Technical Program

Thursday, June 01, 2017

Session 39: Interactive Presentations 3
9:00 AM - 11:00 AM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Mark Eblen
Kyocera America, Inc.
T +1-858-614-2537
mark.eblen@kyocera.com
Swapan Bhattacharya
Engent Inc.
T 770 280 4259
Swapan.bhattacharya@engentaat.com

Tz-Cheng Chiu
National Cheng Kung University
T +886-6-2757575
tcchiu@mail.ncku.edu.tw

Frank Wei
Disco Japan
T +81-3-4590-1035
frank_w@disco.co.jp

Papers:

Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer
Yutaka Uematsu - Hitachi, Ltd.
Nobuyuki Ushifusa - Hitachi, Ltd.
Hitoshi Onozeki - Hitachi Chemical Co., Ltd.

The Use of Single Layer MIS in Modern Assembly
Kohan Lin - Siliconware Precision Industries Co., Ltd.
Albert Lan - Siliconware Precision Industries Co., Ltd.
Mark Liao - Siliconware Precision Industries Co., Ltd.
Boxiang Fang - Siliconware Precision Industries Co., Ltd.

Physical and Electrical Characterization of 3D Embedded Capacitor: A High-Density MIM Capacitor Embedded in TSV
Ye Lin - Nanyang Technological University
Chuan Seng Tan - Nanyang Technological University

Electrical and Thermal Simulation of SWIFT™ High Density Fan-out PoP Technology
Curtis Zwenger - Amkor Technology, Inc.
Bora Baloglu - Amkor Technology, Inc.
George Scott - Amkor Technology, Inc.
Mike Kelly - Amkor Technology, Inc.
WonChul Do - Amkor Technology, Korea
JiHun Yi - Amkor Technology, Korea
WonGeol Lee - Amkor Technology, Korea

High Reliability Challenges with Cu Wire Bonding for Automotive Devices in the AEC-Q006
JunHo Jeon - Amkor Technology, Inc.
SungHo Jeon - Amkor Technology, Inc.
SeokHo Na - Amkor Technology, Inc.
Mina Mo - Amkor Technology, Inc.
Kwangmo Lim - Amkor Technology, Inc.
DaeByoung Kang - Amkor Technology, Inc.
JinYoung Kim - Amkor Technology, Inc.

Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
Chun An Yang - National Taiwan University
C. Robert Kao - National Taiwan University
Hiroshi Nishikawa - Osaka University

Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints
Huayu Sun - City University of Hong Kong
Xiao Hu - HiSilicon Technologies
Yan-Cheong Chan - City University of Hong Kong
Fengshun Wu - Huazhong University of Science and Technology

Assessing the Reliability of High Temperature Solder Alternatives
Maan Z. Kokash - Binghamton University
Rajesh S. Sivasubramony - Binghamton University
Jorge L. Then Cuevas - Binghamton University
Angelo F. Zamudio - Binghamton University
Peter Borgesen - Binghamton University
Alfred A. Zinn - Lockheed Martin
Randall M. Stoltenberg - Lockheed Martin
Jerome Chang - Lockheed Martin
Y.-L. Tseng - Lockheed Martin
Dan Blass - Lockheed Martin

High Performance Silver Alloy Bonding Wire for Memory Devices
Tetsuya Oyamada - Nippon Steel & Sumitomo Metal Corporation
Tomohiro Uno - Nippon Steel & Sumitomo Metal Corporation
Takashi Yamada - Nippon Steel & Sumitomo Metal Corporation
Daizo Oda - Nippon Micrometal Corporation

Low Pressure Solid-State Bonding Using Silver Preforms for High Power Device Packaging
Jiaqi Wu - University of California, Irvine
Chin C. Lee - University of California, Irvine

Fabrication, Characterization and Comparison of FR4-Compatible Composite Magnetic Materials for High Efficiency Integrated Voltage Regulators with Embedded Magnetic Core Micro-Inductors
Mohamed Bellaredj - Georgia Institute of Technology
Sebastian Mueller - Georgia Institute of Technology
Anto Davis - Georgia Institute of Technology
Paul Kohl - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Yasuhiko Mano - Ibiden

The Novel Failure Mechanism of the Polymer Ball Interconnected CBGA under Board Level Thermal Mechanical Stress
Jeffrey ChangBing Lee - iST-Integrated Service Technology, Inc.
Cheng-Chih Chen - iST-Integrated Service Technology, Inc.
Dem Lee - iST-Integrated Service Technology, Inc.
Cherie Chen - iST-Integrated Service Technology, Inc.
Alice Lin - iST-Integrated Service Technology, Inc.

Development of Double Side Protection Process with Bump Support Film (BSF) and Backside Coating Tape for WLP
Masanori Yamagishi - Lintec Corporation
Tomotaka Morishita - Lintec Corporation
Motoki Nozue - Lintec Corporation
Akinori Sato - Lintec Corporation
Keisuke Shinomiya - Lintec Corporation
Shinya Takyu - Lintec Corporation

Design of Miura Folding-Based Micro-Supercapacitors as Foldable and Miniaturized Energy Storage Units
Bo Song - Georgia Institute of Technology
Yun Chen - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials
Chi-An Pan - Siliconware Precision Industries Co., Ltd.
Chi-Tung Yeh - Siliconware Precision Industries Co., Ltd.
Wei-Chun Qiu - Siliconware Precision Industries Co., Ltd.
Rong-Zheng Lin - Siliconware Precision Industries Co., Ltd.
Liang-Yih Hung - Siliconware Precision Industries Co., Ltd.
Kong-Toon Ng - Siliconware Precision Industries Co., Ltd.
C. F. Lin - Siliconware Precision Industries Co., Ltd.
C. Key Chung - Siliconware Precision Industries Co., Ltd.
Don-Son Jiang - Siliconware Precision Industries Co., Ltd.
C. S. Hsiao - Siliconware Precision Industries Co., Ltd.

Low Temperature Curable Polyimide Film Properties and WLP Reliability Performance with Various Curing Conditions
Yu Chuan (Steven) Chen - Siliconware Precision Industries Co., Ltd.
Katch Wan - Siliconware Precision Industries Co., Ltd.
Chen An Chang - Siliconware Precision Industries Co., Ltd.
Rick Lee - Siliconware Precision Industries Co., Ltd.

The Effect of Polymer Rebound on SnBi58 Solder ACFs Joints Cracks during a Thermo-Compression Bonding
Shuye Zhang - Korea Advanced Institute of Science & Technology
Kyung-Wook Paik - Korea Advanced Institute of Science & Technology