Technical Program

Friday, June 01, 2018

Session 32: Power and Panel Assembly
1:30 PM - 5:10 PM
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Habib Hichri
Suss Microtech Photonic Systems Inc.
T +1 951 817 3791
Habib.Hichri@suss.com
Shichun Qu
Intersil, a Renesas Company
T +1-408-546-3713
shichun.qu.uj@renesas.com

Papers:

1. 1:30 PM - An RDL-First Fan-out Panel Level Package for Heterogeneous Integration Applications
Yu-Min Lin - Industrial Technology Research Institute (ITRI)
Sheng-Tsai Wu - Industrial Technology Research Institute (ITRI)
Chun-Min Wang - Unimicron Technology Corporation
Chia-Hsin Lee - Brewer Science Taiwan/Brewer Science, Inc.
Ang-Ying Lin - Industrial Technology Research Institute (ITRI)
Shin-Yi Huang - Industrial Technology Research Institute (ITRI)
Tao-Chih Chang - Industrial Technology Research Institute (ITRI)
Puru Bruce Lin - Unimicron Technology Corporation
Cheng-Ta Ko - Unimicron Technology Corporation
Kuan-Neng Chen - National Chiao Tung University

2. 1:55 PM - High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Kai Zoschke - Fraunhofer IZM
Piotr Mackowiak - Fraunhofer IZM
Ha-Duong Ngo - Fraunhofer IZM
Christian Tschoban - Fraunhofer IZM
Carola Fritsche - Fraunhofer IZM
Kevin Kröhnert - Fraunhofer IZM
Thorsten Fischer - Fraunhofer IZM
Ivan Ndip - Fraunhofer IZM
Klaus-Dieter Lang - Technical University Berlin

3. 2:20 PM - New Developments of Copper Plating Technology for Embedded Power Chip Packages
Yung-Da Chiu - Advanced Semiconductor Engineering (ASE) Inc

4. 3:30 PM - High Yield Precision Transfer and Assembly of GaN µLEDs using Laser Assisted Micro Transfer Printing
Goutham Ezhilarasu - University of California, Los Angeles
Amir Hanna - University of California, Los Angeles
Ajit Paranjpe - Veeco Instruments, Inc.
Subramanian Iyer - University of California, Los Angeles

5. 3:55 PM - Integrated magnetic isolated power packaging
Chang-Yen Ko - Texas Instruments, Inc.

6. 4:20 PM - Large Panel Size Bonder with High Performance and High Accuracy
Hubert Selhofer - Besi Austria GmbH
Hugo Pristauz - Besi Austria GmbH
Andreas Mayr - Besi Austria GmbH

7. 4:45 PM - Advance Embedded Packaging For Power Discrete Device
Jiaren Huo - wuxi sky chip interconnention technology co.,ltd
Guanqiang song - wuxi sky chip interconnection technology co.,LTD
Juntao wang - wuxi sky chip interconnection technology co.,LTD