Technical Program

Friday, May 31, 2019

Session 31: Automotive and Power Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Young-Gon Kim
Integrated Device Technology, Inc.
T +1-408-360-1545
young.kim@idt.com
Kuo-Chung Yee
Taiwan Semiconductor Manufacturing Corporation, Inc.
T +886-3-5636688 Ext. 7222920/7223012
kcyee@tsmc.com

Papers: