Technical Program

Friday, June 01, 2018

Session 31: Automotive and Power Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Young-Gon Kim
Integrated Device Technology, Inc.
T +1-408-360-1545
young.kim@idt.com
Kuo-Chung Yee
TSMC
T +886-3-5636688 Ext. 7222920/7223012
kcyee@tsmc.com

Papers:

1. 1:30 PM - Development of High Power and High Junction Temperature SiC Based Power Packages
Gongyue Tang - IME
Ching Wai Leong - IME
Teck Guan Lim - IME
Zhaohui Chen - IME
Yong Liang Ye - IME
Ravinder Pal Singh - IME
Lin Bu - IME
Boon Long Lau - IME
Tai Chong Chai - IME
Kazunori Yamamoto - IME
Xiaowu Zhang - IME

2. 1:55 PM - Development for Highly Heat Resistant Joint Materials on Exhaust Gas Sensor; SiC-FET-type NOx Sensor and SAW-type PM Sensor
Chiko Yorita - Hitachi, Ltd.
Nobuyuki Ushifusa - Hitachi, Ltd.
Yoshitaka Sasago - Hitachi, Ltd.
Atsushi Isobe - Hitachi, Ltd.
Shigenobu Komatsu - Hitachi, Ltd.
Takahiro Odaka - Hitachi, Ltd.
Kenji Okishiro - Hitachi Metals, Ltd.
Yuta SUGIYAMA - Hitachi Metals, Ltd.

3. 2:20 PM - Innovative Flip Chip Package Solutions for Automotive Applications
tom tang - Siliconware Precision Industries Co., Ltd.
David Ho - Siliconware Precision Industries Co., Ltd.
Mark Liao - Siliconware Precision Industries Co., Ltd.
Jensen Tsai - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.

4. 3:30 PM - Reliability of Laminated Bond Structure Using (Cu,Ni)/Sn TLP Bonding with Al Interlayer for High Temperature Power Electronics Packaging
Yanghe Liu - Toyota Motor Engineering & Manufacturing North America
Shailesh Joshi - Toyota Motor Engineering & Manufacturing North America

5. 3:55 PM - Silver sintering on organic substrates for the embedding of power semiconductor devices
Alexander Schiffmacher - University of Freiburg, IMTEK
Lorenz Litzenberger - University of Freiburg, IMTEK
Juergen Wilde - University of Freiburg, IMTEK
Till Huesgen - Hochschule Kempten, University of Applied Science

6. 4:20 PM - High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding
Kohei Tatsumi - Waseda University
Isamu Morisako - Waseda University
Tomonori Iizuka Nobuaki Sato - Mitsui High-tec Inc.
Koji Shimizu - Mitsui High-tec Inc.
Kazutoshi Ueda - Mitsui High-tec Inc.
Masayuki Hikita - Kyushu Institute of Technology
Rikiya Kamimura - Kitakyushu Foundation for the Advancement of Industry, Science and Technology
Kazuhiko Sugiura - Denso Corporation
Kazuhiro Tsuruta - Denso Corporation
Keiji Toda - Toyota Motor Corporation

7. 4:45 PM - Lead-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages
Byong Jin Kim - Amkor Technology, Inc.
DongSu Ryu - Amkor Technology, Inc.
Hyeong Il Jeon - Amkor Technology, Inc.
Weng Tuck Chim - Amkor Technology, Inc.
JinYoung Khim - Amkor Technology, Inc.
Muhammad Hadhari Hazellah - Amkor Technology, Inc.