Technical Program

Friday, June 02, 2017

Session 27: Advances in Thermal Compression and Wirebonding
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com
William Chen
Advanced Semiconductor Engineering, Inc.
T +1-408-250-4290
william.chen@aseus.com

Papers: