Technical Program

Friday, May 31, 2019

Session 31: Automotive and Power Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Young-Gon Kim
Integrated Device Technology, Inc.
T +1-408-360-1545
young.kim@idt.com
Kuo-Chung Yee
Taiwan Semiconductor Manufacturing Corporation, Inc.
T +886-3-5636688 Ext. 7222920/7223012
kcyee@tsmc.com

Papers:

1. 1:30 PM - Development of High Power and High Junction Temperature SiC Based Power Packages
Gongyue Tang - Institute of Microelectronics A*STAR
Leong Ching Wai - Institute of Microelectronics A*STAR
Teck Guan Lim - Institute of Microelectronics A*STAR
Yong Liang Ye - Institute of Microelectronics A*STAR
Ravinder Pal Singh - Institute of Microelectronics A*STAR
Lin Bu - Institute of Microelectronics A*STAR
Boon Long Lau - Institute of Microelectronics A*STAR
Tai Chong Chai - Institute of Microelectronics A*STAR
Kazunori Yamamoto - Institute of Microelectronics A*STAR
Xiaowu Zhang - Institute of Microelectronics A*STAR
- Institute of Microelectronics A*STAR

2. 1:55 PM - New Developments of Copper Plating Technology for Embedded Power Chip Packages Challenges
Yung-Da Chiu - Advanced Semiconductor Engineering Inc.
Shiu-Chih Wang - Advanced Semiconductor Engineering Inc.
David Tarng - Advanced Semiconductor Engineering Inc.
An-Tai Wu - Advanced Semiconductor Engineering Inc.
Allenyl Chen - Advanced Semiconductor Engineering Inc.
Louis Chen - Advanced Semiconductor Engineering Inc.
Chi-Tsung Chiu - Advanced Semiconductor Engineering Inc.

3. 2:20 PM - Innovative Flip Chip Package Solutions for Automotive Applications
Tom Tang - Siliconware Precision Industries Co., Ltd.
Bo-Siang Fang - Siliconware Precision Industries Co., Ltd.
David Ho - Siliconware Precision Industries Co., Ltd.
B.H. Ma - Siliconware Precision Industries Co., Ltd.
Jensen Tsai - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.

4. 3:30 PM - Reliability of Laminated Bond Structure Using (Cu,Ni)/Sn TLP Bonding With Al Interlayer for High-Temperature Power Electronics Packaging
Yanghe Liu - Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh Joshi - Toyota Motor Engineering & Manufacturing North America, Inc.
Ercan M. Dede - Toyota Motor Engineering & Manufacturing North America, Inc.

5. 3:55 PM - Silver Sintering on Organic Substrates for the Embedding of Power Semiconductor Devices
Alexander Schiffmacher - University of Freiburg, IMTEK
Lorenz Litzenberger - University of Freiburg, IMTEK
Juergen Wilde - University of Freiburg, IMTEK
Till Huesgen - Kempten University of Applied Sciences
Vladimir Polezhaev - Kempten University of Applied Sciences

6. 4:20 PM - High-Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding
Kohei Tatsumi - Waseda University
Isamu Morisako - Waseda University
Keiko Wada - Waseda University
Minoru Fukuomori - Waseda University
Tomonori Iizuka - Waseda University
Nobuaki Sato - Mitsui High-tec, Inc.
Koji Shimizu - Mitsui High-tec, Inc.
Kazutoshi Ueda - Mitsui High-tec Inc.
Masayuki Hikita - Kyushu Institute of Technology
Rikiya Kamimura - Kitakyushu Foundation for the Advancement of Industry, Science and Technology
Naoki Kawanabe - Walts Co.,Ltd.

7. 4:45 PM - Pb-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages
Byong Jin Kim - Amkor Technology, Inc.
DongSu Ryu - Amkor Technology, Inc.
Hyeong Il Jeon - Amkor Technology, Inc.
Weng Tuck Chim - Amkor Technology, Inc.
JinYoung Khim - Amkor Technology, Inc.
Muhammad Hadhari Hazellah - Amkor Technology, Inc.