Technical Program

Friday, June 01, 2018

Session 33: Fan-Out, Flip Chip, and WLCSP
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Ning Ye
Western Digital
T +1-408-801-1278
ning.ye@wdc.com
Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933
weiwng@qti.qualcomm.com

Papers:

1. 1:30 PM - Effect of Time-dependent Bulk Modulus on Reliability Assessment of Automotive Electronic Control Unit
Hyun Seop Lee - University of Maryland
Bongtae Han - University of Maryland

2. 1:55 PM - Failure Life Prediction of Wafer Level Packaging using DoS with AI Technology
P.H. Chou - National Tsing Hua University
X.Y. Hsiao - national Tsing Hua U.
K. N. Chiang - National Tsing Hua University

3. 2:20 PM - Thermal Cycling Simulation and Sensitivity Analysis of Wafer Level Chip Scale Package with Integration of Metal-Insulator-Metal Capacitors
Yong Liu - ON SEMICONDUCTOR
Yi Zhou - Georgia Institute of Technology
Bill Chen - ON SEMICONDUCTOR
Suresh K. Sitaraman - Georgia Institute of Technology

4. 3:30 PM - A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Mario Gschwandl - Polymer Competence Center Leoben GmbH
Peter Fuchs - Polymer Competence Center Leoben GmbH
Thomas Antretter - Montanuniversitaet Leoben
Martin Pfost - TU Dortmund
Tao Qi - AT & S Austria Technologie & Systemtechnik Aktiengesellschaf
Thomas Krivec - AT & S Austria Technologie & Systemtechnik Aktiengesellschaf
Angelika Schingale - Continental Automotive GmbH

5. 3:55 PM - Measurement and Characterization of a Constituent Material Effect on Thermal Expansion Coefficient of Thin Package Substrates
Ji Hyuk Lim - Samsung Electro-Mechanics Company, Limited
Seung Wan Woo Jong Yun Kim

6. 4:20 PM - Wafer Level Warpage Modelling and Validation for FOWLP Considering Effects of Viscoelastic Material Properties under Process Loadings
zhaohui chen - ime
xiaowu zhang - ime

7. 4:45 PM - Board Level Drop Impact Modeling and Validation in Ultra-thin Package
Shu-Shen Yeh - Taiwan Semiconductor Manufacturing Company
Po-Yao Lin - Taiwan Semiconductor Manufacturing Company
Ming-Chih Yew - Taiwan Semiconductor Manufacturing Company
Wen-Yi Lin - Taiwan Semiconductor Manufacturing Company
K. C. Lee - Taiwan Semiconductor Manufacturing Company
C. C. Yang - Taiwan Semiconductor Manufacturing Company
J. H. Wang - Taiwan Semiconductor Manufacturing Company
P. C. Lai - Taiwan Semiconductor Manufacturing Company
Chia-Kuei Hsu - Taiwan Semiconductor Manufacturing Company
Shin-Puu Jeng - Taiwan Semiconductor Manufacturing Company