Technical Program

Friday, June 02, 2017

Session 33: Advanced Bonding and Soldering Technology
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Southern Hemisphere III

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Qianwen Chen
IBM Research
T +1-914-945-1612
chenq@us.ibm.com

Papers: