Technical Program

Friday, May 31, 2019

Session 25: Wafer Level Packaging and Fan-In/Fan-Out Structures & Materials
8:00 AM - 11:40 AM
Committee: Packaging Technologies

Session Co-Chairs:

Albert Lan
Applied Materials
T +886-3-5793588
Albert_Lan@amat.com
Christophe Zincke
Advanced Semiconductor Engineering, Inc.
T +3362856 6802
Christophe.Zinck@aseeu.com

Papers:

1. 8:00 AM - 3D Fan-Out Package Technology with Photosensitive Through Mold Interconnects
Kentaro Mori - Toshiba Corporation
Soichi Yamashita - Toshiba Corporation
Takafumi Fukuda - Toshiba Corporation
Masahiro Sekiguchi - Toshiba Corporation
Hirokazu Ezawa - Toshiba Corporation
Shuzo Akejima - Toshiba Corporation

2. 8:25 AM - Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics
SangMyung Shin - Korea Advanced Institute of Science and Technology
HanMin Lee - Korea Advanced Institute of Science and Technology
JunMo Kim - Korea Advanced Institute of Science and Technology
Tae-Ik Lee - Korea Advanced Institute of Science and Technology
Taek-Soo Kim - Korea Advanced Institute of Science and Technology
Youjin Kyung - LG Chem
Minsu Jeong - LG Chem
Kwangjoo Lee - LG Chem
Kyung-Wook Paik - Korea Advanced Institute of Science and Technology

3. 8:50 AM - Mechanism of Moldable Underfill (MUF) Process for RDL-1st Fan-Out Panel Level Packaging
Lin Bu - Institute of Microelectronics A*STAR
Faxing Che - Institute of Microelectronics A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics A*STAR
Xiaowu Zhang - Institute of Microelectronics A*STAR

4. 10:00 AM - Study of the Board Level Reliability Performance of a Large 0.3 mm Pitch Wafer-Level Package
Bernd Waidhas - Intel Corporation
Jan Proschwitz - Intel Corporation
Christoph Pietryga - Intel Corporation
Thomas Wagner - Intel Corporation
Beth Keser - Intel Corporation

5. 10:25 AM - Study of Board Level Reliability of eWLB (Embedded Wafer-Level BGA) for 0.35mm Ball Pitch
Seung Wook Yoon - STATS ChipPAC Pte. Ltd.
Yeow Kheng Lim - STATS ChipPAC Pte. Ltd.
Seng Guang Chow - STATS ChipPAC Pte. Ltd.
Kang Hai Lee - STATS ChipPAC Pte. Ltd.
NW Liu - MediaTek, Inc.
Yenyao Chi - MediaTek, Inc.
Benson Lin - MediaTek, Inc.

6. 10:50 AM - Board Level Reliability Study of Fan-Out Single Die Package With 350um Bump Pitch
Chieh Lung Lai - Siliconware Precision Industries Co., Ltd.
Gu Yan Lin - Siliconware Precision Industries Co., Ltd.
Tz Yuan Chao - Siliconware Precision Industries Co., Ltd.
Yih Sin Chen - Siliconware Precision Industries Co., Ltd.
Feng Lung Chien - Siliconware Precision Industries Co., Ltd.

7. 11:15 AM - The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition
Clair Tsai - Taiwan Semiconductor Manufacturing Company Ltd.
C. N. Wang - Taiwan Semiconductor Manufacturing Company Ltd.
T. L. Yang - Taiwan Semiconductor Manufacturing Company Ltd.
W. C. Wu - Taiwan Semiconductor Manufacturing Company Ltd.
C. S. Liu - Taiwan Semiconductor Manufacturing Company Ltd.
J.M. Chiu - Taiwan Semiconductor Manufacturing Company Ltd.
Y. F. Chen - Taiwan Semiconductor Manufacturing Company Ltd.
Harry Ku - Taiwan Semiconductor Manufacturing Company Ltd.
Kirin Wang - Taiwan Semiconductor Manufacturing Company Ltd.
C.H. Su - Taiwan Semiconductor Manufacturing Company Ltd.