Technical Program

Friday, May 31, 2019

Session 29: Electromigration and Innovative Reliability Test Methods
8:00 AM - 11:40 AM
Committee: Applied Reliability

Session Co-Chairs:

Keith Newman
AMD
T (408) 749-5566
keith.newman@amd.com
Pilin Liu
Intel Corporation
T +1-480-552-3020
pilin.liu@intel.com

Papers:

1. 8:00 AM - Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints
Madanipour Hossein - The University of Texas at Arlington
Yi-Ram Kim - The University of Texas at Arlington
Choong-Un Kim - The University of Texas at Arlington
Ninad Shashane - Texas Instruments, Inc.
Dibyajat MIshra - Texas Instruments, Inc.
T. Noguchi - Texas Instruments, Inc.
M. Yoshino - Texas Instruments, Inc.
Luu Nguyen - Texas Instruments, Inc.

2. 8:25 AM - Effect of Grain Orientation and Microstructure Evolution on Electromigration in Flip-Chip Solder Joint
Xing Fu - South China University of Technology
Yunfei En - China Electronic Product Reliability and Environmental Research Institute
Bin Zhou - China Electronic Product Reliability and Environmental Research Institute
Si Chen - China Electronic Product Reliability and Environmental Research Institute
Yun Huang - China Electronic Product Reliability and Environmental Research Institute
Ruohe Yao - South China University of Technology

3. 8:50 AM - Highly (111)-Oriented Nanotwinned Cu for Redistribution Lines in 3D IC With High Electromigration Resistance
I-Hsin Tseng - National Chiao Tung University
Chih-Han Tseng - National Chiao Tung University
Yu-Jin Li - National Chiao Tung University
Benson Lin - MediaTek, Inc.
Chia-Cheng Chang - MediaTek, Inc.

4. 10:00 AM - Non-Destructive Failure Analysis of Various Chip to Package Interaction Anomalies in FCBGA Packages Subjected to Temp Cycle Reliability Testing
Vishnu Vardhan Busi Reddy - Georgia Institute of Technology
I. Charles Ume - Georgia Institute of Technology
Jaimal Williamson - Texas Instruments, Inc.
Luu Nguyen - Texas Instruments, Inc.

5. 10:25 AM - Assessment of Accelerometer Versus LASER for Board Level Vibration Measurements
Varun Thukral - NXP Semiconductors
Maƫlle Cahu - NXP Semiconductors
Jeroen Zaal - NXP Semiconductors
Jeroen Jalink - NXP Semiconductors
Romuald Roucou - NXP Semiconductors
Rene Rongen - NXP Semiconductors

6. 10:50 AM - Effect of Process Parameters on the Long-Run Print Consistency and Material Properties of Additively Printed Electronics
Pradeep Lall - Auburn University
Amrit Abrol - Auburn University
Nakul Kothari - Auburn University
Jeff Suhling - Auburn University

7. 11:15 AM - A Viscoplastic-Based Fatigue Reliability Model for the Polyimide Dielectric Thin-Film
Yu-Chen Chang - National Cheng Kung University
Tz-Cheng Chiu - National Cheng Kung University
Yu-Ting Yang - Advanced Semiconductor Engineering Inc.
Yi-Hsiu Tseng - Advanced Semiconductor Engineering Inc.
Xi-Hong Chen - Advanced Semiconductor Engineering Inc.