Technical Program

Wednesday, May 29, 2019

Session 37: Interactive Presentations 1
9:00 AM - 11:00 AM
Committee: Interactive Presentations

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Pavel Roy Paladhi
IBM Corporation
T +1-512-286-9677
Pavel.Roy.Paladhi@ibm.com

Papers:

Comprehensive Solution for Micro Bump Coplanarity Control
Rung-De Wang - Taiwan Semiconductor Manufacturing Company Ltd.
J.H. Chen - Taiwan Semiconductor Manufacturing Company Ltd.
Y.N. Hsu - Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Chen Liu - Taiwan Semiconductor Manufacturing Company Ltd.
Y.C. Wang - Taiwan Semiconductor Manufacturing Company Ltd.
B.E. Ho - Taiwan Semiconductor Manufacturing Company Ltd.
Y.H. Wu - Taiwan Semiconductor Manufacturing Company Ltd.
Ponder Pan - Taiwan Semiconductor Manufacturing Company Ltd.
Harry Ku - Taiwan Semiconductor Manufacturing Company Ltd.
Kirin Wang - Taiwan Semiconductor Manufacturing Company Ltd.
Calvin Lu

Structural Enhancement for a CMOS-MEMS Microphone Under Thermal Loading by Taguchi Method
Chun-Lin Lu - National Tsing Hua University
Meng-Kao Yeh - National Tsing Hua University

A Methodology to Correct In-Fixture Measurement of Impedance by a Machine Learning Model
Bo-Siang Fang - Siliconware Precision Industries Co., Ltd.
Cha-Chu Lai - Siliconware Precision Industries Co., Ltd.
Ying-Wei Lu - Siliconware Precision Industries Co., Ltd.
Kuan-Ta Chen - Siliconware Precision Industries Co., Ltd.
Mike Tsai - Siliconware Precision Industries Co., Ltd.
Don-Son Jiang - Siliconware Precision Industries Co., Ltd.

Material and Structure Design Optimization for Panel-Level Fan-Out Packaging
Ian Hu - Advanced Semiconductor Engineering Inc.
Dao-Lang Chen - Advanced Semiconductor Engineering Inc.
Karen Yu Chen - Advanced Semiconductor Engineering Inc.
Meng-Kai Shih - Advanced Semiconductor Engineering Inc.
David Tarng - Advanced Semiconductor Engineering Inc.
Dinos Huang - Advanced Semiconductor Engineering Inc.
JY On - Advanced Semiconductor Engineering Inc.

The Microstructure and Mechanical Property of the High Entropy Alloy as a Low Temperature Solder
Yingxia Liu - Beijing Institute of Technology
Quanfeng He - City University of Hong Kong
Yong Yang - City University of Hong Kong
King-Ning Tu - University of California, Los Angeles
Xiuchen Zhao - Beijing Institute of Technology
Zhuangzhuang Hou - Beijing Institute of Technology
Li Pu - Beijing Institute of Technology

A Versatile Fan-Out Infrastructure Based on Die-Stencil Substrate Promoted by an Advanced Multifunctional Temporary Bonding Material
Xiao Liu - Brewer Science, Inc.
Baron Huang - Brewer Science, Inc.
Hong Zhang - Brewer Science, Inc.
Lisa Kirchner - Brewer Science, Inc.
Arthur Southard - Brewer Science, Inc.
Rama Puligadda - Brewer Science, Inc.
Tony Flaim - Brewer Science, Inc.

Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnections
Han-Tang Hung - National Taiwan University
S. Yang - National Taiwan University
I A. Weng - National Taiwan University
Y. H. Chen - Unimicron Technology Corporation
C. R. Kao - National Taiwan University

3D Integration of CMOS-Compatible Surface Electrode Ion Trap and Silicon Photonics for Scalable Quantum Computing
Jing Tao - Nanyang Technological University
Yu Dian Lim - Nanyang Technological University
Hong Yu Li - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Nam Piau Chew - Nanyang Technological University
Anak Agung Alit Apriyana - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Lin Bu - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Peng Zhao - Nanyang Technological University
Luca Guidoni - University Paris Diderot
Chuan Seng Tan - Nanyang Technological University

Integrated RTD Sensors for Maintaining Thermal Uniformity During TCB Process
Salwa Ben Jemaa - University de Sherbrooke
Julien Sylvestre - University de Sherbrooke
Pascale Gagnon - IBM Canada, Ltd.

Wireless Transfer of Power and Data via a Single Resonant Inductive Link
Lih-Tyng Hwang - National Sun Yat-Sen University
Yi-Chen Hsieh - National Sun Yat-Sen University
Chin-Wei Chan - National Sun Yat-Sen University
I-Fang Lo - National Sun Yat-Sen University
Heri Suryoatmojo - National Sun Yat-Sen University
Shiang-Hwua Yu - National Sun Yat-Sen University

Adaptive Patterning of Optical and Electrical Fan-Out for Photonic Chip Packaging
Ahmed Elmogi - Ghent University
Andres Desmet - Ghent University
Jeroen Missinne - Ghent University
Hannes Ramon - Ghent University
Joris Lambrecht - Ghent University
Peter De Heyn - IMEC
Marianna Pantouvaki - IMEC
Joris Van Campenhout - IMEC
Johan Bauwelinck - Ghent University
Geert Van Steenberge - Ghent University

Low Surface Reflectance at Near Infrared Wavelength Thermoplastic Optical Lens Without AR Coating
Sho Yakabe - Sumitomo Electric Industries, Ltd.
Takuro Watanabe - Sumitomo Electric Industries, Ltd.
Takayuki Shimazu - Sumitomo Electric Industries, Ltd.
Ryohei Hokari - National Institute of Advanced Industrial Science and Technology
Kazuma Kurihara - National Institute of Advanced Industrial Science and Technology

A Novel Design of a Bandwidth Enhanced Dual-Band Impedance Matching Network with Coupled Line Wave Slowing
Deepayan Banerjee - Indraprastha Institute of Information Technology, Delhi
Antra Saxena - Indraprastha Institute of Information Technology, Delhi
Mohammad Hashmi - Nazarbayev University

Effects of Electromigration on Microstructural Evolution and Mechanical Properties of Preferential Growth Intermetallic Compound Interconnects for 3D Packaging
Mingliang Huang - Dalian University of Technology
Lin Zou - Dalian University of Technology

Telemetry for Implantable Biosensors
Ryan Green - Virginia Commonwealth University
Erdem Topsakal - Virginia Commonwealth University

Ultra-Thin QFN-Like 3D Package With 3D Integrated Passive Devices
Ayad Ghannam - 3DiS Technologies
Niek van Haare - Besi NL
Julian Bravin - EV Group
Elisabeth Brandl - EV Group
Birgit Brandst├Ątter - Besi AT
Hannes Kingler - Besi AT
Benedikt Auer - Besi AT
Philippe Meunier - NXP Semiconductors
Sebastiaan Kersjes - Besi NL

Low-Cost Non-TSV Based 3D Packaging Using Glass Panel Embedding (GPE) for Power-Efficient, High-Bandwidth Heterogeneous Integration
Siddharth Ravichandran - Georgia Institute of Technology
Shuhei Yamada - Murata Manufacturing Co., Ltd.
Fuhan Liu - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Mohanalingam Kathaperumal - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

Polylithic Integration of 2.5D and 3D Chiplets Using Interconnect Stitching
Paul Jo - Georgia Institute of Technology
Ting Zheng - Georgia Institute of Technology
Muhannad Bakir - Georgia Institute of Technology

Characterization of the Current Mechanisms and Improved Leakage Current in Silver Doped Barium Stronium Titanate
Todd Schumann - University of Florida
Kyoung-Tae Kim - University of Florida
Sheng-Po Fang - University of Florida
Yong-Kyu Yoon - University of Florida

High-Temperature Aging Effects in SAC and SAC+X Lead-Free Solders
Mohmmad Alam - Auburn University
KM Rafidh Hassan - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University