Technical Program

Thursday, May 30, 2019

Session 23: High-Bandwidth 3D and Photonic Integration
1:30 PM - 5:10 PM
Committee: Photonics
joint with Interconnections

Session Co-Chairs:

Takaaki Ishigure
Keio University
T +81-45-566-1593
ishigure@appi.keio.ac.jp
Dingyou Zhang
Broadcom Inc.
T
dingyouzhang.brcm@gmail.com

Papers: