1. Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective Metal Passivation (Interface Metal) Technology for 3D IC and Advanced Packaging
Mu-Ping Hsu — National Yang Ming Chiao Tung University
Wen-Tsu Tsai — National Yang Ming Chiao Tung University
Ou-Hsiang Lee — Industrial Technology Research Institute
Chi-Yu Chen — National Yang Ming Chiao Tung University
Tzu-Ying Kuo — Industrial Technology Research Institute
Hsiang-Hung Chang — Industrial Technology Research Institute
Zhong-Jie Hong — National Yang Ming Chiao Tung University
Kuan-Neng Chen — National Yang Ming Chiao Tung University
2. Distributed Vertical Power Delivery for High Performance Computing Systems With Buck-Derived Regulators
Sriharini Krishnakumar — University of Illinois
Mingeun Choi — Georgia Institute of Technology
Ramin Rahimzadeh Khorasani — Penn State University
Rohit Sharma — Indian Institute of Technology
Madhavan Swaminathan — Penn State University
Satish Kumar — Georgia Institute of Technology
Inna Partin-Vaisband — University of Illinois Chicago
3. Multi-Objective Optimization of a 1200-V Fan-Out Panel-Level SiC MOSFET Packaging with Improved Genetic and Particle Swarm Algorithms
Xuyang Yan — Fudan University
Wei Chen — Fudan University
Jing Jiang — Fudan University
Xuejun Fan — Lamar University
Guoqi Zhang — Delft University of Technology
Jiajie Fan — Fudan University
4. Packaging of Silicon Photonic Neural Network Accelerators
Russell Schwartz — University of Florida
Nicola Peserico — University of Florida
Hamed Dalir — University of Florida
Volker Sorger — University of Florida
5. Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging
Chiao-Yen Wang — National Yang Ming Chiao Tung University
Tzu-Heng Hung — National Yang Ming Chiao Tung University
Ping-Jung Liu — Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Neng Chen — National Yang Ming Chiao Tung University
7. Fabrication and Testing of In-Line Structures for Non-Destructive Study of Solder Electromigration: Applications to SnBi Low Temperature Solder
Chetan Jois — Purdue University
Pei-En Chou — Purdue University
Ganesh Subbarayan — Purdue University
9. Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration
Bo-Jheng Shih — National Yang Ming Chiao Tung University
Yu-Ming Pan — National Yang Ming Chiao Tung University
Chiao-Yen Wang — National Yang Ming Chiao Tung University
Huan-Yu Chiu — National Yang Ming Chiao Tung University
Chih-Chao Yang — Taiwan Semiconductor Research Institute
Chang-Hong Shen — Taiwan Semiconductor Research Institute
Huang-Chung Cheng — National Yang Ming Chiao Tung University
Kuan-Neng Chen — National Yang Ming Chiao Tung University
10. Manufacturing and Characterization of Planar Transformers as Molded Interconnect Device Technology Component for an Industrial Production
Tim Nils Bierwirth — Leibniz University Hannover
Sebastian Bengsch — Ensinger GmbH
Michael Werner — Ensinger GmbH
Rico Wachs — Tridelta Weichferrite GmbH
Christian Henne — Ensinger GmbH
Stefan Bur — Ensinger GmbH
Folke Dencker — Leibniz University Hannover
Marc Christopher Wurz — Leibniz University Hannover
11. Hybrid Wiring Layers for Fine Pitch Integration
Vineeth Harish — CHIPS UCLA
Krutikesh Sahoo — CHIPS UCLA
Kai Zheng — Applied Materials, Inc.
Gilbert Park — Applied Materials, Inc.
Han-Wen Chen — Applied Materials, Inc.
Steven Verhaverbeke — Applied Materials, Inc.
Subramanian Iyer — CHIPS UCLA
12. Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
Yen-Shuo Chen — National Yang Ming Chiao Tung University
Tzu-Wei Chiu — Seriphy technology corporation
Hua-Tai Fan — National Yang Ming Chiao Tung University
Yu-Chien Ko — National Yang Ming Chiao Tung University
Chu-Chi Chen — Taiwan Semiconductor Research Institute
Fu-Hsiang Ko — National Yang Ming Chiao Tung University
Ching-Chia Lin — National Yang Ming Chiao Tung University
13. New Method for Fluid Filling Through Silicon Vias With Silver Ink for Packaging Techniques
Zachary Nelson — University of California, Santa Barbara
Alice Mo — University of California, Santa Barbara
Luke Theogarajan — University of California, Santa Barbara
14. Electrospray Printed Silver Films for EMI Shielding of SiP Architectures
Emma Pawliczak — Binghamton University
Paul Chiarot — Binghamton University
16. Latency Insertion Method for Accelerated Simulation of Memristor Crossbar Array in Neuromorphic Chip
Yi Zhou — University of Illinois
Hanzhi Ma — Zhejian University
Junwei Yu — Zhejian University
Tahsin Shameem — University of Illinois
Zohreh Salehi — University of Illinois
Shaloo Rakheja — University of Illinois
Erping Li — Zhejian University
Jose Schutt-Aine — University of Illinois
17. A Novel Packaging Approach to Reduce Shading Losses in Emerging Submillimeter Concentrated Photovoltaic (CPV) Technologies
Corentin Jouanneau — University of Sherbrooke
Thomas Bidaud — University of Sherbrooke
Artur Turala — University of Sherbrooke
David Danovitch — University of Sherbrooke
Gwenaelle Hamon — University of Sherbrooke
Maxime Darnon — University of Sherbrooke
18. Fabrication and Packaging of a Heterogeneously Integrated, Flexible Quantum Dot Enabled Micro-Display
Henry Sun — University of California, Los Angeles
Harshal Sonagara — University of California, Los Angeles
Lisong Xu — Applied Materials, Inc.
Kai Ding — Applied Materials, Inc.
Mingwei Zhu — Applied Materials, Inc.
Subramanian Iyer — University of California, Los Angeles
19. Intense Pulsed Light Soldering of SAC305 for Flip-Chip Package
Seong-Ung Ryu — Hanyang University
Young-Min Ju — Hanyang University
Jong-Whi Park — Hanyang University
Seok-Hoon Jeong — Hanyang University
Hak-Sung Kim — Hanyang University
20. Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures
Madison Manley — Georgia Institute of Technology
Ankit Kaul — Georgia Institute of Technology
Muhannad Bakir — Georgia Institute of Technology
21. Hybrid Interconnect Infrastructure for Inter-Chiplet Communication in Wafer-Scale Systems
Yousef Safari — McGill University
Rezvan Mohammadrezaee — McGill University
Dima Al Saleh — McGill University
Boris Vaisband — McGill University
22. Reliability of Indium Solder Joints using Laser-Assisted Bonding (LAB) Process at Room Temperature
Ji Eun Jung — Electronics and Telecommunications Research Institute
Yoon Hwan Moon — Electronics and Telecommunications Research Institute
Ga-Eun Lee — Electronics and Telecommunications Research Institute
Jiho Joo — Electronics and Telecommunications Research Institute
Gwang-Mun Choi — Electronics and Telecommunications Research Institute
Chanmi Lee — Electronics and Telecommunications Research Institute
Ki-seok Jang — Electronics and Telecommunications Research Institute
Jin-Hyuk Oh — Electronics and Telecommunications Research Institute
Yong-Sung Eom — Electronics and Telecommunications Research Institute
Jung-Ho Shin — Electronics and Telecommunications Research Institute
Kwang-Seong Choi — Electronics and Telecommunications Research Institute
Seung-Yoon Lee — Hanbat National University
23. Tailored Multi-Mode, High-Q Nb Superconducting Resonators: Unique Platform for Magnon-Photon Coupling
Muntasir Mahdi — Auburn University
Bhargav Yelamanchili — Auburn University
Archit Shah — Auburn University
Sherman Peek — Auburn University
Yuzan Xiong — University of North Carolina
Dan-Chi Nguyen — Ewha Womans University/The University of North Carolina
Tae Hee Kim — Ewha Womans University
Wei Zhang — University of North Carolina
Michael Hamilton — Auburn University
24. Magnetic Cores for High Conversion Ratio Package Embedded Inductors
Sai Saravanan Ambi Venkataramanan — Georgia Institute of Technology
Prahalad Murali — Georgia Institute of Technology
Dustin Allen Gilbert — University of Tennessee
Mohan Kathaperumal — Georgia Institute of Technology
Mark Losego — Georgia Institute of Technology
25. Unveiling Mechanical Stress in Lithium-Metal Batteries for Flexible Electronics: A Novel Approach With Optical Techniques and Artificial Interfaces
Mayukh Nandy — Arizona State University
Siyang Liu — Arizona State University
Hongbin Yu — Arizona State University
26. Creep Properties of SAC305 Solder Specimens that Mimic the Microstructures of a Micro Solder Ball: Measurement and BLR Prediction
You-Gwon Kim — Hanyang University
Heon-Su Kim — Hanyang University
Tae-Wan Kim — Hanyang University
Seong-Ung Ryu — Hanyang University
Hak-Sung Kim — Hanyang University
Yongrae Jang — University of Maryland
Bongtae Han — University of Maryland
Jun-Hyeong Lee — DUKSAN Hi-Metal Co., Ltd.
Jin-Kyu Kim — DUKSAN Hi-Metal Co., Ltd.
29. RF Energy Harvesting Hybrid RFID Based Sensors for Smart Agriculture Applications
Yihang Chu — Michigan State University
Ethan Kepros — Michigan State University
Bhargav Avireni — Michigan State University
Sambit Kumar Ghosh — Michigan State University
Premjeet Chahal — Michigan State University
30. Influence of Nickel and Bismuth Addition on the Mechanical Shear Strength of SAC+ Ni, Bi Solders Under Isothermal Aging and Multiple Reflows
Jyothsna Bandayagari — Binghamton University
Dr. Santosh Kudtarkar — Analog Devices, Inc.
Dr. Arun Raj — Analog Devices, Inc.
Dr. Shafi Saiyed — Analog Devices, Inc.
Dr. Darshil Patel — Binghamton University
Dr. Yingge Zhou — Binghamton University
31. Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC- eSiFO) Package
Zhou Yang — Peking University
Yuchi Yang — Peking University
Peijue Lyu — Peking University
Jianyu Du — Peking University
Lang Chen — Peking University
Chi Zhang — Peking University
Wei Wang — Peking University
33. Demystifying Edge Cases in Advanced IC Packaging Inspection Through Novel Explainable AI Metrics
Shajib Ghosh — University of Florida
Antika Roy — University of Florida
Md Mahfuz Al Hasan — University of Florida
Patrick Craig — University of Florida
Nitin Varshney — University of Florida
Sanjeev J. Koppal — University of Florida
Navid Asadizanjani — University of Florida
35. Effective Heat Dissipation of White Laser Diodes by Welding Metallized Phosphor-Sapphire on Ceramic Substrate With 3D Metal Dam
Zikang Yu — Huazhong University of Science and Technology
Jiuzhou Zhao — Huazhong University of Science and Technology
Qing Wang — Huazhong University of Science and Technology
Yang Peng — Huazhong University of Science and Technology
Mingxiang Chen — Huazhong University of Science and Technology
36. Nanoporous Copper: Just How Much Can This Compliant Bonding Interface Relax Flatness and Coplanarity Requirements in Copper-to-Copper Bonding?
Ali Amirnasiri — Georgia Institute of Technology
Ramon Sosa — Georgia Institute of Technology
Antonia Antoniou — Georgia Institute of Technology
Vanessa Smet — Georgia Institute of Technology
