Technical Program

Friday, May 31, 2019

Session 28: Embedded and Integrated Technologies
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
joint with Packaging Technologies

Session Co-Chairs:

Christo Bojkov
T +1-972-994-8229
John H. Lau
ASM Pacific Technology
T +852-2619-2757


1. 8:00 AM - Development of Flexible Hybrid Electronics Using Reflow Assembly With Stretchable Film
Weifeng Liu - Flex, Ltd.
William Uy - Flex, Ltd.
Alex Chan - Flex, Ltd.
Dongkai Shangguan - Flex, Ltd.
Andy Behr - Panasonic Corporation
Takatoshi Abe - Panasonic Corporation
Tomohiro Fukao - Panasonic Corporation

2. 8:25 AM - Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer With Embedded Inductors and Heterogeneous Dies Integration
Gabriel Pares - CEA-LETI
Jean-Philippe Michel - CEA-LETI
Edouard Deschaseaux - CEA-LETI
Pierre Ferris - CEA-LETI
Ayssar Serhan - CEA-LETI
Alexandre Giry - CEA-LETI

3. 8:50 AM - Process Induced Wafer Warpage Optimization for Multi-Chip Integration on Wafer Level Molded Wafer
Chen-Yu Huang - Siliconware Precision Industries Co., Ltd
Daniel Ng - Siliconware Precision Industries Co., Ltd
Willard Li - Siliconware Precision Industries Co., Ltd
Chich Shen Lin - Siliconware Precision Industries Co., Ltd
Chang Fu Lin - Siliconware Precision Industries Co., Ltd
C. Key Chung - Siliconware Precision Industries Co., Ltd

4. 10:00 AM - Improvement Structure of Package Substrate Embedded Thin Film Capacitor
Tomoyuki Akahoshi - Fujitsu Laboratories, Ltd.
Daisuke Mizutani - Fujitsu Laboratories, Ltd.
Kei Fukui - Fujitsu Interconnect Technologies, Ltd.
Shogo Yamawaki - Fujitsu Interconnect Technologies, Ltd.
Hidehiko Fujisaki - Fujitsu Interconnect Technologies, Ltd.
Manabu Watanabe - Fujitsu Advanced Technology, Ltd.
Masateru Koide - Fujitsu Advanced Technology, Ltd.

5. 10:25 AM - 3D Packaging With Embedded High-Power-Density Passives for Integrated Voltage Regulators
Teng Sun - Georgia Institute of Technology
Pulugurtha Markondeya - Florida International University
Himani Sharma - Georgia Institute of Technology
Furukawa Yoshihiro - Nitto Denko Corporation
Rao Tummala - Georgia Institute of Technology

6. 10:50 AM - A Novel Panel Level Double Side-Embedded Package for Small Size Power Devices
Kunpeng Ding - Shenzhen Siptory Technologies Co., Ltd.
Zhichao Wu - Tsinghua University
Bowei Zhang - Wuxi Sky Chp Interconnection Technology Co., Ltd.
Mian Huang - Shenzhen Siptory Technologies Co., Ltd.
Jian Cai - Tsinghua University

7. 11:15 AM - EMI Shielding on Electronic Packages Realized by Electrolytic Plating
Katherina Krefft - Qualcomm Technologies, Inc.
Mustafa Özkök - Atotech Deutschland GmbH
Eckart Klusmann - Atotech Deutschland GmbH
Sven Lamprecht - Atotech Deutschland GmbH