Technical Program

Friday, June 02, 2017

Session 32: Reliability Challenges in 2.5D/3D Interconnect
1:30 PM - 5:10 PM
Committee: Interconnections
joint with Applied Reliability
Room: Southern Hemisphere I

Session Co-Chairs:

Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
nathan.lower@rockwellcollins.com
Dongji Xie
NVIDIA Corporation
T +1-408-486-8630
dongjix@nvidia.com

Papers: