Technical Program

Thursday, May 30, 2019

Session 21: 5G, mm-Wave, and Antenna-in-Package
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Maciej Wojnowski
Infineon Technologies AG
T +49 89 234 26531
Xiaoxiong (Kevin) Gu
IBM Corporation
T +1-914-945-2292


1. 1:30 PM - Vivaldi Antenna Array Completely Fabricated Using Additive Manufacturing
Vincens Gjokaj - Michigan State University
Cameron Crump - Michigan State University
John Albrecht - Michigan State University
John Papapolymerou - Michigan State University
Premjeet Chahal - Michigan State University

2. 1:55 PM - Novel Multicore PCB and Substrate Solutions for Ultra Broadband Dual Polarized Antennas for 5G Millimeter Wave Covering 25 - 43 GHz
Trang Thai - Intel Corporation
Sidharth Dalmia - Intel Corporation
Josef Hagn - Intel Corporation
Pouya Talebbeydokhti - Intel Corporation
Yossi Tsfati - Intel Corporation

3. 2:20 PM - 3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas
Muhammad Ali - Georgia Institute of Technology
Atom Watanabe - Georgia Institute of Technology
Tong-Hong Lin - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Markondeya Raj Pulugurtha - Florida International University
Manos Tentzeris - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

4. 3:30 PM - Advanced Wafer-Level PKG Solutions for 60GHz WiGig (802.11ad) Telecom Infrastructure
Dapeng Wu - Sivers IMA AB
Robin Dahlbäck - Sivers IMA AB
Erik Öjefors - Sivers IMA AB
Mats Carlsson - Sivers IMA AB

5. 3:55 PM - Antenna and Module Design Considerations for mm-Scale IoT Devices at mm-Wave 5G Frequencies
Arun Paidimarri - IBM Corporation
Duixian Liu - IBM Corporation
Christian Baks - IBM Corporation
Bodhisatwa Sadhu - IBM Corporation
Alberto Valdes-Garcia - IBM Corporation

6. 4:20 PM - Advanced Thin-Profile Fan-Out With Beamforming Verification for 5G Wideband Antenna
Sheng-Chi Hsieh - Advanced Semiconductor Engineering Inc.
Lucus Chu - Advanced Semiconductor Engineering Inc.
Cheng-Yu Ho - Advanced Semiconductor Engineering Inc.
Chen-Chao Wang - Advanced Semiconductor Engineering Inc.

7. 4:45 PM - Integrated Compact Planar Inverted-F Antenna (PIFA) With a Shorting via Wall for Millimeter-Wave Wireless Chip-to-Chip (C2C) Communications in 3D-SiP
Seahee Hwangbo - University of Florida
Renuka Bowrothu - University of Florida
Hae-in Kim - University of Florida
Yong-Kyu Yoon - University of Florida