Technical Program

Friday, June 01, 2018

Session 34: Emerging Materials and Processing
1:30 PM - 5:10 PM
Committee: Materials & Processing

Session Co-Chairs:

Ziyin Lin
Intel Corporation
T
ziyin.lin@intel.com
Dwayne Shirley
Inphi
T
shirley@ieee.org

Papers:

1. 1:30 PM - Flexible Graphene-Glass Fiber Composite Film with Ultrahigh Thermal Conductivity and Mechanical Strength as Highly Efficient Thermal Interface Materials
Xiaoliang Zeng - Shenzhen Institutes of Advanced Technology, Chinese Academy
Linlin Ren - Shenzhen Institutes of Advanced Technology, Chinese Academy
Rong Sun - Shenzhen Institutes of Advanced Technology, Chinese Academy
Jianbin Xu - Department of Electronics Engineering, The Chinese Universit
Ching-Ping Wong - School of Mechanical Engineering, Georgia Institute of Techn

2. 1:55 PM - Highly Thermal Conductive and Electrically Insulated Graphene Based Thermal Interface Material with Long-term Reliability
Nan Wang - SHT Smart High Tech AB
Shujing Chen - Shanghai University
Lilei Ye - SHT Smart High Tech AB
Johan Liu - Chalmers University of Technology

3. 2:20 PM - Design of mixed spherical and platelet h-BN particles filled polymer-based thermal interface material for power electronics with enhanced thermal conductivity by finite element modeling and experimental characterization
Han Jiang - Loughborough University
Han Zhou - Loughborough University
Stuart Robertson - Loughborough University
Zhaoxia Zhou - Loughborough University
Liguo Zhao - Loughborough University
Changqing Liu - Loughborough University

4. 3:30 PM - Wafer level integration of thin silicon bare dies within flexible label
Jean-Charles Souriau - CEA-LETI
Ahmad Itawi La√ętitia Castagn√©

5. 3:55 PM - Laser Sintering of Aerosol Jet Printed Conductive Interconnects on Paper Substrates
Mohammed Alhendi - Binghamton University
Darshana Weerawarne - Binghamton University
Jack Lombardi - Binghamton University
Azar Alizadeh - General Electric
Mark Poliks - Binghamton University

6. 4:20 PM - In-Situ Investigation of Organic Additive Interactions in Copper Electroplating Solutions with Surface Enhanced Raman Spectroscopy (SERS)
Nithin Nedumthakady - Georgia Institute of Technology
Bartlet DeProspo - Georgia Institute of Technology
Himani Sharma - Georgia Institute of Technology
Rahul Manepalli - Intel Corporation
Sashi Kandanur - Intel Corporation
Rao Tummala - Georgia Institute of Technology

7. 4:45 PM - C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process
Chien-Hsien Kuo - Taiwan Semiconductor Manufacturing Company
Rolance Yang - Taiwan Semiconductor Manufacturing Company
Chien-Chih Kuo - Taiwan Semiconductor Manufacturing Company
Hon-Lin Huang - Taiwan Semiconductor Manufacturing Company
Harry Ku - Taiwan Semiconductor Manufacturing Company
Kirin Wang - Taiwan Semiconductor Manufacturing Company