Technical Program

Thursday, May 30, 2019

Session 39: Interactive Presentations 3
9:00 AM - 11:00 AM
Committee: Interactive Presentations

Session Co-Chairs:

Michael Mayer
University of Waterloo
T +1-519-888-4024
mmayer@uwaterloo.ca
Alan Huffman
Micross Advanced Interconnect Technology
T +1-919-248-9216
alan.huffman@micross.com

Papers:

Modeling and Design of Power Distribution Network for a Heterogeneous Integrated Active Interposer With Neuromorphic Computing Circuits
Min Miao - Beijing Information Science and Technology University
Tianfang Chen - Beijing Information Science and Technology University
Jincan Zhang - Beijing Information Science and Technology University
Na Li - Beijing Information Science and Technology University
Kunkun Li - Beijing Information Science and Technology University
Liyuan Wang - Beijing Information Science and Technology University
Yang Yang - Shenzhen Graduate School, Peking University
Xiaole Cui - Shenzhen Graduate School, Peking University
Yufeng Jin - Shenzhen Graduate School, Peking University
Huan Liu - Peking University

PCB Microstrip Line Far-End Crosstalk Mitigation by Surface Mount Capacitors
Zhaoqing Chen - IBM Corporation

New Cost-Effective Via-Last Approach by “One-Step TSV” After Wafer Stacking for 3D Memory Applications
Masaya Kawano - Institute of Microelectronics A*STAR
Xiang-Yu Wang - Institute of Microelectronics A*STAR
Qin Ren - Institute of Microelectronics A*STAR

Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints During Thermomigration
Yu-An Shen - Osaka University
Shiqi Zhou - Osaka University
Jiahui Li - City University of Hong Kong
K. N. Tu - University of California, Los Angeles
Hiroshi Nishikawa - Osaka University

Simulation and Experimental Validations of EM/TM/SM Physical Reliability for Interconnects Utilized in Stretchable and Foldable Electronics
Oscar Chuang - National Tsing University
Chang-Chun Lee - National Tsing University
Chia-Ping Hsieh - National Tsing University
Wei-Yuan Cheng - Industrial Technology Research Institute
Steve Chiu - Industrial Technology Research Institute

A Complex Integrated Circuit Structure Transformation, Modeling and Simulation Method
Daixing Wang - Peking University
Yufeng Jin - Peking University
Wei Wang - Peking University

A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 Based Anisotropic Conductive Films
Shuye Zhang - Harbin Institute of Technology
Mingliang Huang - Dalian University of Technology
Yang Wu - Dalian University of Technology
Ming Yang - Hisilicon Optoelectronics Co., Ltd.
Tiesong Lin - Harbin Institute of Technology
Peng He - Harbin Institute of Technology
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads
Mahesh Yalagach - Polymer Competence Center Leoben GmbH
Peter Filipp Fuchs - Polymer Competence Center Leoben GmbH
Archim Wolfberger - ams AG
Mario Gschwandl - Polymer Competence Center Leoben GmbH
Thomas Antretter - University of Leoben
Michael Feuchter - University of Leoben
Coen Tak Coen Tak - ams AG
Tao Qi - AT&S

Electromigration-Induced β-Sn Grain Rotation in Lead-Free Flip Chip Solder Bumps
Mingliang Huang - Dalian University of Technology
Jiameng Kuang - Dalian University of Technology
Hongyu Sun - Dalian University of Technology

Low-Cost MT-Ferrule-Compatible Optical Connector for Co-Packaged Optics Using Single-Mode Polymer Waveguide
Akihiro Noriki - National Institute of Advanced Industrial Science and Technology
Takeru Amano - National Institute of Advanced Industrial Science and Technology
Masatoshi Tsunoda - Kyocera Corporation
Toshiaki Michihiro - Kyocera Corporation

Characterization of Coated Silver Wire Bond Interface Using TEM
Murali Sarangapani - Heraeus Holding GmbH
Eric Tan Swee Seng - Heraeus Holding GmbH
Jason Wong Chin Yeung - Heraeus Holding GmbH

Research on Applied Reliability of BGA Solder Balls in Extreme Marine Environment
Liyuan Liu - China Electronic Product Reliability and Environmental Testing Research Institute
Tao Lu - China Electronic Product Reliability and Environmental Testing Research Institute
Daojun Luo - China Electronic Product Reliability and Environmental Testing Research Institute
Hui Xiao - China Electronic Product Reliability and Environmental Testing Research Institute

Influence of Single/Double Sweeping Modes and Sweeping Voltage Increment/Polarity on Measurement of TSV Leakage Current
Qinghua Zeng - Peking University
Jing Chen - Peking University
Yufeng Jin - Peking University

Improving the Solder Wettability via Atmospheric Plasma Technology
Sagung Kencana - National Taiwan University of Science and Technology
Wallace Chuang - Robert Bosch Taiwan Co., Ltd
Eckart Schellkes - Robert Bosch Taiwan Co., Ltd
Yee-Wen Yen - National Taiwan University of Science and Technology
Yu-Lin Kuo - National Taiwan University of Science and Technology

Orthogonal Quilt Packaging 3D Integration for High Energy Particle Detectors
Jason Kulick - Indiana Integrated Circuits, LLC
Tian Lu - Indiana Integrated Circuits, LLC
Christopher Kenney - SLAC National Accelerator Laboratory
Julie Segal - SLAC National Accelerator Laboratory
Carlos Ortega - Indiana Integrated Circuits, LLC
Gary Bernstein - Indiana Integrated Circuits, LLC
Edit Varga - Indiana Integrated Circuits, LLC

Carbonized Electrodes for Electrochemical Sensing
Mohammad Aminul Haque - The University of Tennessee, Knoxville
Nickolay V. Lavrik - Oak Ridge National Laboratory
Dale Hensley - Oak Ridge National Laboratory
Nicole McFarlane - The University of Tennessee, Knoxville

Moldability Challenges Associated With the Assembly of Thicker IC Packages for High Voltage and Power Applications
Sadia Naseem - Texas Instruments, Inc.
Jack Chiang - Texas Instruments, Inc.
Megan Chang - Texas Instruments, Inc.
Bob Lee - Texas Instruments, Inc.
Jason Chien - Texas Instruments, Inc.

Highly Compact, Multiband Composite-Right/Left-Handed (CRLH) Transmission Line Based Stub for GPS Applications
Hae-In Kim - University of Florida
Seahee Hwangbo - University of Florida
Renuka Bowrothu - University of Florida
Yong-Kyu Yoon - University of Florida