Technical Program

Thursday, May 31, 2018

Session 21: 5G, mm-Wave, and Antenna-in-Package
1:30 PM - 5:10 PM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

Maciej Wojnowski
Infineon Technologies AG
T +49 89 234 26531
Xiaoxiong (Kevin) Gu
IBM Corporation
T +1-914-945-2292


1. 1:30 PM - 235 GHz Integrated Phased Array using Stacked and Tile Heterogeneous Integration Technologies
Florian Herrault - HRL Laboratories, LLC
Jonathan Lynch - HRL Laboratories, LLC
Gabriel Virbila - HRL Laboratories, LLC
Keerti Kona - HRL Laboratories, LLC
Dave Hammon - HRL Laboratories, LLC
Mike Wetzel - HRL Laboratories, LLC
Dean Regan - HRL Laboratories, LLC
Joel Wang - HRL Laboratories, LLC
Yan Tang - HRL Laboratories, LLC
Eric Prophet - HRL Laboratories, LLC
Partia Naghibi - HRL Laboratories, LLC

2. 1:55 PM - Novel multicore PCB and substrate solutions for ultra broadband dual polarized antennas for 5G millimeter wave covering 25 - 43 GHz
Trang Thai - Intel Corporation
Sidharth Dalmia - Intel Corporation
Josef Hagn - Intel Corporation
Pouya Talebbeydokhti - Intel Corporation
Yossi Tsfati - Intel Corporation

3. 2:20 PM - 3D Glass Package-Integrated, High Performance Power Dividing Networks for 5G Broadband Antennas
Muhammad Ali - Georgia Institute of Technology
Atom Watanabe - Georgia Institute of Technology
Tong-Hong Lin - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Markondeya Raj Pulugurtha - Florida International University
Manos Tentzeris - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

4. 3:30 PM - Advanced Wafer Level PKG solutions for 60GHz WiGig (802.11ad) Telecom Infrastructure
Dapeng Wu - Sivers IMA AB
Robin Dahlbäck - Sivers IMA AB
Erik Öjefors - Sivers IMA AB
Mats Carlsson - Sivers IMA AB

5. 3:55 PM - Antenna and module design considerations for mm-scale IoT devices at mm-wave 5G frequencies
Arun Paidimarri - IBM Thomas J. Watson Research Center
Duixian Liu - IBM Thomas J. Watson Research Center
Christian Baks - IBM Thomas J. Watson Research Center
Bodhisatwa Sadhu - IBM Thomas J. Watson Research Center
Alberto Valdes-Garcia - IBM Thomas J. Watson Research Center

6. 4:20 PM - Advanced Thin-Profile Fan-Out with Beamforming Verification for 5G Wideband Antenna
Sheng-Chi Hsieh - ASE group
Lucus Chu - ASE group
Cheng-Yu Ho - ASE group
Chen-Chao Wang - ASE group

7. 4:45 PM - Integrated Compact Planar Inverted-F Antenna (PIFA) with a shorting via wall for Millimeter-wave Wireless Chip-to-chip (C2C) Communications in 3D-SiP
Seahee Hwangbo - University of Florida
Renuka Bowrothu - University of Florida
Hae-in Kim - University of Florida