Company, Ltd.
Jisoo Hwang - Samsung Electronics Company, Ltd.
Heeseok Lee - Samsung Electronics Company, Ltd.
Jongkyu Yoo - Samsung Electronics Company, Ltd.
James Jeong - Samsung Electronics Company, Ltd.
Heejung Choi - Samsung Electronics Company, Ltd.
Yohan Kwon - Samsung Electronics Company, Ltd.
Hoi-Jin Lee - Samsung Electronics Company, Ltd.
Youngmin Shin - Samsung Electronics Company, Ltd.

4. Thermal Analysis, Characterization and Material Selection for SiC Based Intelligent Power Modules
Gongyue Tang - Institute of Microelectronics
Leong Ching Wai - Institute of Microelectronics
Siak Boon Lim - Institute of Microelectronics
Boon Long Lau - Institute of Microelectronics
Kazunori Yamamoto - Institute of Microelectronics
Xiaowu Zhang - Institute of Microelectronics

5. Finite Element Modeling Methodology for Monotonic Bend Test of Flip-Chip BGA Package
Scott McCann - Xilinx, Inc.
Tom Lee - Xilinx, Inc.
Suresh Ramalingam - Xilinx, Inc.

6. Constant Poisson’s Ratio of Thermosetting Polymers: Is it Reasonable for Accurate Thermal Stress Analyses?
Hyun Seop Lee - University of Maryland
Sukrut Phansalkar - University of Maryland
Bongtae Han - University of Maryland

7. Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging
Faxing Che - Institute of Microelectronics A*STAR
Kazunori Yamamoto - Institute of Microelectronics A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics A*STAR

8. Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density
Ryan Wong - Georgia Institute of Technology
Siddharth Ravichandran - Georgia Institute of Technology
Haksun Lee - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

9. Electromechanical Finite Element Analysis for Designed Low-Frequency MEMS Piezoelectric Vibration Energy Harvester
Ling Xu - Fudan University
Shengrui Zhou - Fudan University
Yingfei Xiang - Fudan University
Yinglin Yang - Fudan University