Technical Program

Friday, May 31, 2019

Session Co-Chairs:

Papers:

Low-Temperature Transient Liquid Phase (TLP) Bonding Using Eutectic Sn-In Solder Anisotropic Conductive Films (ACFs) for Flexible Ultrasonic Transducers
Jae-Hyeong Park - Korea Advanced Institute of Science and Technology
Jongcheol Park - National NanoFab Center
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Room-Temperature Wire Bonding with Pd Coated Cu Wire on Al Pads: Ball Bond Optimization with 2-Stage Methodology
Nicholas Kam - University of Waterloo
Michael Hook - University of Waterloo
Michael Mayer - University of Waterloo
Celal Con - KA Imaging Inc.
Karim Karim - KA Imaging Inc.

On-Chip ESD Monitor
Kannan Kalappurakal Thankappan - University of California, Los Angeles
Boris Vaisband - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

Preparation and Characterization of Electroplated Cu/Graphene Composite
Xin Wang - Tsinghua University
Qian Wang - Tsinghua University
Jian Cai - Tsinghua University
Changming Song - Tsinghua University
Yang Hu - Tsinghua University
Yang Zhao - University of Science and Technology of China
Yu Pei - University of Science and Technology of China

Quantifying the Impact of RF Probing Variability on TRL Calibration for LTCC Substrates
Ömer Faruk Yildiz - Hamburg University of Technology
David Dahl - Hamburg University of Technology
Christian Schuster - Hamburg University of Technology

Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging
Kirak Son - Andong National University
Gahui Kim - Andong National University
Hyodong Ryu - Andong National University
Gyu-Tae Park - Amkor Technology, Inc.
Ho-Young Son - SK hynix Inc.
Nam-Seog Kim - SK hynix Inc.
Cheol-Woong Yang - Sungkyunkwan University
Young-Cheon Kim - Andong National University
Jeong Sam Han - Andong National University
Young-Bae Park - Andong National University

Ag Diffusion Control Through Sn on a Sequential Plating-Based Bumping Process
Abderrahim El Amrani - Université de Sherbrooke
Etienne Paradis - Université de Sherbrooke
David Danovitch - Université de Sherbrooke
Dominique Drouin - Université de Sherbrooke

Mechanical Reliability Assessment of Cu6Sn5 Intermetallic Compound and Multilayer Structures in Cu/Sn Interconnects for 3D IC Applications
Jui-Yang Wu - National Taiwan University
C. Robert Kao - National Taiwan University
Jenn-Ming Yang - University of California, Los Angeles

A Study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with Self-Exposed Surface of Conductive Particles for Ultra-Fine Pitch Chip-on-Glass (COG) Applications
Dal-Jin Yoon - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Bending Properties of Fine Pitch Flexible CIF (Chip-in-Flex) Packages Using APL (Anchoring Polymer Layer) ACFs (Anisotropic Conductive Films)
Ji-Hye Kim - Korea Advanced Institute of Science and Technology
Dal-Jin Yoon - Korea Advanced Institute of Science and Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Effects of the Curing Properties and Viscosities of Non-Conductive Films (NCFs) on Sn-Ag Flip Chip Solder Bump Joint Morphology and Reliability
HanMin Lee - Korea Advanced Institute of Science and Technology
SeYong Lee - Korea Advanced Institute of Science and Technology
SangMyung Shin - Korea Advanced Institute of Science and Technology
TaeJin Choi - Doosan Corporation Electro-Materials BG
SooIn Park - Doosan Corporation Electro-Materials BG
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Experimental Investigations on Vertical Ultrasonic Assisted Low Temperature Sintering Process
Henning Seefisch - Leibniz University Hanover
Jens Twiefel - Leibniz University Hanover

Pressureless Transient Liquid Phase Sintering Bonding of Sn-58Bi with Ni Particles for High-Temperature Packaging Applications
Kyung Deuk Min - Sungkyunkwan University
Kwang-Ho Jung - Sungkyunkwan University
Choong-Jae Lee - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

Epoxy/Triazine Copolymer Resin System for High Temperature Encapsulant Applications
Jiaxiong Li - Georgia Institute of Technology
Chao Ren - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

Low-Temperature Ag-Ag Direct Bonding Technology for Advanced Chip-Package Interconnection
Jiaqi Wu - University of California, Irvine
Chin C. Lee - University of California, Irvine

Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications
Sinan Su - Auburn University
Francy Akkara - Auburn University
Anto Raj - Auburn University
Cong Zhao - Apple Inc.
Seth Gordon - Auburn University
Sharath Sridhar - Auburn University
Sivasubramanian Thirugnanasambandam - Auburn University
Sa'd Hamasha - Auburn University
Jeffery Suhling - Auburn University
John Evans - Auburn University

A novel approach of copper-ceramic-joints manufactured by selective laser melting
Thomas Stoll - Institute for Factory Automation and Production Systems
Matthias Kirstein - Institute for Factory Automation and Production Systems
Joerg Franke

Wideband Low-Profile Ka-Band Microstrip Antenna With Low Cross Polarization Using Asymmetry AMC Structure
Mei Xue - Institute of Microelectronics A*STAR
Weikang Wan Qidong Wang Liqiang Cao

Automatic Transient Thermal Impedance Tester for Quality Inspection of Soldered and Sintered Power Electronic Devices on Panel and Tile Level
Maximilian Schmid - Technical University of Applied Research
Sri Krishna Bhogaraju - Technical University of Applied Research
Gordon Elger - Technical University of Applied Research

Time 0 Void Evolution and Effect on Electromigration
Jiefeng Xu - Binghamton University
Van Lai Pham - Binghamton University
Huayan Wang - Binghamton University
Stephen R. Cain - Binghamton University
Scott McCann - Xilinx, Inc.
Ho Hyung Lee - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.
S.B. Park - Binghamton University

Quintuple Band lamda/4 Stub by Using Unbalanced Bridged CRLH Transmission Lines
Renuka Bowrothu - University of Florida
Seahee Hwangbo - University of Florida
Yong-Kyu Yoon - University of Florida
Haein Kim - University of Florida

Product Level Design Optimization for 2.5D Package Pad Cratering Reliability during Drop Impact
Huayan Wang - Binghamton University
Jing Wang - Binghamton University
Jiefeng Xu - Binghamton University
Vanlai Pham - Binghamton University
Ke Pan - Binghamton University
Seungbae Park - Binghamton University
Hohyung Lee - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.

Microstructure of Pb-Free Solder Joints by Reflow and Thermo-Compression Bonding (TCB) Process
Jinho Hah - Georgia Institute of Technology
Yongja Kim - Georgia Institute of Technology
Patxi Fernandez-Zelaia - Georgia Institute of Technology
Sangil Lee - Georgia Institute of Technology
Leroy Christie - ASM Pacific Assembly Products, Inc.
Paul Houston - Engent Inc.
Shreyes Melkote - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
Ching-Ping Wong - Georgia Institute of Technology

Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages
Jinho Hah - Georgia Institute of Technology
Yong Ja Kim - Samsung Electronics Company, Ltd.
Kyoung Sik (Jack) Moon - Georgia Institute of Technology
C. P. Wong - Georgia Institute of Technology