Technical Program

Friday, June 02, 2017

Session 25: Characterization and Reliability of Fan-Out & WLP
8:00 AM - 11:40 AM
Committee: Applied Reliability
Room: Southern Hemisphere III

Session Co-Chairs:

Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com
Toni Mattila
Aalto University
T +358-405009909
toni.mattila@aalto.fi

Papers:

1. 8:00 AM - The Paradoxical Role of Sulphur in Molding Compounds: Influence on High Temperature Reliability of Cu-Al Wirebond Interconnects
Amar Mavinkurve - NXP Semiconductors
Leon Goumans - NXP Semiconductors
Bongkoj Bumrungkittikul - NXP Semiconductors
Mark-Luke Farrugia - NXP Semiconductors
Erik van Olst - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors
Rene Rongen - NXP Semiconductors

2. 8:25 AM - Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-Bonded Device Assembly
Oliver Chyan - University of North Texas
Nick Ross - University of North Texas
Alex Lambert - University of North Texas
Seare Berhe - University of North Texas
Muthappan Asokan - University of North Texas
Mahmud Chowdhury - Texas Instruments, Inc.
Shawn O’Connor - Texas Instruments, Inc.
Luu Nguyen - Texas Instruments, Inc.

3. 8:50 AM - Use Condition Risk Assessment for Moisture Related Failures
Min Pei - Intel Corporation
Sibasish Mukherjee - Intel Corporation
Nitin Uppal - Intel Corporation
Milena Vujosevic - Intel Corporation

4. 10:00 AM - Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package
Zhaohui Chen - Institute of Microelectronics, A*STAR
Faxing Che - Institute of Microelectronics, A*STAR
Mian Zhi Ding - Institute of Microelectronics, A*STAR
David Soon Wee Ho - Institute of Microelectronics, A*STAR
Tai Chong Chai - Institute of Microelectronics, A*STAR
Vempati Srinivasa - Institute of Microelectronics, A*STAR

5. 10:25 AM - The Comparative Study To Enhance Board Level Reliability Performance of Wafer Level Package at 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology
Kuei Hsiao Kuo - Siliconware Precision Industries Co., Ltd.
Yi Sin Ting - Siliconware Precision Industries Co., Ltd.
Chui Feng Weng - Siliconware Precision Industries Co., Ltd.
Feng Lung Chien - Siliconware Precision Industries Co., Ltd.
Katch Wan - Siliconware Precision Industries Co., Ltd.
Chun Sheng Ho - Siliconware Precision Industries Co., Ltd.
Rick Lee - Siliconware Precision Industries Co., Ltd.

6. 10:50 AM - Quality and Reliability Assessment of Cu Pillar Bumps for Fine Pitch Applications
Othmane Jerhaoui - CEA-Leti
Stephane Moreau - CEA-Leti
David Bouchu - CEA-Leti
Gilles Romero - CEA-Leti
Denis Marseilhan - CEA-Leti
Thierry Mourier - CEA-Leti
Arnaud Garnier - CEA-Leti

7. 11:15 AM - Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200°C
Pradeep Lall - Auburn University
Di Zhang - Auburn University
Vikas Yadav - Auburn University
Jeff Suhling - Auburn University
David Locker - US Army AMRDEC