Technical Program

Thursday, May 30, 2019

Session 24: Advancements in Solder Joint Characterization and Reliability Evaluation
1:30 PM - 5:10 PM
Committee: Applied Reliability

Session Co-Chairs:

Scott Savage
Medtronic Microelectronics Center
T +1-480-303-4749
Pei-Haw Tsao
Taiwan Semiconductor Manufacturing Company, Ltd.
T +886-3-5636688 Ext. 7072122/7075113


1. 1:30 PM - Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy
Shiqi Zhou - Osaka University
Yu-An Shen - Osaka University
Hiroshi Nishikawa - Osaka University
Tiffani Uresti - Texas A&M University at Qatar
Vasanth Shunmugasamy - Texas A&M University at Qatar
Bilal Mansoor - Texas A&M University at Qatar

2. 1:55 PM - Microstructural Evolution in SAC+X Solders Subjected to Aging
Jeffrey C. Suhling - Auburn University
Jing Wu - Auburn University
Pradeep Lall - Auburn University

3. 2:20 PM - Microstructure Signature Evolution in Solder Joints, Solder Bumps, and Micro-Bumps Interconnection in a Large 2.5D FCBGA Package During Thermo-Mechanical Cycling
Tae-Kyu Lee - Portland State University
Arman Ahari - Portland State University
Greg Baty - Portland State University
Peng Su - Juniper Networks
Andy Hsiao - Portland State University

4. 3:30 PM - Long-Term Reliability of Solder Joints in 3D Memory ICs Under Near-Application Conditions
Omar Ahmed - University of Central Florida
Golareh Jalilvand - University of Central Florida
Hector Fernandez - University of Central Florida
Peng Su - Juniper Networks
Tae-Kyu Lee - Portland State University
Tengfei Jiang - University of Central Florida

5. 3:55 PM - Experimental Investigation of the Correlation between a Load-Based Metric and Solder Joint Reliability of BGA Assemblies on System Level
Fabian Schempp - Robert Bosch GmbH
Marc Dressler - Robert Bosch GmbH
Daniel Kraetschmer - Robert Bosch GmbH
Friederike Loerke - Robert Bosch GmbH
Juergen Wilde - University of Freiburg, IMTEK

6. 4:20 PM - Fatigue Life Predictive Model Development for Decoupling Capacitors
Krishna Tunga - IBM Corporation
Joseph Ross - IBM Corporation
Kamal Sikka - IBM Corporation
Bakul Parikh - IBM Corporation

7. 4:45 PM - A Study of Substrate Models and Its Effect on Package Warpage Prediction
Van Lai Pham - Binghamton University
Huayan Wang - Binghamton University
Jiefeng Xu - Binghamton University
Jing Wang - Binghamton University
Seungbae Park - Binghamton University
Charandeep Singh - Corning, Inc.