Technical Program

Thursday, June 01, 2017

Session 24: Novel Methods to Assess Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Southern Hemisphere V

Session Co-Chairs:

Sridhar Canumalla
Microsoft Corporation
T +1-425-538-4060
scanuma@microsoft.com
Keith Newman
AMD
T (408) 749-5566
keith.newman@amd.com

Papers:

1. 1:30 PM - Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units
Alexandru Prisacaru - Robert Bosch GmbH
Alicja Palczynska - Robert Bosch GmbH
Przemyslaw Jakub Gromala - Robert Bosch GmbH
Bongtae Han - University of Maryland
G.Q. (Kouchi) Zhang - Delft University of Technology

2. 1:55 PM - Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation
Sudan Ahmed - Auburn University
Md Hasnine - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

3. 2:20 PM - New Method to Separate Failure Modes by Transient Thermal Analysis of High Power LEDs
Alexander Hanss - Technische Hochschule Ingolstadt
E Liu - Technische Hochschule Ingolstadt
Gordon Elger - Technische Hochschule Ingolstadt
Maximilian Schmid - Technische Hochschule Ingolstadt
Dominik Müller - Technische Hochschule Ingolstadt
Udo Karbowski - Lumileds
Robert Derix - Lumileds

4. 3:30 PM - Improving Terahertz Signal Travel Distance for Fault Isolation
Hemachandar Tanukonda Devarajulu - Intel Corporation
Mayue Xie - Intel Corporation
Chengqing Hu - Intel Corporation
Deepak Goyal - Intel Corporation
Eiji Kato - Advantest Corporation
Masaichi Hashimoto - Advantest Corporation

5. 3:55 PM - Effective Evaluation Method: A New Delamination Test Method for MUF (molded underfill) Package
Junghwa Kim - Samsung SDI
Seung Han - Samsung SDI
Woochul Na - Samsung SDI
SoYoon Kim - Samsung SDI
Ki Hyeok Kwon - Samsung SDI
Deokhoon Park - Samsung SDI
Donghwan Lee - Samsung SDI
Sang Kyun Kim - Samsung SDI

6. 4:20 PM - Measuring Sodium Migration in Mold Compounds Using a Sodium Amalgam Electrode as an Infinite Source
Stefan Schwab - Kompetenzzentrum Automobil- u. Industrieelektronik
Julia Appenroth - Technische Universität Wien
Sabine Holzer - Infineon Technologies
Michael Bauer - Infineon Technologies
Stefan Miethaner - Infineon Technologies
Michael Nelhiebel - Kompetenzzentrum Automobil- u. Industrieelektronik
Peter Weinberger - Technische Universität Wien
Herbert Hutter - Technische Universität Wien
Maximilian Bonta - Technische Universität Wien
Andreas Limbeck - Technische Universität Wien

7. 4:45 PM - A New Method for Prediction of Corrosion Processes in Metallization Systems for Substrates and Electrical Contacts
Sandy Klengel - Fraunhofer IMWS
Tino Stephan - Fraunhofer IMWS
Uwe Spohn - Fraunhofer IMWS