Technical Program

Friday, June 02, 2017

Session 32: Reliability Challenges in 2.5D/3D Interconnect
1:30 PM - 5:10 PM
Committee: Interconnections
joint with Applied Reliability
Room: Southern Hemisphere I

Session Co-Chairs:

Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
Dongji Xie
NVIDIA Corporation
T +1-408-486-8630


1. 1:30 PM - Reliability Challenges in 2.5D and 3D IC Integration
Li Li - Cisco Systems
Paul Ton - Cisco Systems
Mohan Nagar - Cisco Systems
Pierre Chia - Cisco Systems

2. 1:55 PM - High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Coppe-Metallized Through-Package-Vias (TPVs) in Ultra-Thin Glass Substrates
Sukhadha Viswanathan - Georgia Institute of Technology
Timothy B. Huang - Georgia Institute of Technology
Tomonori Ogawa - Asahi Glass
Kaya Demir - Georgia Institute of Technology
P Markondeya Raj - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Tummala Rao - Georgia Institute of Technology

3. 2:20 PM - Reliability Evaluations on 3D ID Package Beyond JEDEC
Raghunandan Chaware - Xilinx
Laurene Yip - Xilinx
Inderjit Singh - Xilinx
Kenny Ng - Xilinx
Michael Shen Antai Xu - Xilinx

4. 3:30 PM - Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE
Hisashi Kino - Tohoku University
Takafumi Fukushima - Tohoku University
Tetsu Tanaka - Tohoku University

5. 3:55 PM - Electrical Characterization of CMP-Less Via-Last TSV under Reliability Stress Conditions
Mingbin Yu - IME, A*STAR

6. 4:20 PM - A Novel Failure Analysis Technique for Semiconductor Packaging by Xenon Difluoride Gas
Hongqing Zhang Zhang - IBM
Frank Pompeo - IBM
Tom Wassick - IBM

7. 4:45 PM - Alternative 3D Small Form Factor Methodology of System in Package for IoT and Wearable Devices Application
Mike Tsai - SPIL
Albert Lan - SPIL
Chi Liang Shih - SPIL
Terence Huang - SPIL
Ryan Chiu - SPIL
S. L. Chung - SPIL
J. Y. Chen - SPIL
Frank Chu - SPIL
Cheng Kai Chang - SPIL
Daniel Chen - SPIL
Nicholas Kao - SPIL