Technical Program

Wednesday, May 31, 2017

Session 38: Interactive Presentations 2
2:00 PM - 4:00 PM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Patrick Thompson
Texas Instruments, Inc.
T +1-214-567-0660
patrick.thompson@ti.com

Eric Beyne
IMEC
T +32-16-281-261
eric.beyne@imec.be

Richard Rao
MicroSemi
T +1-805- 914-2272
Richard.rao@microsemi.com

Papers:

Exploring DDR4 Address Bus Design for High Speed Memory Interface
Nanju Na - Xilinx
Juan Wang - Xilinx
Sean Long - Xilinx
Changyi Su - Xilinx
Thomas To - Xilinx
Yong Wang - Xilinx

Signal Integrity Modelling in Inhomogeneous Waveguide/PCB of Arbitrary Shape Using Broadband Green’s Function
Kung-Hau Ding - Air Force Research Laboratory
Tien-Hao Liao - University of Michigan
Leung Tsang - University of Michigan

A Novel Frequency-Modulated Power Delivery Network Design for DRAM Interface in Low Cost Wirebond Package
Sheng-Feng Lee - Mediatek
Chia-Yu Chan - Mediatek
Shang-Pin Chen - Mediatek

Compact Thin-Film Broadband Millimeter-Wave Bandpass Filters on Low-Loss Glass Interposers using Evanescent Mode Eighth-Mode Substrate Integrated Waveguide Cavities
David Senior - Anaren Microwave
Seahee Hwangbo - University of Florida
Aric Shorey - Corning
Jungkwun Kim - University of Kansas
Yong-Kyu Yoon - University of Florida

The Comparison of Package Design and Electrical Analysis in Mobile Application
Tsun-Lung Hsieh - ASE
Yuan-Hsi Chou - The University of Texas, Austin
Po-Chih Pan - ASE
Chih-Yi Huang - ASE
Ming-Fong Jhong - ASE
Chen-Chao Wang - ASE

Multi-band Harmonic RF Tags for Barcode Applications in a Cluttered Environment
Saranraj Karuppuswami - Michigan State University
Mohd Ifwat Mohd Ghazali - Michigan State University
Amanpreet Kaur - Michigan State University
Premjeet Chahal - Michigan State University

High-Band AlN Based RF-MEMS Resonator for TSV Integration
Nan Wang - IME
Yao Zhu - IME
Chengliang Sun - IME
Mingbin Yu - IME
Geng Li Chua - IME
Srinivas Merugu - IME
Navab Singh - IME
Yuandong Gu - IME

Equalization Enhancement Approaches for PAM4 Signaling for Next Generation Speeds
Jiayi He - Missouri University of S&T
Bhyrav Mutnury - Dell
Arun Chada - Dell
Nana Dikhaminjia - Missouri University of S&T
Mikheil Tsiklauri - Missouri University of S&T
James Drewniak - Missouri University of S&T

Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SIP based on Communication Channel Modeling Methodology
Min Miao - Beijing Information Science and Technology University
Zhensong Li - Beijing Information Science and Technology University
Xiaoyang Duan - Beijing Information Science and Technology University
Xiaole Cui - Peking University
Yufeng Jin - Peking University
Tianfang Chen - Beijing Information Science and Technology University
Huan Liu - Peking University
Xin Sun - Peking University

A New and Effective EMI Shield Method with Nanomagnetic Multilayered Film Composite
Ji Hye Lee - Samsung SDI
Kyong Chul Bae - Samsung SDI
Yoonman Lee - Samsung SDI
Junghwa Kim - Samsung SDI
Dong Hwan Lee - Samsung SDI
Sang Kyun Kim - Samsung SDI

A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens Under Mixed Mode I/III Loading
V N N Trilochan Rambhatla - Georgia Institute of Technology
David Samet - Georgia Institute of Technology
Scott R. McCann - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

Low Temperature Ultrasonic Bonding of Cu/Sn Microbumps with Au Layer for High Density Interconnection Applications
Qinghua Zeng - Peking University
Yong Guan - Peking University
Jing Chen - Peking University
Yufeng Jin - Peking University

Chip-Scale SERF Atomic Magnetometer without Magnetic Shield
Ling Lu - Southeast University
Jintang Shang - Southeast University
Zhihua Pan Yu Ji

Numerical Simulations of Joint-to-Joint Temperature Variation during Thermo-Compression Bonding
Depayne Athia - University of Waterloo
Alireza Rezvani - Kulicke and Soffa
Horst Clauberg - Kulicke and Soffa
Ivy Qin - Kulicke and Soffa
Michael Mayer - University of Waterloo

The Complete Packaging Reliability Studies through One Digital Image Correlation System
Yuling Niu - State University of New York at Binghamton
Jing Wang - State University of New York at Binghamton
Seungbae Park - State University of New York, Binghamton

Resistometric Characterization of the Interface between Au Wire Bonds to AlCuW Bond Pads
Steve Kilgore - NXP Semiconductors
Craig Gaw - NXP Semiconductors

A Low-Cost and Compact 100G PAM-4 ROSA using TO-Can Package
Sae-Kyoung Kang - ETRI
Jie Hyun Lee - ETRI
Joon Young Huh - ETRI
Joon Ki Lee - ETRI

Comparison and Consistency of On-PCB Microstrip Line Modeling by 3D Fullwave and 2D Quasi-Static Approaches for High Speed Packaging System Signal Integrity Simulations
Zhaoqing Chen - IBM

New Analytical Method for Assessing Thermo-Mechanical Stress-Induced Damage to WLCSP Solder Interconnects
Tae-Kyu Lee - Portland State University
Weidong Xie - Cisco Systems
Steven Perng - Cisco Systems
Cherif Guirguis - Cisco Systems
Kola Akinade - Cisco Systems
Edward Ibe - Zymet
Karl Loh - Zymet

Real-Time Diagnosis of Wire Degradation Based on Digital Signal Analysis
Jinwoo Lee - UNIST
Daeil Kwon - UNIST