Technical Program

Wednesday, May 31, 2017

Session 38: Interactive Presentations 2
2:00 PM - 4:00 PM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Patrick Thompson
Texas Instruments, Inc.
T +1-214-567-0660
patrick.thompson@ti.com

Eric Beyne
IMEC
T +32-16-281-261
eric.beyne@imec.be

Richard Rao
MicroSemi
T +1-805- 914-2272
Richard.rao@microsemi.com

Papers:

Exploring DDR4 Address Bus Design for High Speed Memory Interface
Nanju Na - Xilinx, Inc.
Juan Wang - Xilinx, Inc.
Sean Long - Xilinx, Inc.
Changyi Su - Xilinx, Inc.
Thomas To - Xilinx, Inc.
Yong Wang - Xilinx, Inc.

Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies
Hiroshi Kudo - Dai Nippon Printing Co., Ltd.
Ryohei Kasai - Dai Nippon Printing Co., Ltd.
Jyunichi Suyama - Dai Nippon Printing Co., Ltd.
Mitsuhiro Takeda - Dai Nippon Printing Co., Ltd.
Yumi Okazaki - Dai Nippon Printing Co., Ltd.
Haruo Iida - Dai Nippon Printing Co., Ltd.
Daisuke Kitayama - Dai Nippon Printing Co., Ltd.
Toshio Sasao - Dai Nippon Printing Co., Ltd.
Kouji Sakamoto - Dai Nippon Printing Co., Ltd.
Hiroaki Sato - Dai Nippon Printing Co., Ltd.
Shouhei Yamada - Dai Nippon Printing Co., Ltd.

The Comparison of Package Design and Electrical Analysis in Mobile Application
Tsun-Lung Hsieh - Advanced Semiconductor Engineering, Inc.
Yuan-Hsi Chou - University of Texas, Austin
Po-Chih Pan - Advanced Semiconductor Engineering, Inc.
Chih-Yi Huang - Advanced Semiconductor Engineering, Inc.
Ming-Fong Jhong - Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang - Advanced Semiconductor Engineering, Inc.

Multi-band Harmonic RF Tags for Barcode Applications in a Cluttered Environment
Saranraj Karuppuswami - Michigan State University
Mohd Ifwat Mohd Ghazali - Michigan State University
Amanpreet Kaur - Michigan State University
Premjeet Chahal - Michigan State University

High-Band AlN Based RF-MEMS Resonator for TSV Integration
Nan Wang - Institute of Microelectronics, A*STAR
Yao Zhu - Institute of Microelectronics, A*STAR
Chengliang Sun - Institute of Microelectronics, A*STAR
Mingbin Yu - Institute of Microelectronics, A*STAR
Geng Li Chua - Institute of Microelectronics, A*STAR
Srinivas Merugu - Institute of Microelectronics, A*STAR
Navab Singh - Institute of Microelectronics, A*STAR
Yuandong Gu - Institute of Microelectronics, A*STAR

Equalization Enhancement Approaches for PAM4 Signaling for Next Generation Speeds
Jiayi He - Missouri University of S&T
Bhyrav Mutnury - Dell, Inc.
Arun Chada - Dell, Inc.
Nana Dikhaminjia - Missouri University of S&T
Mikheil Tsiklauri - Missouri University of S&T
James Drewniak - Missouri University of S&T

Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SIP based on Communication Channel Modeling Methodology
Min Miao - Beijing Information Science and Technology University
Zhensong Li - Beijing Information Science and Technology University
Xiaoyang Duan - Beijing Information Science and Technology University
Xiaole Cui - Peking University
Yufeng Jin - Peking University
Tianfang Chen - Beijing Information Science and Technology University
Huan Liu - Peking University
Xin Sun - Peking University

A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens Under Mixed Mode I/III Loading
V N N Trilochan Rambhatla - Georgia Institute of Technology
David Samet - Georgia Institute of Technology
Scott R. McCann - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

Low Temperature Ultrasonic Bonding of Cu/Sn Microbumps with Au Layer for High Density Interconnection Applications
Qinghua Zeng - Peking University
Yong Guan - Peking University
Jing Chen - Peking University
Yufeng Jin - Peking University

Chip-Scale SERF Atomic Magnetometer without Magnetic Shield
Ling Lu - Southeast University
Jintang Shang - Southeast University
Zhihua Pan - Southeast University
Yu Ji - Southeast University

Numerical Simulations of Joint-to-Joint Temperature Variation during Thermo-Compression Bonding
Depayne Athia - University of Waterloo
Alireza Rezvani - Kulicke and Soffa, Inc.
Horst Clauberg - Kulicke and Soffa, Inc.
Ivy Qin - Kulicke and Soffa, Inc.
Michael Mayer - University of Waterloo

The Complete Packaging Reliability Studies through One Digital Image Correlation System
Yuling Niu - State University of New York at Binghamton
Jing Wang - State University of New York at Binghamton
Seungbae Park - State University of New York, Binghamton

Resistometric Characterization of the Interface between Au Wire Bonds to AlCuW Bond Pads
Steve Kilgore - NXP Semiconductors
Craig Gaw - NXP Semiconductors

Comparison and Consistency of On-PCB Microstrip Line Modeling by 3D Fullwave and 2D Quasi-Static Approaches for High Speed Packaging System Signal Integrity Simulations
Zhaoqing Chen - IBM Corporation

Real-Time Diagnosis of Wire Degradation Based on Digital Signal Analysis
Jinwoo Lee - Ulsan National Institute of Science & Technology
Daeil Kwon - Ulsan National Institute of Science & Technology