Technical Program

Wednesday, May 31, 2017

Session 4: Advanced Substrates and Integrated Devices
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Southern Hemisphere V

Session Co-Chairs:

Tieyu Zheng
Microsoft Corporation
T +1-425- 722-1141
tizheng@microsoft.com
Yu-Hua Chen
Unimicron
T +886-3-5995899#2109
yh_chen@unimicron.com

Papers:

1. 8:00 AM - Novel Organic Substrate with Enhanced Thermal Conductivity
Xiaoliang Zeng - Shenzhen Institutes of Advanced Technology
Yimin Yao - Shenzhen Institutes of Advanced Technology
Yougen Hu - Shenzhen Institutes of Advanced Technology
Kun Guo - Shenzhen Institutes of Advanced Technology
Jiajia Sun - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Jianbin Xu - Chinese University Hong Kong
Ching-Ping Wong - Chinese University Hong Kong

2. 8:25 AM - Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals
Shreya Dwarakanath - Georgia Institute of Technology
Pulugurtha Markondeya Raj - Georgia Institute of Technology
Collen Z. Leng - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Mark D Losego - Georgia Institute of Technology
Rao R Tummala - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

3. 8:50 AM - Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack resistance at TST for Automotive IC Package
Chiho Ueta - TAIYO INK
Kazuya Okada - TAIYO INK
Toko Shiina - TAIYO INK
Tadahiko Hanada - TAIYO INK
Nobuhito Itoh - TAIYO INK

4. 10:00 AM - Bondable Copper Substrates With Silver Solid Solution Coatings for High-Power Electronic Applications
Yongjun Huo - University of California, Irvine
Chin C. Lee - University of California, Irvine

5. 10:25 AM - On-Chip Integrated Solid-State Micro-Supercapacitor
Muhammad Amin Saleem - Smoltek
Bo Song - Georgia Institute of Technology
Rickard Andersson - Smoltek
C.P Wong - Georgia Institute of Technology
Vincent Desmaris - Smoltek

6. 10:50 AM - Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power Supply
Tomoyuki Akahoshi - Fujitsu
Daisuke Mizutani - Fujitsu
Kei Fukui - Fujitsu
Seigo Yamawaki - Fujitsu
Hidehiko Fujisaki - Fujitsu
Manabu Watanabe - Fujitsu
Masateru Koide - Fujitsu

7. 11:15 AM - Panel-Based Integrated Passive Device for RF Application
Ming Hung Chen - ASE
Tze Hsin Chiang - ASE
Jia Hao Zhang - ASE
Hsu Chiang Shih - ASE
Sheng Chi Hsieh - ASE
Teck Chong Lee - ASE
Chih Pin Hung - ASE