Technical Program

Friday, May 31, 2019

Session 27: Advanced Biosensors and Bioelectronics
8:00 AM - 11:40 AM
Committee: Emerging Technologies

Session Co-Chairs:

Zhuo Li
Fudan University
T +86-21-65643267
zhuo_li@fudan.edu.cn
Jimin Yao
Intel Corporation
T +1-217-299-7362
jimin.yao@intel.com

Papers:

1. 8:00 AM - Microfabricated Biodissolvable Probe for Electrical Neural Signal Recording
Sajay Bhuvanendran Nair Gourikutty - Institute of Microelectronics, A*STAR, Singapore
Ruiqi Lim - Institute of Microelectronics, A*STAR, Singapore

2. 8:25 AM - Stretchable, Implantable Nanomembrane Biosensor for Wireless, Real-Time Monitoring of Hemodynamics
Robert Herbert - Georgia Institute of Technology
Woon-Hong Yeo - Georgia Institute of Technology

3. 8:50 AM - A Wearable Passive pH Sensor for Health Monitoring
Saikat Mondal - Michigan State University
Saranraj Karuppuswami - Michigan State University
Rachel Steinhornst - Michigan State University
Premjeet Chahal - Michigan State University

4. 10:00 AM - Novel Packaging Structure and Processes for Micro-Size Thin-Film Batteries (TFB) to Enable Miniaturized Healthcare Internet-of-Things (IoT) Devices
Bing Dang - IBM Corporation
Qianwen Chen - IBM Corporation
Leanna Pancoast - IBM Corporation
Yu Luo - IBM Corporation
Hongqing Zhang - IBM Corporation
Andy Shih - Front Edge Technology, Inc.
Barry Cheng - Front Edge Technology, Inc.
Kai Liu - Front Edge Technology, Inc.
Mengnian Nio - Front Edge Technology, Inc.
Simon Nieh - Front Edge Technology, Inc.
John Knickerbocker - IBM Corporation

5. 10:25 AM - Printed Temporary Transfer Tattoos for Skin-Mounted Electronics
Samuli Tuominen - Tampere University of Technology
Matti Mäntysalo - Tampere University of Technology

6. 10:50 AM - Thermoset polymers for Bioelectronic Interfaces: Engineering of Thermomechanical Properties
Alexandra Joshi-Imre - The University of Texas at Dallas
Walter E. Voit - The University of Texas at Dallas
Joseph J. Pancrazio - The University of Texas at Dallas
Melanie Ecker - The University of Texas at Dallas

7. 11:15 AM - Direct Heterogeneous Bonding of SiC to Si, SiO2, and Glass for High-Performance Power Electronics and Bio-MEMS
Jikai Xu - Harbin Institute of Technology
Chenxi Wang - Harbin Institute of Technology
Qiushi Kang - Harbin Institute of Technology
Shicheng Zhou - Harbin Institute of Technology
Yanhong Tian - Harbin Institute of Technology