Technical Program

Friday, June 02, 2017

Session 25: Characterization and Reliability of Fan-Out & WLP
8:00 AM - 11:40 AM
Committee: Applied Reliability
Room: Southern Hemisphere III

Session Co-Chairs:

Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com
Toni Mattila
Aalto University
T +358-405009909
toni.mattila@aalto.fi

Papers:

1. 8:00 AM - The Paradoxical Role of Sulphur in Molding Compounds: Influence on High Temperature Reliability of Cu-Al Wirebond Interconnects
Amar Mavinkurve - NXP Semiconductors
Leon Goumans - NXP Semiconductors
Bongkoj Bumrungkittikul - NXP Semiconductors
Mark-Luke Farrugia - NXP Semiconductors
Erik van Olst - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors
Rene Rongen - NXP Semiconductors

2. 8:25 AM - Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-Bonded Device Assembly
Oliver Chyan - University of North Texas
Nick Ross - University of North Texas
Alex Lambert - University of North Texas
Seare Berhe - University of North Texas
Muthappan Asokan - University of North Texas
Mahmud Chowdhury - Texas Instruments
Shawn O’Connor - Texas Instruments
Luu Nguyen - Texas Instruments

3. 8:50 AM - Use Condition Risk Assessment for Moisture Related Failures
Min Pei - Intel
Sibasish Mukherjee - Intel
Nitin Uppal - Intel
Milena Vujosevic - Intel

4. 10:00 AM - Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package
Zhaohui Chen - IME, A*STAR
Faxing Che - IME, A*STAR
Mian Zhi Ding - IME, A*STAR
David Soon Wee Ho - IME, A*STAR
Tai Chong Chai - IME, A*STAR
Vempati Srinivasa - IME, A*STAR

5. 10:25 AM - The Comparative Study To Enhance Board Level Reliability Performance of Wafer Level Package at 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology
Kuei Hsiao Kuo - SPIL
Yi Sin Ting - SPIL
Chui Feng Weng - SPIL
Feng Lung Chien - SPIL
Katch Wan - SPIL
Chun Sheng Ho - SPIL
Rick Lee - SPIL

6. 10:50 AM - Quality and Reliability Assessment of Cu Pillar Bumps for Fine Pitch Applications
Othmane Jerhaoui - CEA-LETI
Stephane Moreau - CEA-LETI
David Bouchu - CEA-LETI
Gilles Romero - CEA-LETI
Denis Marseilhan - CEA-LETI
Thierry Mourier - CEA-LETI
Arnaud Garnier - CEA-LETI

7. 11:15 AM - Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200°C
Pradeep Lall - Auburn University
Di Zhang - Auburn University
Vikas Yadav - Auburn University
Jeff Suhling - Auburn University
David Locker - US Army AMRDEC