Technical Program

Wednesday, May 31, 2017

Session 3: Flip Chip Assembly
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Southern Hemisphere III

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
T +1-450-534-7767
voberson@ca.ibm.com
Mark Gerber
Advanced Semiconductor Engineering Inc.
T +1-214-305-2154
mark.gerber@aseus.com

Papers: