Technical Program

Wednesday, May 31, 2017

Session 4: Advanced Substrates and Integrated Devices
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Southern Hemisphere V

Session Co-Chairs:

Tieyu Zheng
Microsoft Corporation
T +1-425- 722-1141
tizheng@microsoft.com
Yu-Hua Chen
Unimicron
T +886-3-5995899#2109
yh_chen@unimicron.com

Papers: