Technical Program

Friday, June 02, 2017

Session 30: RF Components and Module Integration
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components
Room: Southern Hemisphere V

Session Co-Chairs:

Craig Gaw
NXP Semiconductor
T +1-480-814-5142
c.a.gaw@ieee.org
Wendem Beyene
Rambus Inc.
T +1-408-462-8366
wbeyene@rambus.com

Papers: