Technical Program

Friday, May 31, 2019

Session 36: RF & Power Components and Modules
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Yong-Kyu Yoon
University of Florida
T +1-352-392-5985
ykyoon@ece.ufl.edu
Craig Gaw
NXP Semiconductor
T +1-480-814-5142
c.a.gaw@ieee.org

Papers:

1. 1:30 PM - Multilayer Trench Decoupling Capacitor Using Stacked Layers of BST and LNO
Todd Schumann - University of Florida
Sheng-Po Fang - University of Florida
Jongmin Yook - Korea Electronics Technology Institute
Dongsu Kim - Korea Electronics Technology Institute
Yong-Kyu Yoon - University of Florida

2. 1:55 PM - System Co-Design of a High Current (40A) Synchronous Step-Down Converter in an Innovative Multi-Chip Module (MCM) in QFN-Type Packaging Technology
Todd Harrison - Texas Instruments, Inc.
Jie Chen - Texas Instruments, Inc.
Rajen Murugan - Texas Instruments, Inc.

3. 2:20 PM - Integrating Solid-State Protection With a RF-MEMS Switch for Achieving ESD Robustness
Srivatsan Parthasarathy - Analog Devices, Inc.
Padraig Fitzgerald - Analog Devices, Inc.
Javier Salcedo - Analog Devices, Inc.
Ray Goggin - Analog Devices, Inc.
Jean-Jacques Hajjar - Analog Devices, Inc.

4. 3:30 PM - A “Zero Height” Small Size Low Cost RF Interconnect Substrate Technology For RF Front Ends For M.2 Modules And Sip
Sidharth Dalmia - Intel Corporation
Kirthika Nahalingam - Intel Corporation
Swathi Vijayakumar - Intel Corporation
Pouya Talebbeydokhti - Intel Corporation

6. 4:20 PM - RF Inductors Integrated in Organic Packaging
Denis Mercier - CEA-LETI
Jean-Philippe Michel - CEA-LETI
Christine Raynaud - CEA-LETI
Christophe Billard - CEA-LETI

7. 4:45 PM - Optimal Package Capacitor Hook Up Strategies for Power Delivery Network
Abinash Roy - Qualcomm Technologies, Inc.
Aniket Patil - Qualcomm Technologies, Inc.