Technical Program

Thursday, May 30, 2019

Session 21: 5G, mm-Wave, and Antenna-in-Package
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Maciej Wojnowski
Infineon Technologies AG
T +49 89 234 26531
maciej.wojnowski@infineon.com
Xiaoxiong (Kevin) Gu
IBM Corporation
T +1-914-945-2292
xgu@us.ibm.com

Papers: