Technical Program

Friday, June 02, 2017

Session 29: Warpage Control and Substrates
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Americas Seminar

Session Co-Chairs:

Paul Tiner
Texas Instruments
T +1-469-471-3565
p-tiner@ti.com
Paul Houston
Engent
T +1-770-280-4238
paul.houston@engentaat.com

Papers: