Technical Program

Wednesday, May 31, 2017

Session 3: Flip Chip Assembly
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Southern Hemisphere III

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Mark Gerber
Advanced Semiconductor Engineering Inc.
T +1-214-305-2154
mark.gerber@aseus.com

Papers:

1. 8:00 AM - Key Properties for Successful Ultra Thin Die Pickup
Stefan Behler - Besi Switzerland AG
Teng Wang - IMEC
Arnita Podpod - IMEC

2. 8:25 AM - Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package
Nokibul Islam - STATS ChipPAC, Inc.
Vinayak Pandey - STATS ChipPAC, Inc.
KyungOe Kim - STATS ChipPAC, Inc.

3. 8:50 AM - Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and Methods
Tomonori Nakamura - Shinkawa Ltd.
Farhan Shafiq - Shinkawa Ltd.
Tetsuya Otani - Shinkawa Ltd.
Osamu Watanabe - Shinkawa Ltd.
Toru Maeda - Shinkawa Ltd.
Yoshihito Hagiwara - Shinkawa Ltd.
Keiji Honjo - Dexerials
Daichi Mori - Dexerials
Outa Egashira - Dexerials
Daisuke Handa - Dexerials
Tamotsu Owada - Dexerials

4. 10:00 AM - Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
Pascale Gagnon - IBM Corporation
Christian Bergeron - IBM Corporation
Richard Langlois - IBM Corporation
St├ęphane Barbeau - IBM Corporation
Steve Whitehead - IBM Corporation
Katsuyuki Sakuma - IBM Corporation
Raphael Robertazzi - IBM Corporation
Christy Tyberg - IBM Corporation
Matthew Wordeman - IBM Corporation
Michael Scheurmann - IBM Corporation

5. 10:25 AM - Chip Shooter to Enable Fine Pitch Flip Chip
Jie Fu - Qualcomm Technologies, Inc.
Manuel Aldrete - Qualcomm Technologies, Inc.
Milind Shah - Qualcomm Technologies, Inc.

6. 10:50 AM - Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)
Fletcher (Cheng-Piao) Tung - Siliconware Precision Industries Co., Ltd.
Max (Chin Yu) Lu - Siliconware Precision Industries Co., Ltd.
Albert (Chang Yi) Lan - Siliconware Precision Industries Co., Ltd.
Steward (Chi An) Pan - Siliconware Precision Industries Co., Ltd.

7. 11:15 AM - Fine Pitch Interconnect Rework for Lead-Free Flip Chip Packages
Malak Kanso - Sherbrooke University
David Danovitch - Sherbrooke University
Elodie Nguena - Sherbrooke University
Richard Langlois - IBM Corporation
Christian Bergeron - IBM Corporation