Technical Program

Friday, June 01, 2018

Session 28: Embedded and Integrated Technologies
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
joint with Packaging Technologies

Session Co-Chairs:

Christo Bojkov
Qorvo
T +1-972-994-8229
cpb2016@sbcglobal.net
John H. Lau
ASM Pacific Technology
T +852-2619-2757
john.lau@asmpt.com

Papers:

1. 8:00 AM - Development of Flexible Hybrid Electronics Using Reflow Assembly with Stretchable Film
Weifeng Liu - Flex
William Uy - Flex
Alex Chan - Flex
Dongkai Shangguan - Flex
Andy Behr - Panasonic
Takatoshi Abe - Panasonic
Tomohiro Fukao - Panasonic

2. 8:25 AM - Highly Compact RF Transceiver Module using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration
Gabriel Pares - CEA-LETI
Jean-Philippe Michel - CEA-LETI
Edouard Deschaseaux - CEA-LETI
Pierre Ferris - CEA-LETI
Ayssar Serhan - CEA-LETI
Alexandre Giry - CEA-LETI

3. 8:50 AM - Process induced wafer warpage optimization for multi-chip integration on wafer level molded wafer
Chen-Yu Huang - Siliconware Precision Industries Co., Ltd
Daniel Ng - Siliconware Precision Industries Co., Ltd
Willard Li - Siliconware Precision Industries Co., Ltd
Chich Shen Lin - Siliconware Precision Industries Co., Ltd
Chang Fu Lin - Siliconware Precision Industries Co., Ltd
C. Key Chung - Siliconware Precision Industries Co., Ltd

4. 10:00 AM - Improvement Structure of Thin Film Capacitor Embedded Package Substrate
Tomoyuki Akahoshi - Fujitsu Laboratories, Ltd.
Daisuke Mizutani - Fujitsu Laboratories, Ltd.
Kei Fukui - Fujitsu Interconnect Technologies, Ltd.
Shogo Yamawaki - Fujitsu Interconnect Technologies, Ltd.
Hidehiko Fujisaki - Fujitsu Interconnect Technologies, Ltd.
Manabu Watanabe - Fujitsu Advanced Technology, Ltd.
Masateru Koide - Fujitsu Advanced Technology, Ltd.

5. 10:25 AM - 3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators
Teng Sun - Georgia Institute of Technology
Pulugurtha Markondeya - Georgia Institute of Technology
Himani Sharma - Georgia Institute of Technology
Furukawa Yoshihiro - Nitto Denko Corporation
Rao Tummala - Georgia Institute of Technology

6. 10:50 AM - A Novel Panel Level Double Side-Embedded Package for Small Size Power Devices
Kunpeng Ding - Shenzhen Siptory Technologies Co., Ltd.
Zhichao Wu - Tsinghua University
Bowei Zhang - Wuxi Sky Chp Interconnection Technology Co., Ltd.
Mian Huang - Shenzhen Siptory Technologies Co., Ltd.
Jian Cai - Tsinghua University

7. 11:15 AM - EMI shielding on Electronic Packages realized by Electrolytic Plating
Katherina Krefft - Qualcomm Germany RFFE GmbH
Mustafa Özkök - Atotech Germany GmbH
Eckart Klusmann - Atotech Germany GmbH
Sven Lamprecht - Atotech Germany GmbH