Technical Program

Wednesday, May 31, 2017

Session 4: Advanced Substrates and Integrated Devices
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Southern Hemisphere V

Session Co-Chairs:

Tieyu Zheng
Microsoft Corporation
T +1-425- 722-1141
Yu-Hua Chen
T +886-3-5995899#2109


1. 8:00 AM - A Novel Organic Substrate with Enhanced Thermal Conductivity
Xiaoliang Zeng - Shenzhen Institutes of Advanced Technology
Yimin Yao - Shenzhen Institutes of Advanced Technology
Yougen Hu - Shenzhen Institutes of Advanced Technology
Kun Guo - Shenzhen Institutes of Advanced Technology
Jiajia Sun - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Jianbin Xu - Chinese University Hong Kong
Ching-Ping Wong - Chinese University Hong Kong

2. 8:25 AM - Infusing Inorganics into the Subsurface of Polymer Redistribution Layer Dielectrics for Improved Adhesion to Metals
Shreya Dwarakanath - Georgia Institute of Technology
Pulugurtha Markondeya Raj - Georgia Institute of Technology
Collen Z. Leng - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Mark D Losego - Georgia Institute of Technology
Rao R Tummala - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

3. 8:50 AM - Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack resistance at TST for Automotive IC Package
Chiho Ueta - Taiyo Ink Mfg.Co.,Ltd.
Kazuya Okada - Taiyo Ink Mfg.Co.,Ltd.
Toko Shiina - Taiyo Ink Mfg.Co.,Ltd.
Tadahiko Hanada - Taiyo Ink Mfg.Co.,Ltd.
Nobuhito Itoh - Taiyo Ink Mfg.Co.,Ltd.

4. 10:00 AM - Bondable Copper Substrates With Silver Solid Solution Coatings for High-Power Electronic Applications
Yongjun Huo - University of California, Irvine
Chin C. Lee - University of California, Irvine

5. 10:25 AM - On-Chip Integrated Solid-State Micro-Supercapacitor
Muhammad Amin Saleem - Smoltek AB
Bo Song - Georgia Institute of Technology
Rickard Andersson - Smoltek AB
C.P Wong - Georgia Institute of Technology
Vincent Desmaris - Smoltek AB

6. 10:50 AM - Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power Supply
Tomoyuki Akahoshi - Fujitsu Laboratories, Ltd.
Daisuke Mizutani - Fujitsu Laboratories, Ltd.
Kei Fukui - Fujitsu Laboratories, Ltd.
Seigo Yamawaki - Fujitsu Laboratories, Ltd.
Hidehiko Fujisaki - Fujitsu Laboratories, Ltd.
Manabu Watanabe - Fujitsu Laboratories, Ltd.
Masateru Koide - Fujitsu Laboratories, Ltd.

7. 11:15 AM - Panel-Based Integrated Passive Device for RF Application
Ming Hung Chen - Advanced Semiconductor Engineering, Inc.
Tze Hsin Chiang - Advanced Semiconductor Engineering, Inc.
Jia Hao Zhang - Advanced Semiconductor Engineering, Inc.
Hsu Chiang Shih - Advanced Semiconductor Engineering, Inc.
Sheng Chi Hsieh - Advanced Semiconductor Engineering, Inc.
Teck Chong Lee - Advanced Semiconductor Engineering, Inc.
Chih Pin Hung - Advanced Semiconductor Engineering, Inc.