Technical Program

Friday, June 02, 2017

Session 36: Advances in Signal and Power Integrity
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components
Room: Southern Hemisphere V

Session Co-Chairs:

Zhaoqing Chen
IBM Corporation
T +1-845-435-5595
zhaoqing@us.ibm.com
Amit P. Agrawal
Keyssa Inc.
T +1-408-666-8452
Ap_agrawal@yahoo.com

Papers:

1. 1:30 PM - Active and Passive Techniques for Noise Sensitive Circuits in Integrated Voltage Regulator Based Microprocessor Power Delivery
Amit Jain - Intel Corporation
Sameer Shekhar - Intel Corporation
Yan Z. Li - Intel Corporation

2. 1:55 PM - High Voltage Capacitors for Next-Generation Power Modules in Electric Vehicles
Robert Spurney - Georgia Institute of Technology
Himani Sharma - Georgia Institute of Technology
P. M. Raj - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Naomi Lollis - AVX Corporation

3. 2:20 PM - Package and Printed Circuit Board Design of a 19.2 Gb/s Data Link for High-Performance Computing
Sungjun Chun - IBM Corporation
Jose Hejase - IBM Corporation
Junyan Tang - IBM Corporation
Jean Audet - IBM Corporation
Dale Becker - IBM Corporation
Daniel Dreps - IBM Corporation
Glen Wiedemeier - IBM Corporation
Megan Nguyen - IBM Corporation
Lloyd Walls - IBM Corporation
Francesco Preda - IBM Corporation
Daniel Douriet - IBM Corporation

4. 3:30 PM - Signal and Power Integrity Analysis of High-Speed Links with Silicon Interposer
Wendemagegnehu Beyene - Rambus, Inc.
Nitin Juneja - Rambus, Inc.
Yeon-Chang Hahm - Rambus, Inc.
Ravi Kollipara - Rambus, Inc.
Joohee Kim - Rambus, Inc.

5. 3:55 PM - Novel Parallel Resonance Peak Measurement and Lossy Transmission Line Modeling of 2-T and 3-T MLCC capacitors for PDN Application
Larry Smith - Qualcomm Technologies, Inc.
Javid Mohamed - Qualcomm Technologies, Inc.
Jaemin Shin - Qualcomm Technologies, Inc.
Tim Michalka - Qualcomm Technologies, Inc.

6. 4:20 PM - Eye-Diagram Estimation Methods for Voltage- and Probability-Dependent PAM-4 Signal on Stacked Through-Silicon Vias
Junyong Park - Korea Advanced Institute of Science & Technology
Jonghoon J. Kim - Korea Advanced Institute of Science & Technology
Heegon Kim Kim - MST
Sumin Choi - Korea Advanced Institute of Science & Technology
Joungho Kim - Korea Advanced Institute of Science & Technology
Youngwoo Kim - Korea Advanced Institute of Science & Technology

7. 4:45 PM - Signal Integrity Modelling in Inhomogeneous Waveguide/PCB of Arbitrary Shape Using Broadband Green’s Function
Kung-Hau Ding - Air Force Research Laboratory
Tien-Hao Liao - University of Michigan
Leung Tsang - University of Michigan