Technical Program

Wednesday, May 29, 2019

Session 37: Interactive Presentations 1
9:00 AM - 11:00 AM
Committee: Interactive Presentations

Session Co-Chairs:

Nam Pham
IBM Corporation
T +1-512-286-8011
npham@us.ibm.com
Pavel Roy Paladhi
IBM Corporation
T +1-512-286-9677
Pavel.Roy.Paladhi@ibm.com

Papers:

Comprehensive Solution for Micro Bump Coplanarity Control
Chun-Chen Liu - Taiwan Semiconductor Manufacturing Company Ltd.
Max Chen - Taiwan Semiconductor Manufacturing Company Ltd.
Ann Hsu - Taiwan Semiconductor Manufacturing Company Ltd.
Rung-De Wang - Taiwan Semiconductor Manufacturing Company Ltd.
Bin-En Ho - Taiwan Semiconductor Manufacturing Company Ltd.
Chin-Yu Ku - Taiwan Semiconductor Manufacturing Company Ltd.
Kirin Wang - Taiwan Semiconductor Manufacturing Company Ltd.
Calvin Lu - Taiwan Semiconductor Manufacturing Company Ltd.
K.C. Liu - Taiwan Semiconductor Manufacturing Company Ltd.
De-Dui Liao - Taiwan Semiconductor Manufacturing Company Ltd.

Structural Enhancement for a CMOS-MEMS Microphone Under Thermal Loading by Taguchi Method
Chun-Lin Lu - National Tsing Hua University
Meng-Kao Yeh - National Tsing Hua University

A Methodology to Correct In-Fixture Measurement of Impedance by a Machine Learning Model
Bo-Siang Fang - Siliconware Precision Industries Co., Ltd.
Cha-Chu Lai - Siliconware Precision Industries Co., Ltd.
Ying-Wei Lu - Siliconware Precision Industries Co., Ltd.
Kuan-Ta Chen - Siliconware Precision Industries Co., Ltd.
Don-Son Jiang - Siliconware Precision Industries Co., Ltd.
Mike Tsai - Siliconware Precision Industries Co., Ltd.

Material and Structure Design Optimization for Panel-Level Fan-Out Packaging
Dao-Long Chen - Advanced Semiconductor Engineering Inc.
Ian Hu - Advanced Semiconductor Engineering Inc.
Meng-Kai Shih - Advanced Semiconductor Engineering Inc.
David Tarng - Advanced Semiconductor Engineering Inc.
Chih-Pin Hung - Advanced Semiconductor Engineering Inc.

A High Entropy Alloy as Very Low Melting Point Solder for Advanced Electronic Packaging
Li Pu - Beijing Institute of Technology
Quanfeng He - City University of Hong Kong
Yong Yang - City University of Hong Kong
King-Ning Tu - University of California, Los Angeles
Xiuchen Zhao - Beijing Institute of Technology
Zhuangzhuang Hou - Beijing Institute of Technology
Yingxia Liu - Beijing Institute of Technology

A Versatile Fan-Out Infrastructure Based on Die-Stencil Substrate Promoted by an Advanced Multifunctional Temporary Bonding Material
Xiao Liu - Brewer Science, Inc.
Baron Huang - Brewer Science, Inc.
Hong Zhang - Brewer Science, Inc.
Lisa Kirchner - Brewer Science, Inc.
Rama Puligadda - Brewer Science, Inc.
Tony Flaim - Brewer Science, Inc.

Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnections
H. T. Hung - National Taiwan University
S. Yang - National Taiwan University
I A. Weng - National Taiwan University
Y. H. Chen - Unimicron Technology Corporation
C. R. Kao - National Taiwan University

3D Integration of CMOS-Compatible Surface Electrode Ion Trap and Silicon Photonics for Scalable Quantum Computing
Jing Tao - Nanyang Technological University
Yu Dian Lim - Nanyang Technological University
Hong Yu Li - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Nam Piau Chew - Nanyang Technological University
Anak Agung Alit Apriyana - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Lin Bu - Institute of Microelectronics, Agency for Science, Technology and Research A*STAR
Peng Zhao - Nanyang Technological University
Luca Guidoni - University Paris Diderot
Chuan Seng Tan - Nanyang Technological University

RTD Sensor Based Approach for Maintaining Thermal Uniformity During TCB Process
Salwa Ben Jemaa - University of Sherbrooke
Julien Sylvestre - University of Sherbrooke
Pascale Gagnon - IBM Canada, Ltd.

Fully-Filled, Highly-Reliable Fine-Pitch Interposers With TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging
M Mariappan - Global INTegration Initiative
T Fukushima - Global INTegration Initiative
K Mori - Global INTegration Initiative
A Nakamura - Global INTegration Initiative
Y Lee - Global INTegration Initiative
M Motoyoshi - Global INTegration Initiative
J.C Bea - Global INTegration Initiative
S Watariguchi - Meltex Inc.,
M Koyanagi - Global INTegration Initiative

Wireless Transfer of Power and Data via a Single Resonant Inductive Link
Yi-Chen Hsieh - National Sun Yat-Sen University
Lih-Tyng Hwang - National Sun Yat-Sen University
Shiang-Hwua Yu - National Sun Yat-Sen University

Adaptive Patterning of Optical and Electrical Fan-Out for Photonic Chip Packaging
Ahmed Elmogi - Ghent University
Andres Desmet - Ghent University
Jeroen Missinne - Ghent University
Hannes Ramon - Ghent University
Joris Lambrecht - Ghent University
Peter De Heyn - IMEC
Marianna Pantouvaki - IMEC
Joris Van Campenhout - IMEC
Johan Bauwelinck - Ghent University
Geert Van Steenberge - Ghent University

Characterization of Fine-Pitch Hybrid Bonding Pads Using Electrical Misalignment Test Vehicles
Imed Jani - CEA-LETI
Didier Lattard - CEA-LETI
Pascal Vivet - CEA-LETI
Edith Beigné - CEA-LETI
Lucile Arnaud - CEA-LETI
Alexis Farcy - STMicroelectronics
Joris Jourdan - STMicroelectronics
Yann Henrion - STMicroelectronics
Emilie Deloffre - STMicroelectronics
Haim Bilgem - STMicroelectronics

3D Printed Interposer Layer for High-Density Packaging of IoT Devices
Saikat Mondal - Michigan State University
Mohd. Ifwat Mohd. Ghazali - Michigan State University
Kanishka Wijewardena - Michigan State University
Deepak Kumar - Michigan State University
Premjeet Chahal - Michigan State University

Moisture Dependent Mechanical Behavior of Underfill Encapsulants
Promod Chowdhury - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

Effects of Electromigration on Microstructural Evolution and Mechanical Properties of Preferred Orientation IMC Interconnects for 3D Packaging
Mingliang Huang - Dalian University of Technology
Lin Zou - Dalian University of Technology

Telemetry for Implantable Biosensors
Ryan Green - Virginia Commonwealth University
Erdem Topsakal - Virginia Commonwealth University

Low-Temperature Cu-Cu Bonding Using Nano-Cu Paste Sintering in Pt-Catalyzed Formic Acid Vapor
Fengwen Mu - The University of Tokyo
Hui Ren - Tsinghua University
Lei Liu - Tsinghua University
Yinghui Wang - Institute of Microelectronics
Guisheng Zou - Tsinghua University
Tadatomo Suga - The University of Tokyo

Ultra-Thin QFN-Like 3D Package With 3D Integrated Passive Devices
Ayad GHANNAM - 3DiS Technologies
Niek van HAARE - Besi
Julian BRAVIN - EV Group
Birgit BRANDSTÄTTER - Besi
Philippe MEUNIER - NXP Semiconductors
Sebastiaan KERSJES - Besi

3D Glass Panel Embedding (GPE) for Superior Bandwidth, Power-Efficiency and Cost than Current Approaches
Siddharth Ravichandran - Georgia Institute of Technology
Shuhei Yamada - Murata Manufacturing Co., Ltd.
Fuhan Liu - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Mohanalingam Kathaperumal - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

Polylithic Integration of Heterogeneous Dice
Paul Jo - Georgia Institute of Technology
Ting Zheng - Georgia Institute of Technology
Muhannad Bakir - Georgia Institute of Technology

Highly Energy Efficient Low Leakage Current RF Tunable Capacitors Using Silver Doped Barium Strontium Titanate
Todd Schumann - University of Florida
Kyoung-Tae Kim - University of Florida
Sheng-Po Fang - University of Florida
Yong-Kyu Yoon - University of Florida

High-Temperature Aging Effects in SAC and SAC+X Lead-Free Solders
Mohmmad Alam - Auburn University
KM Rafidh Hassan - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

New Developments of Copper Plating Technology for Embedded Power Chip Packages
Yung-Da Chiu - Advanced Semiconductor Engineering Inc.
Shiu-Chih Wang - Advanced Semiconductor Engineering Inc.
David Tarng - Advanced Semiconductor Engineering Inc.
CP Hung - Advanced Semiconductor Engineering Inc.