Technical Program

Thursday, May 30, 2019

Session 24: Advancements in Solder Joint Characterization and Reliability Evaluation
1:30 PM - 5:10 PM
Committee: Applied Reliability

Session Co-Chairs:

Scott Savage
Medtronic Microelectronics Center
T +1-480-303-4749
scott.savage@medtronic.com
Pei-Haw Tsao
Taiwan Semiconductor Manufacturing Company, Ltd.
T +886-3-5636688 Ext. 7072122/7075113
PHTSAO@tsmc.com

Papers: