Technical Program

Friday, May 31, 2019

Session 29: Electromigration and Innovative Reliability Test Methods
8:00 AM - 11:40 AM
Committee: Applied Reliability

Session Co-Chairs:

Keith Newman
AMD
T (408) 749-5566
keith.newman@amd.com
Pilin Liu
Intel Corporation
T +1-480-570-7670
pilin.liu@intel.com

Papers: