Technical Program

Wednesday, May 31, 2017

Session 3: Flip Chip Assembly
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Southern Hemisphere III

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Mark Gerber
Advanced Semiconductor Engineering Inc. USA
T +1-214-305-2154
mark.gerber@aseus.com

Papers:

1. 8:00 AM - Key Properties for Successful Ultra Thin Die Pickup
Stefan Behler - Besi Switzerland
Teng Wang - IMEC
Arnita Podpod - IMEC

2. 8:25 AM - Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package
Nokibul Islam - STATS ChipPAC
Vinayak Pandey - STATS ChipPAC
KyungOe Kim - STATS ChipPAC

3. 8:50 AM - Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and Methods
Tomonori Nakamura - SHINKAWA
Farhan Shafiq - SHINKAWA
Tetsuya Otani - SHINKAWA
Osamu Watanabe - SHINKAWA
Toru Maeda - SHINKAWA
Yoshihito Hagiwara - SHINKAWA
Keiji Honjo - DEXERIALS
Daichi Mori - DEXERIALS
Outa Egashira - DEXERIALS
Daisuke Handa - DEXERIALS
Tamotsu Owada - DEXERIALS

4. 10:00 AM - Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
Pascale Gagnon - IBM
Christian Bergeron - IBM
Richard Langlois - IBM
St├ęphane Barbeau - IBM
Steve Whitehead - IBM
Katsuyuki Sakuma - IBM
Raphael Robertazzi - IBM
Christy Tyberg - IBM
Matthew Wordeman - IBM
Michael Scheurmann - IBM

5. 10:25 AM - Chip Shooter to Enable Fine Pitch Flip Chip
Jie Fu - Qualcomm
Manuel Aldrete - Qualcomm
Milind Shah - Qualcomm

6. 10:50 AM - Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)
Fletcher (Cheng-Piao) Tung - SPIL
Max (Chin Yu) Lu - SPIL
Albert (Chang Yi) Lan - SPIL
Steward (Chi An) Pan - SPIL

7. 11:15 AM - Fine Pitch Interconnect Rework for Lead-Free Flip Chip Packages
Malak Kanso - Sherbrooke University
David Danovitch - Sherbrooke University
Elodie Nguena - Sherbrooke University
Richard Langlois - IBM Canada
Christian Bergeron - IBM Canada