Technical Program

Thursday, June 01, 2017

Session 23: Additive Manufacturing and Panel-Level Packaging
1:30 PM - 5:10 PM
Committee: Emerging Technologies
Room: Southern Hemisphere IV

Session Co-Chairs:

Florian Herrault
HRL Laboratories, LLC
T +1-310-317-5269
W. Hong Yeo
Georgia Institute of Technology
T +1- 404-894-3200


1. 1:30 PM - Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?
Tobias Tiedje - Technical University Dresden
Sebastian Lüngen - Technical University Dresden
Martin Schubert - Technical University Dresden
Marco Luniak - Technical University Dresden
Krzysztof Nieweglowski - Technical University Dresden
Karlheinz Bock - Technical University Dresden

2. 1:55 PM - 3D Printing as a New Packaging Approach for MEMS and Electronic Devices
Gabrielle Aspar - CEA-Leti
Baptiste Goubault - CEA-Leti
Olivier Lebaigue - CEA-Leti
Gilles Simon - CEA-Leti
Léa Di Cioccio - CEA-Leti
Yves Bréchet - CEA-Leti
Jean-Charles Souriau - CEA-Leti

3. 2:20 PM - 3D Printed High Frequency Coaxial Transmission Line Based Circuits
Michael Craton - Michigan State University
Jennifer A. Byford - Michigan State University
Vincens Gjokaj - Michigan State University
Premjeet Chahal - Michigan State University
John Papapolymerou - Michigan State University

4. 3:30 PM - Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
Chintan Buch - Georgia Institute of Technology
Daniel Struk - Georgia Institute of Technology
Klaus-Jürgen Wolter - Georgia Institute of Technology
Peter J. Hesketh - Georgia Institute of Technology
Catherine Shearer - EMD-Ormet Circuits
James Haley - EMD-Ormet Circuits
Mel Findlay - KWJ Engineering
Marc Papageorge - SPEC Sensors
Venkatesh Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

5. 3:55 PM - Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems
Carl Prevatte - X-Celeprint
Matthew A. Meitl - X-Celeprint
Erich Radauscher - X-Celeprint
David Gomez - X-Celeprint
Kanchan Ghosal - X-Celeprint
Salvatore Bonafede - X-Celeprint
Brook Raymond - X-Celeprint
Tanya Moore - X-Celeprint
António Jose Trindade - X-Celeprint
Paul Hines - Micross Advanced Interconnect Technology
Christopher A. Bower - X-Celeprint

6. 4:20 PM - Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device & Sensor Packaging for Harsh Environment Applications
Keng Yuen Au - Institute of Microelectronics, A*STAR
Eva Wai Leong Ching - Institute of Microelectronics, A*STAR

7. 4:45 PM - A Study on the Novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Chip-On-Glass(COG) Applications
Dal-jin Yoon - Korea Advanced Institute of Science & Technology
Sang-Hoon Lee - Korea Advanced Institute of Science & Technology
Kyung-Wook Paik - Korea Advanced Institute of Science & Technology