Technical Program

Friday, May 31, 2019

Session 26: High-Speed Signaling for High-Performance Computing and Memory
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Rockwell Hsu
Cisco Systems, Inc.
T +1-480-612-1469
Jaemin Shin
Qualcomm Corporation
T +1-858-651-2815


1. 8:00 AM - Hybrid Prepreg Conventional Build-Up Laminate for 112Gbit/s SerDes
Edmund Blackshear - GLOBALFOUNDRIES
Jean Audet - IBM Canada Ltd.
Keiichi Hirabayashi - Shinko Electric Industries Company, Ltd.

2. 8:25 AM - PI/SI Analysis and Design Approach for HPC Platform Applications
Sungwook Moon - Samsung Electronics Company, Ltd.
Chanmin Jo - Samsung Electronics Company, Ltd.
Seungki Nam - Samsung Electronics Company, Ltd.

3. 8:50 AM - PoP LPDDR5 (6.4 Gbps) NTODT and 1-tap DFE for Signal Integrity Enhancement
Sunil Gupta - Qualcomm Technologies, Inc.

4. 10:00 AM - Open CAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel With Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector
Biao Cai - IBM Corporation
Jose Hejase - IBM Corporation
Kyle Giesen - IBM Corporation
Junyan Tang - IBM Corporation
Brian Connolly - IBM Corporation
Kyu- Hyoun Kim - IBM Corporation
Daniel Dreps - IBM Corporation
Zhineng Fan - Amphenol Corporation
Rocky Huang - Amphenol ICC
Luyun Yi, Qiaoli Chen - Amphenol ICC
Yifan Huang, Stephen Smith - Amphenol ICC

5. 10:25 AM - Effectiveness of Equalization and Performance Potential in DDR5 Channels With RDIMM(s)
Nanju Na - Xilinx, Inc.
Hing "Thomas" To - Xilinx, Inc.

6. 10:50 AM - Inductive Links for 3D Stacked Chip-to-Chip Communication
Xiao Sun - IMEC
Nicolas Pantano - IMEC
Kim Soon-Wook - IMEC
Geert Van der Plas - IMEC
Eric Beyne - IMEC

7. 11:15 AM - System Co-Design of a 600V GaN FET Power Stage With Integrated Driver in a QFN System-in-Package (QFN-SiP)
Jie Chen - Texas Instruments, Inc.
Yong Xie - Texas Instruments, Inc.
Django Trombley - Texas Instruments, Inc.
Rajen Murugan - Texas Instruments, Inc.