Technical Program

Friday, June 02, 2017

Session 32: Reliability Challenges in 2.5D/3D Interconnect
1:30 PM - 5:10 PM
Committee: Interconnections
joint with Applied Reliability
Room: Southern Hemisphere I

Session Co-Chairs:

Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
nathan.lower@rockwellcollins.com
Dongji Xie
NVIDIA Corporation
T +1-408-486-8630
dongjix@nvidia.com

Papers:

1. 1:30 PM - Reliability Challenges in 2.5D and 3D IC Integration
Li Li - Cisco Systems, Inc.
Paul Ton - Cisco Systems, Inc.
Mohan Nagar - Cisco Systems, Inc.
Pierre Chia - Cisco Systems, Inc.

2. 1:55 PM - High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Coppe-Metallized Through-Package-Vias (TPVs) in Ultra-Thin Glass Substrates
Sukhadha Viswanathan - Georgia Institute of Technology
Timothy B. Huang - Georgia Institute of Technology
Tomonori Ogawa - Asahi Glass Co., Ltd.
Kaya Demir - Georgia Institute of Technology
P Markondeya Raj - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Tummala Rao - Georgia Institute of Technology

3. 2:20 PM - Reliability Evaluations on 3D ID Package Beyond JEDEC
Raghunandan Chaware - Xilinx, Inc.
Laurene Yip - Xilinx, Inc.
Inderjit Singh - Xilinx, Inc.
Kenny Ng - Xilinx, Inc.
Michael Shen - Xilinx, Inc.
Antai Xu - Xilinx, Inc.

4. 3:30 PM - Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE
Hisashi Kino - Tohoku University
Takafumi Fukushima - Tohoku University
Tetsu Tanaka - Tohoku University

5. 3:55 PM - Electrical Characterization of CMP-Less Via-Last TSV under Reliability Stress Conditions
Mingbin Yu - Institute of Microelectronics, A*STAR

6. 4:20 PM - A Novel Failure Analysis Technique for Semiconductor Packaging by Xenon Difluoride Gas
Hongqing Zhang Zhang - IBM Corporation
Frank Pompeo - IBM Corporation
Tom Wassick - IBM Corporation

7. 4:45 PM - Alternative 3D Small Form Factor Methodology of System in Package for IoT and Wearable Devices Application
Mike Tsai - Siliconware Precision Industries Co., Ltd.
Albert Lan - Siliconware Precision Industries Co., Ltd.
Chi Liang Shih - Siliconware Precision Industries Co., Ltd.
Terence Huang - Siliconware Precision Industries Co., Ltd.
Ryan Chiu - Siliconware Precision Industries Co., Ltd.
S. L. Chung - Siliconware Precision Industries Co., Ltd.
J. Y. Chen - Siliconware Precision Industries Co., Ltd.
Frank Chu - Siliconware Precision Industries Co., Ltd.
Cheng Kai Chang - Siliconware Precision Industries Co., Ltd.
Daniel Chen - Siliconware Precision Industries Co., Ltd.
Nicholas Kao - Siliconware Precision Industries Co., Ltd.