Technical Program

Friday, June 02, 2017

Session 33: Advanced Bonding and Soldering Technology
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Southern Hemisphere III

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Qianwen Chen
IBM Corporation
T +1-914-945-1612
chenq@us.ibm.com

Papers:

1. 1:30 PM - Novel Large-Area Attachment for High-Temperature Power Electronics Module Application
Chunlei Liu - ABB Switzerland Ltd.
Fabian Mohn - ABB Switzerland Ltd.
Juergen Schuderer - ABB Switzerland Ltd.
Daniele Torresin - ABB Switzerland Ltd.

2. 1:55 PM - Bismuth-Based Transient Liquid Phase (TLP) Bonding as High-Temperature Lead-Free Solder Alternatives
Junghyun Cho - Binghamton University
Roozbeh Sheikhi - Binghamton University
Sandeep Mallampati - Binghamton University
Liang Yin - General Electric Co.
David Shaddock - General Electric Co.

3. 2:20 PM - Silver Sinter Paste for SiC Bonding with Improved Mechanical Properties
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG
Ly May Chew - Heraeus Deutschland GmbH & Co. KG

4. 3:30 PM - Diffusion Barrier Effect of Ni-W-P and Ni-Fe UBMs during High Temperature Storage
Li-Yin Gao - Chinese Academy of Sciences
Li Liu - Loughborough University
Zhi-Quan Liu - Chinese Academy of Sciences
Jing Wang - Loughborough University
Zhao-Xia Zhou - Loughborough University
Chang-Qing Liu - Loughborough University

5. 3:55 PM - Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder
Ling Xie - Institute of Microelectronics, A*STAR
Sunil Wickramanayaka - Institute of Microelectronics, A*STAR
Vasarla Nagendra Sekhar - Institute of Microelectronics, A*STAR
Daniel Ismael Cereno - Institute of Microelectronics, A*STAR

6. 4:20 PM - Fabrication and Characterization of Nanoporous Metallic Interconnects Using Electrospun Nanofiber Template and Electrochemical Deposition
Sheng-Po Fang - University of Florida
Seahee Hwangbo - University of Florida
Hyowon An - University of Florida
Yong-Kyu Yoon - University of Florida

7. 4:45 PM - Ga Liquid Metal Embrittlement for Fine Pitch Interconnect Rework
Elodie Nguena - University of Sherbrooke
David Danovitch - University of Sherbrooke
Malak Kanso - University of Sherbrooke
Richard Langlois - IBM Corporation