Technical Program

Thursday, May 31, 2018

Session 23: High-Bandwidth 3D and Photonic Integration
1:30 PM - 5:10 PM
Committee: Photonics
joint with Interconnections

Session Co-Chairs:

Takaaki Ishigure
Keio University
T +81-45-566-1593
ishigure@appi.keio.ac.jp
Dingyou Zhang
Broadcom Inc.
T
zhangdingyou04@gmail.com

Papers:

1. 1:30 PM - A Highly Reliable 1.4um pitch Via-last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems
Stefaan Van Huylenbroeck - IMEC
Joeri De Vos - IMEC
Zaid El-Mekki - IMEC
Geraldine Jamieson - IMEC
Nina Tutunjyan - IMEC
Karthik Muga - IMEC
Michele Stucchi - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

2. 1:55 PM - Nanoscale Topography Characterization for Direct Bond Interconnect
Bongsub Lee - Xperi Corporation
Pawel Mrozek - Xperi Corporation
Gill Fountain - Xperi Corporation
John Posthill - john.posthill@xperi.com
Jeremy Theil - Xperi Corporation
Rajesh Katkar - Xperi Corporation
Laura Mirkarimi - Xperi Corporation

3. 2:20 PM - Fabrication and Characterisation of Carbon Based Interconnects for 3D ICs
Andreas Nylander - Chalmers University of Technology
Marlene Bonmann - Chalmers University of Technology
Jie Zhao - Uppsala University
Andrei Voroblev - Chalmers University of Technology
Yifeng Fu - Chalmers University of Technology
Jan Stake - Chalmers University of Technology
Zhibin Zhang - Uppsala University
Johan Liu - Chalmers University of Technology

4. 3:30 PM - 3D Silicon Photonics Interposer for Tb/s Optical Interconnects in Data Centers with double-side assembled active components and integrated optical and electrical Through Silicon Via on SOI
Bogdan Sirbu - Fraunhofer IZM
Yann Eichhammer - Fraunhofer IZM
Victor Sidorov - AMS
Jochen Kraft - AMS
Xin Yin - IMEC
Johan Bauwelinck - IMEC
Christian Neumeyr - Vertilas
Francisco Soares - Fraunhofer HHI
Oppermann Hermann - Fraunhofer IZM
Tolga Tekin - Fraunhofer IZM

5. 3:55 PM - Flip-Chip III-V-to-Silicon Photonics Interfaces for Optical Sensor
Yves Martin - IBM Corporation
Jason Orcutt - IBM Corporation
Chi Xiong - IBM Corporation
Laurent Schares - IBM Corporation
Tymon Barwicz - IBM Corporation
Martin Glodde - IBM Corporation
Eric Zhang - IBM Corporation
William Green - IBM Corporation
Victor Dolores-Calzadilla - Fraunhofer HHI Institute
Martin Moehrle - Fraunhofer HHI Institute

6. 4:20 PM - Extremely low-profile single mode fiber array coupler suitable for silicon photonics
Mitsuharu Hirano - Sumitomo Electric Industries, Ltd.
Akira Furuya - Sumitomo Electric Industries, Ltd.
Hideki Machida - Sumitomo Electric Industries, Ltd.
Koichi Koyama - Sumitomo Electric Industries, Ltd.
Yasunori Murakami - Sumitomo Electric Industries, Ltd.
Kazunori Tanaka - Sumitomo Electric Industries, Ltd.

7. 4:45 PM - Micro lens array assembly for optical organic substrates
Patrick Jacques - IBM Bromont
Richard Langlois - IBM Bromont
Koji Masuda - IBM Tokyo Research Lab
Masao Tokunari - IBM Tokyo Research Lab
Hsiang Han Hsu - IBM Tokyo Research Lab
Paul Fortier - IBM Bromont