Technical Program

Friday, June 02, 2017

Session 34: Waveguide Devices and Chip-to-Fiber Packaging
1:30 PM - 5:10 PM
Committee: Optoelectronics
Room: Americas Seminar

Session Co-Chairs:

Ping Zhou
LDX Optronics, Inc.
T +1-865-981-8822
Hiren Thacker

T +1-619-940-7803


1. 1:30 PM - Design, Fabrication and Connectorization of High-Performance Multimode Glass Waveguides for Board-Level Optical Interconnects
Lars Brusberg - Corning, Inc.
Davide Fortusini - Corning, Inc.
Henning Schröder - Fraunhofer IZM
Wei Jiang - Corning, Inc.
Aramais Zakharian - Corning, Inc.
Sergey Kuchinsky - Corning, Inc.
Christian Fiebig - Corning, Inc.
Shenping Li - Corning, Inc.
Andrey Kobyakov - Corning, Inc.
Alan Evans - Corning, Inc.

2. 1:55 PM - Axially Tapered Circular Core Polymer Optical Waveguides Enabling Highly Efficient Light Coupling
Takaaki Ishigure - Keio University
Kenji Katori - Keio University
Hoshihiko Toda - Keio University
Kazuki Yasuhara - Keio University

3. 2:20 PM - First Demonstration of Single-Mode Polymer Optical Waveguides with Circular Cores for Fiber-to-Waveguide Coupling in 3D Glass Photonic Interposers
Rui Zhang - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

4. 3:30 PM - 3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration
Sebastian Lüngen - Technical University Dresden
Sujay Charania - Technical University Dresden
Tobias Tiedje - Technical University Dresden
Krzystof Nieweglowski - Technical University Dresden
Sebastian Killge - Technical University Dresden
Lukas Lorenz - Technical University Dresden
Johann W. Bartha - Technical University Dresden
Karlheinz Bock - Technical University Dresden

5. 3:55 PM - Position Dependence of Coupling Efficiency of Grating Coupler in Waveguide Cavity
Shogo Ura - Kyoto Institute of Technology
Kazuki Mori - Kyoto Institute of Technology
Ryo Tsujimoto - Kyoto Institute of Technology
Junichi Inoue - Kyoto Institute of Technology
Kenji Kintaka - National Institute of Advanced Industrial Science & Technology

6. 4:20 PM - Efficient, Easy-to-Use, Planar Fiber-to-Chip Coupling Process with Angle-Polished Fibers
Djorn Karnick - Karlsruhe Institute of Technology (KIT)
Nils Bauditsch - Karlsruhe Institute of Technology (KIT)
Lars Eisenblätter - Karlsruhe Institute of Technology (KIT)
Thomas Kühner - Karlsruhe Institute of Technology (KIT)
Marc Schneider - Karlsruhe Institute of Technology (KIT)
Marc Weber - Karlsruhe Institute of Technology (KIT)

7. 4:45 PM - Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components
Nicolas Boyer - IBM Corporation
Alexander Janta-Polczynski - IBM Corporation
Jean-Francois Morissette - Université de Sherbrooke
Stephan Martel - IBM Corporation
Swetha Kamlapurkar - IBM Corporation
Sebastian Engelmann - IBM Corporation
Paul Fortier - IBM Corporation
Tymon Barwicz - IBM Corporation
Ted Lichoulas - AFL Telecommunications