Technical Program

Friday, May 31, 2019

Session 33: Fan-Out, Flip Chip, and WLCSP
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Ning Ye
Western Digital
T +1-408-801-1278
ning.ye@wdc.com
Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933
wwang@g.clemson.edu

Papers: