Technical Program

Friday, June 02, 2017

Session 26: 3D Integration Processing and Reliability
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Southern Hemisphere II

Session Co-Chairs:

Rozalia Beica
Dow Electronic Materials
T 1-508-787-4691
rgbeica@dow.com
Dean Malta
Micross Advanced Interconnect Technology
T +1-919-248-8405
Dean.Malta@micross.com

Papers: