Technical Program

Friday, May 31, 2019

Session 30: Assembly and Process Modeling
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Suresh K. Sitaraman
Georgia Institute of Technology
T +1-404-894-3405
suresh.sitaraman@me.gatech.edu
Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925
knchiang@pme.nthu.edu.tw

Papers:

1. 8:00 AM - Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-G Acceleration Loads
Pradeep Lall - Auburn University
Kalyan Dornala - Auburn University
John Deep - US AFRL
Ryan Lowe - ARA

2. 8:25 AM - Numerical Simulation on the Formation Process of Metal Droplets by Pneumatic Diaphragm Drop-On Demand Technology
Kun Ma - Wuhan University of Technology
Sheng Liu - Wuhan University of Technology
Zhiwen Chen - Wuhan University of Technology
Li Liu - Wuhan University of Technology
Hao Zheng - Wuhan University of Technology
Yao Zhang - Wuhan University of Technology

3. 8:50 AM - On the Curing-Induced Residual Stresses After Molding Processes: Mold Shrinkage, Chemical Shrinkage or Both?
Bongtae Han - The University of Maryland
Sukrut Phansalkar - The University of Maryland
Hyun-Seop Lee - The University of Maryland
Changsu Kim - The University of Maryland

4. 10:00 AM - Realistic Solder Joint Geometry Integration with Finite Element Analysis for Reliability Evaluation of Printed Circuit Board Assembly
Chun Sean Lau - Western Digital Corporation
Ning Ye - Western Digital Corporation
Hem Takiar - Western Digital Corporation

5. 10:25 AM - Multi-physics Modelling and Experimental Investigation – An Original Approach for Laser-Dicing/Grooving Process Optimization
Jeff Moussodji Moussodji - University de Sherbrooke
Oswaldo Chacon - IBM Corporation
Francis Santerre - IBM Corporation
Dominique Drouin - University de Sherbrooke

6. 10:50 AM - Thermal Characteristics of Vertically Integrated GaN/SiC-on-Si Assemblies: A Comparative Study
Kimmo Rasilainen - Chalmers University of Technology
Per Ingelhag - Ericsson AB
Peter Melin - Ericsson AB
Torbjörn M. J. Nilsson - Saab AB
Mattias Thorsell - Chalmers University of Technology & Saab AB
Christian Fager - Chalmers University of Technology

7. 11:15 AM - Comprehensive Investigation on Warpage Management of FOPLP With Multi-Embedded Ring Designs
Chang-Chun Lee - National Tsing Hua University
Yan-Yu Liou - National Tsing Hua University
Pei-Chen Huang - National Tsing Hua University
Fussen Hsu - Unimicron Technology Corporation
Puru Bruce Lin - Unimicron Technology Corporation
Cheng-Ta Ko - Unimicron Technology Corporation
Yu-Hua Chen - Unimicron Technology Corporation