Technical Program

Thursday, May 30, 2019

Session 23: High-Bandwidth 3D and Photonic Integration
1:30 PM - 5:10 PM
Committee: Photonics
joint with Interconnections

Session Co-Chairs:

Takaaki Ishigure
Keio University
T +81-45-566-1593
ishigure@appi.keio.ac.jp
Dingyou Zhang
Broadcom Inc.
T
dingyouzhang.brcm@gmail.com

Papers:

1. 1:30 PM - A Highly Reliable 1.4um Pitch Via-last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems
Stefaan Van Huylenbroeck - IMEC
Joeri De Vos - IMEC
Zaid El-Mekki - IMEC
Geraldine Jamieson - IMEC
Nina Tutunjyan - IMEC
Karthik Muga - IMEC
Michele Stucchi - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

2. 1:55 PM - Nanoscale Topography Characterization for Direct Bond Interconnect
Bongsub Lee - Xperi Corporation
Pawel Mrozek - Xperi Corporation
Gill Fountain - Xperi Corporation
John Posthill - Xperi Corporation
Jeremy Theil - Xperi Corporation
Rajesh Katkar - Xperi Corporation
Laura Mirkarimi - Xperi Corporation

3. 2:20 PM - Fabrication and Characterisation of Carbon Based Interconnects for 3D ICs
Andreas Nylander - Chalmers University of Technology
Marlene Bonmann - Chalmers University of Technology
Jie Zhao - Uppsala University
Andrei Voroblev - Chalmers University of Technology
Yifeng Fu - Chalmers University of Technology
Jan Stake - Chalmers University of Technology
Zhibin Zhang - Uppsala University
Johan Liu - Chalmers University of Technology

4. 3:30 PM - 3D Silicon Photonics Interposer for Tb/s Optical Interconnects in Data Centers With Double-Side Assembled Active Components and Integrated Optical and Electrical Through Silicon Via on SOI
Bogdan Sirbu - Fraunhofer IZM
Yann Eichhammer - Fraunhofer IZM
Victor Sidorov - AMS AG
Jochen Kraft - AMS AG
Xin Yin - IMEC
Johan Bauwelinck - IMEC
Christian Neumeyr - VERTILAS GmbH
Francisco Soares - Fraunhofer HHI
Oppermann Hermann - Fraunhofer IZM
Tolga Tekin - Fraunhofer IZM

5. 3:55 PM - Flip-Chip III-V-to-Silicon Photonics Interfaces for Optical Sensor
Yves Martin - IBM Corporation
Jason Orcutt - IBM Corporation
Chi Xiong - IBM Corporation
Laurent Schares - IBM Corporation
Tymon Barwicz - IBM Corporation
Martin Glodde - IBM Corporation
Eric Zhang - IBM Corporation
William Green - IBM Corporation
Victor Dolores-Calzadilla - Fraunhofer HHI
Martin Moehrle - Fraunhofer HHI
Ariane Sigmund - Fraunhofer HHI

6. 4:20 PM - Extremely Low-Profile Single Mode Fiber Array Coupler Suitable for Silicon Photonics
Mitsuharu Hirano - Sumitomo Electric Industries, Ltd.
Akira Furuya - Sumitomo Electric Industries, Ltd.
Hideki Machida - Sumitomo Electric Industries, Ltd.
Koichi Koyama - Sumitomo Electric Industries, Ltd.
Yasunori Murakami - Sumitomo Electric Industries, Ltd.
Kazunori Tanaka - Sumitomo Electric Industries, Ltd.

7. 4:45 PM - Micro-Lens Array Assembly for Optical Organic Substrates
Patrick Jacques - IBM Canada, Ltd.
Richard Langlois - IBM Canada, Ltd.
Koji Masuda - IBM Research
Masao Tokunari - IBM Research
Hsiang Han Hsu - IBM Research
Paul Fortier - IBM Canada, Ltd.