Technical Program

Friday, June 01, 2018

Session 30: Assembly and Process Modeling
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Suresh K. Sitaraman
Georgia Institute of Technology
T +1-404-894-3405
Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925


1. 8:00 AM - Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-g Acceleration Loads
Pradeep Lall - Auburn University
Kalyan Dornala - Auburn University
John Deep - US AFRL
Ryan Lowe - ARA Associates

2. 8:25 AM - Numerical simulation on the formation process of metal droplets by pneumatic diaphragm drop-on demand technology
Kun Ma - Wuhan University
Sheng Liu - Wuhan University
Zhiwen Chen - Wuhan University
Chunxi Wang - Wuhan University
Li Liu - Wuhan University of Technology

3. 8:50 AM - On the Curing-induced Residual Stresses after Molding Processes: Mold Shrinkage, Chemical Shrinkage or Both?
Bongtae Han - University of Maryland
Changsu Kim - University of Maryland
Sukrut Phansalkar - University of Maryland

4. 10:00 AM - Realistic Solder Joint Geometry Integration with Finite Element Analysis for Reliability Evaluation of Printed Circuit Board Assembly
Chun Sean Lau - Western Digital
Ning Ye - Western Digital
Hem Takiar - Western Digital

5. 10:25 AM - Multi-physics modelling and Experimental Investigation – An original approach for Laser-dicing/grooving process optimization
Jeff Moussodji Moussodji - University of Sherbrooke
Oswaldo Chacon - IBM
Francis Santerre - IBM
Dominique Drouin - University of Sherbrooke

6. 10:50 AM - Thermal Characteristics of Vertically Integrated GaN/SiC-on-Si Assemblies: A Comparative Study
Kimmo Rasilainen - Chalmers University of Technology
Per Ingelhag - Ericsson AB
Peter Melin - Ericsson AB
Torbjörn M. J. Nilsson - Saab AB
Mattias Thorsell - Chalmers University of Technology & Saab AB
Christian Fager - Chalmers University of Technology

7. 11:15 AM - Comprehensive Investigation on Warpage Management of FOPLP with Multi Embedded Ring Designs
Chang-Chun Lee - Dept. of Power Mech. Engin., National Tsing Hua University
Yan-Yu Liou - Dept. of Power Mech. Engin., National Tsing Hua University
Pei-Chen Huang - Dept. of Power Mech. Engin., National Tsing Hua University
Fussen Hsu - New Business Development, Unimicron
Puru Bruce Lin - New Business Development, Unimicron
Cheng-Ta Ko - New Business Development, Unimicron
Yu-Hua Chen - New Business Development, Unimicron