Technical Program

Friday, June 01, 2018

Session 36: RF & Power Components and Modules
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Yong-Kyu Yoon
University of Florida
T +1-352-392-5985
Craig Gaw
NXP Semiconductor
T +1-480-814-5142


1. 1:30 PM - Multilayer trench decoupling capacitor using stacked layers of BST and LNO
Todd Schumann - University of Florida
Sheng-Po Fang - University of Florida
Jongmin Yook - Korea Electronics Technology Institute
Dongsu Kim - Korea Electronics Technology Institute
Yong-Kyu Yoon - University of Florida

2. 1:55 PM - System Co-Design of a High Current (40A) Synchronous Step-Down Converter in an Innovative Multi-Chip Module (MCM) in QFN-type Packaging Technology
Todd Harrison - Texas Instruments, Inc.
Jie Chen - Texas Instruments, Inc
Rajen Murugan - Texas Instruments, Inc

3. 2:20 PM - Integrating Solid State Protection with a RF-MEMS Switch for Achieving ESD Robustness
srivatsan parthasarathy - analog devices,inc

4. 3:30 PM - A “Zero Height” Small Size Low Cost RF Interconnect Substrate Technology For RF Front Ends For M.2 Modules And Sip
Sidharth Dalmia - Intel Corporation
Kirthika Nahalingam - Intel Corporation
Swathi Vijayakumar - Intel Corporation
Pouya Talebbeydokhti - Intel Corporation

5. 3:55 PM - A Novel Design of a Bandwidth Enhanced Dual-Band Impedance Matching Network With Coupled Line Wave Slowing
Deepayan Banerjee - University of Calgary, Canada
Antra Saxena - University of Calgary, Canada
Mohammad Hashmi - Nazarbayev University
Mohamed Helaoui - University of Calgary, Canada
Fadhel Ghannouchi - University of Calgary, Canada

6. 4:20 PM - RF inductors integrated in organic packaging
Denis Mercier - CEA-LETI
Jean-Philippe Michel - CEA-LETI
Christine Raynaud - CEA-LETI
Christophe Billard - CEA-LETI

7. 4:45 PM - Optimal Package Capacitor Hook up Strategies for Power Delivery Network
ABINASH ROY - Qualcomm Technologies, Inc.
ANIKET PATIL - Qualcomm Technologies, Inc.