Technical Program

Friday, June 01, 2018

Session 26: High-Speed Signaling for High-Performance Computing and Memory
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Rockwell Hsu
Cisco Systems, Inc.
T +1-480-612-1469
rohsu@cisco.com
Jaemin Shin
Qualcomm Corporation
T +1-858-651-2815
jaemins@qti.qualcomm.com

Papers:

1. 8:00 AM - Hybrid prepreg conventional build up laminate for 112Gbit/s SerDes
Kwang Won Choi - GLOBALFOUNDRIES US Inc.
Edmund Blackshear - GLOBALFOUNDRIES US Inc.
Eric Tremble - GLOBALFOUNDRIES US Inc.
David Stone - GLOBALFOUNDRIES US Inc.
Jean Audet - IBM Canada Ltd.
Keiichi Hirabayashi - Shinko Electric Industries Co., Ltd.

2. 8:25 AM - PI/SI Analysis and Design Approach for HPC Platform Applications
Chanmin Jo - Samsung Electronics Company, Ltd.
Seungki Nam - Samsung Electronics Company, Ltd

3. 8:50 AM - PoP LPDDR5 (6.4 Gbps) NTODT and 1-tap DFE for Signal Integrity Enhancement
Sunil Gupta - Qualcomm, Inc.

4. 10:00 AM - OpenCAPI Memory Interface signal integrity study for high-speed DDR5 Differential DIMM channel with standard loss FR-4 material and SNIA SFF-TA-1002 connector
Biao Cai - IBM Corporation
Jose Hejase - IBM Corporation
Kyle Giesen - IBM Corporation
KYU-HYOUN (Kh) Kim - IBM Corporation
Junyan Tang - IBM Corporation
Daniel Dreps - IBM Corporation
Zhineng Fan - Amphenol ICC

5. 10:25 AM - Effectiveness of equalization and performance potential in DDR5 channels with RDIMM(s)
nanju na - xilinx inc.
thomas to - xilinx inc.

6. 10:50 AM - Inductive link for 3D stacked chip to chip communication
Xiao Sun - IMEC
Nicolas Pantano - IMEC
Soon-Wook Kim - IMEC
Geert Van der Plas - IMEC
Eric Beyne - IMEC

7. 11:15 AM - System Co-Design of an Integrated Driver and 600V GaN FET Power Stage in a QFN System-in-Package (QFN-SiP)
Jie Chen - Texas Instruments, Inc
Yong Xie - Texas Instruments, Inc
Trombley Django - Texas Instruments, Inc
Rajen Murugan - Texas Instruments, Inc