Technical Program

Friday, May 31, 2019

Session 25: Wafer Level Packaging and Fan-In/Fan-Out Structures & Materials
8:00 AM - 11:40 AM
Committee: Packaging Technologies

Session Co-Chairs:

Albert Lan
Applied Materials
T +886-3-5793588
Albert_Lan@amat.com
Andrew Kim
Intel Corporation
T +1-916-356-7176
hyoung.il.kim@intel.com

Papers: