Technical Program

Wednesday, May 30, 2018

Session 4: Advancements in Automotive and Power Devices
8:00 AM - 11:40 AM
Committee: Materials & Processing

Session Co-Chairs:

Praveen Pandojirao-S
Johnson & Johnson
T +1-904-443-1691
Lewis Huang
Senju Electronic


1. 8:00 AM - Solid-Liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications
Knut E Aasmundtveit - University of South-Eastern Norway
Thi-Thuy Luu - Zimmer & Peacock
Hoang-Vu Nguyen - University of South-Eastern Norway
Andreas Larsson - University of South-Eastern Norway
Torleif A Tollefsen - Tegma

2. 8:25 AM - Fluxless bonding technique of diamond to copper using silver-indium multilayer structure
Roozbeh Sheikhi - University of California, Irvine
Yongjun Huo - University of California, Irvine
Chin C Lee - University of California, Irvine

3. 8:50 AM - Formulation and Processing of Conductive Polysulfide Sealants for Automotive and Aerospace Applications
Bo Song - Georgia Institute of Technology
Fan Wu - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

4. 10:00 AM - Challenges and Approaches to Developing Automotive FCBGA Grade 1/0 Package Capability
Rajen Dias - Amkor Technology, Inc.
Mike Kelly Devarajan Balaraman KwangSeok Oh JoonYoung Park Hideaki Shoji Tomio Shiraiwa

5. 10:25 AM - Advanced substrates for GaN-based HEMTs devices
Anthony Cibié - CEA-LETI
Julie Widiez - CEA-LETI
René Escoffier - CEA-LETI
Denis Blachier - CEA-LETI
Stéphane Bécu - CEA-LETI
Perceval Coudrain - CEA-LETI
William Vandendaele - CEA-LETI
Jerome Biscarrat - CEA-LETI
Charlotte Gillot - CEA-LETI
Matthew Charles - CEA-LETI

6. 10:50 AM - A new reliable, corrosion resistant gold-palladium coated copper wire material
Sandy Klengel - Fraunhofer IMWS
Robert Klengel - Fraunhofer IMWS
Tino Stephan - Fraunhofer IMWS
Jan Schischka - Fraunhofer IMWS
Matthias Petzold - Fraunhofer IMWS
Motoki Eto - Nippon Micrometal Corporation
Noritoshi Araki - Nippon Micrometal Corporation
Takashi Yamada - Nippon Micrometal Corporation

7. 11:15 AM - Ultrasonic-accelerated intermetallic joint formation with composite solder for high-temperature power device packaging
Hongjun Ji - Harbin Institute of Technology at Shenzhen
Mingyu Li - Harbin Institute of Technology at Shenzhen
Weiwei Zhao - Harbin Institute of Technology at Shenzhen