Technical Program

Wednesday, May 29, 2019

Session 38: Interactive Presentations 2
2:00 PM - 4:00 PM
Committee: Interactive Presentations

Session Co-Chairs:

Patrick Thompson
Texas Instruments, Inc.
T +1-214-567-0660
patrick.thompson@ti.com
Rao Bonda
Amkor Technology
T +1-480-786-7749
rao.bonda@amkor.com

Papers:

Laundering Reliability of Electrically Conductive Fabrics for E-Textile Applications
Jeffrey Lee - Integrated Service Technology
ChangHo Lo - Integrated Service Technology
Cheng-Chih Chen - Integrated Service Technology
Weifeng Liu - Flex, Ltd.

Preconditioning Technologies for Sputtered Seed Layers in FOPLP
Johannes Weichart - Evatec Corporation
Jürgen Weichart - Evatec Corporation
Andreas Erhart - Evatec Corporation
Kay Viehweger - Fraunhofer IZM, Berlin

Impact of Thermal Boundary Resistance on the Thermal Design of GaN-on-Diamond HEMTs
Huaixin Guo - Nanjing Electronic Devices Institute
Yuechan Kong - Nanjing Electronic Devices Institute
Tangsheng Chen - Nanjing Electronic Devices Institute

Measuring the Electric Properties of Thin Film Shape Memory Polymers in Simulated Physiological Conditions
Daniel Del Nero - The University of Texas at Dallas
Alexandra Joshi-Imre - The University of Texas at Dallas
Walter Voit - The University of Texas at Dallas

Evaluation of WLP Dielectrics for High-Voltage Applications
Markus Woehrmann - Fraunhofer IZM
Marcus Paeck - Fraunhofer IZM
Michael Toepper - Fraunhofer IZM
Klaus-Dieter Lang - TU Berlin

Mitigating the Effects of Microvortices in High-Re Deterministic Lateral Displacement by Using Symmetric Airfoil-Shaped Pillars
Jong-Hoon Kim - Washington State University
Kawkab Ahasan - Washington State University
Brian Dincau - Washington State University

Plasma Dry Process Technology Development of Glass-Epoxy Film on the Silicon Substrate to Fabricate RDL for Future GPU/AI Application.
Takahide Murayama - ULVAC, Inc.
Muneyuki Sato - ULVAC, Inc.
Akiyoshi Suzuki - ULVAC, Inc.
Atsuhito Ihori - ULVAC, Inc.
Tetsushi Fujinaga - ULVAC, Inc.
Yasuhiro Morikawa - ULVAC, Inc.

Fully Solid-State Integrated Capacitors Based on Carbon Nanofibers and Dielectrics with Specific Capacitances Higher than 200 nF/mm^2
Amin Saleem - Smoltek AB
Rickard Andersson - Smoltek AB
Maria Bylund - Smoltek AB
Charlotte Goemare - SmoltekAB
Guilhem Pacot - Smoltek AB
Mohammed Kabir - Smoltek AB
Vincent Desmaris - Smoltek AB

Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems
Wei-Yuan Cheng - Industrial Technology Research Institute (ITRI)
Chen-Tsai Yang - Industrial Technology Research Institute (ITRI)
Shau-Fei Cheng - Industrial Technology Research Institute (ITRI)
Wei-Han Chen - Industrial Technology Research Institute (ITRI)
Hsin-Cheng Lai - Industrial Technology Research Institute (ITRI)
Tai-Jui Wang - Industrial Technology Research Institute (ITRI)
Yuh-Zheng Lee - Industrial Technology Research Institute (ITRI)

Structuring of Laser Activated Polymers for Sensor Applications
Kevin Cromwell - Leibniz University Hanover
Sebastian Bengsch - Leibniz University Hanover
Maximilian Aue - Leibniz University Hanover
Marc Wurz - Leibniz University Hanover

A Deep Learning Approach for Volterra Kernel Extraction for Time Domain Simulation of Weakly Nonlinear Circuits
Thong Nguyen - University of Illinois
Xinying Wang - University of Illinois
Xu Chen - University of Illinois
Jose Schutt-Aine - University of Illinois

224G Package Interconnect Study Based on Artificial Neural Network Modeling Approach
Hui Liu - Intel Corporation
Qian Ding - Intel Corporation
Penglin Liu - Intel Corporation

Enhanced Reliability of a RF-SiP With Mold Encapsulation and EMI Shielding
Chan-Yuan Liu - Advanced Semiconductor Engineering Inc.
Kuo-Hsien Liao - Advanced Semiconductor Engineering Inc.
Yu-Chou Tseng - Advanced Semiconductor Engineering Inc.
Dao-Long Chen - Advanced Semiconductor Engineering Inc.
Alex Chan - Advanced Semiconductor Engineering Inc.
Meng-Kai Shih - Advanced Semiconductor Engineering Inc.
Mark Gerber - Advanced Semiconductor Engineering Inc.
Jason Chien - Advanced Semiconductor Engineering Inc.

Study of the Effect and Mechanism of a Cap Layer in Controlling the Statistical Variation of Via Extrusion
Golareh Jalilvand - University of Central Florida
Tengfei Jiang - University of Central Florida

Least-Squares Method Built in Processing Model of Finite Element Analysis Utilized to Obtain Accurate Prediction for Non-Axisymmetric Warpage of 2L ETS MUF FCCSP SiP
Chih-Sung Chen - Siliconware Precision Industries Co., Ltd.
Nicholas Kao - Siliconware Precision Industries Co., Ltd.
Poyu Liao - Siliconware Precision Industries Co., Ltd.
Ssu-Cheng Lai - Siliconware Precision Industries Co., Ltd.
Don Son Jiang - Siliconware Precision Industries Co., Ltd.

Three-Dimensional Copper Foam-Filled Elastic Conductive Composites With Simultaneously Enhanced Mechanical, Electrical, Thermal and Electromagnetic Interference (EMI) Shielding Properties
Yougen Hu - Shenzhen Institutes of Advanced Technology
Han Gu - Shenzhen Institutes of Advanced Technology
Tao Zhao - Shenzhen Institutes of Advanced Technology
Tan Lu - Shenzhen Institutes of Advanced Technology
Pengli Zhu - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Ching-Ping Wong - Georgia Institute of Technology

Vertical Interconnect Technology for Enlarging Capacity on Micro Solid Thin Film Rechargeable Battery
Akihiro Horibe - IBM Corporation
Kuniaki Sueoka - IBM Corporation
Risa Miyazawa - IBM Corporation
Takahiro Mori - IBM Corporation
Hiroyuki Mori - IBM Corporation

Characterization of Fine Pitch Hybrid Bonding Pads Using Electrical Misalignment Test Vehicles
Imed Jani - CEA-LETI
Didier Lattard - CEA-LETI
Pascal Vivet - CEA-LETI
Edith Beigné - CEA-LETI
Lucile Arnaud - CEA-LETI
Alexis Farcy - STMicroelectronics
Joris Jourdan - STMicroelectronics
Yann Henrion - STMicroelectronics
Emilie Deloffre - STMicroelectronics
Haim Bilgen - STMicroelectronics

Dynamic Characteristics Evaluation on NCF Under Challenging Conditions and Its Application
Tomonori Nakamura - Shinkawa Ltd.
Hiromi Shibahara - Shinkawa Ltd.
Osamu Watanabe - Shinkawa Ltd.
Tetsuya Utano - Shinkawa Ltd.
Daisuke Tani - Shinkawa Ltd.
Sung Chenhsiu - Shinkawa Ltd.
Toru Maeda - Shinkawa Ltd.
Doug Day - Shinkawa Ltd.
Hidekazu Yagi - Dexerials Corporation
Ryoji Kojima - Dexerials Corporation
Daichi Mori - Dexerials Corporation

Study of Electrical and Mechanical Characteristics of Inkjet-Printed Patch Antenna Under Uniaxial and Biaxial Bending
Yi Zhou - Georgia Institute of Technology
Rui Chen - Georgia Institute of Technology
Nahid Aslani Amoli - Georgia Institute of Technology
Sridhar Sivapurapu - Georgia Institute of Technology
Mohamed Bellaredj - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology

Effects of Oven and Laser Sintering Parameters on the Electrical Resistance of IJP Nano-Silver Traces on Mesoporous PET Before and During Fatigue Cycling
Gurvinder Singh Khinda - Binghamton University
Maan Z. Kokash - Binghamton University
Mohammed Alhendi - Binghamton University
M. Yadav - Binghamton University
Jack P. Lombardi - Binghamton University
Darshana L. Weerawarne - Binghamton University
Mark D. Poliks - Binghamton University
Peter Borgesen - Binghamton University
Nancy C. Stoffel - GE Global Research

Multilayer Glass Substrate With High-Density Via Structure for All Inorganic Multi-Chip Module
Toshiki Iwai - Fujitsu Laboratories, Ltd.
Taiji Sakai - Fujitsu Laboratories, Ltd.
Daisuke Mizutani - Fujitsu Laboratories, Ltd.
Seiki Sakuyama - Fujitsu Laboratories, Ltd.
Kenji Iida - FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Takayuki Inaba - FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Hidehiko Fujisaki - FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Akira Tamura - FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Yoshinori Miyazawa - FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

The Poisson’s Ratio of Lead-Free Solder – The Often Forgotten but Important Material Property
KM Rafidh Hassan - Auburn University
Mohammad Alam - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

Additive Laser Metal Deposition onto Silicon for Enhanced Microelectronics Cooling
Arad Azizi - Binghamton University
Matthias Daeumer - Binghamton University
Jacob C. Simmons - Binghamton University
Bahgat G. Sammakia - Binghamton University
Bruce T. Murray - Binghamton University
Scott Schiffres - Binghamton University

Moisture Barrier, Mechanical, and Thermal Properties of PDMS-PIB Blends for Solar Photovoltaic (PV) Module Encapsulant
Jinho Hah - Georgia Institute of Technology
Michael Sulkis - Georgia Institute of Technology
Chao Ren - Georgia Institute of Technology
Kyoung-Sik (Jack) Moon - Georgia Institute of Technology
Samuel Graham - Georgia Institute of Technology
C. P. Wong - Georgia Institute of Technology