Technical Program

Thursday, June 01, 2017

Session 21: 3D Cu-Cu and Micro Bump Bonding Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Katsuyuki Sakuma
IBM Corporation
T +1-914-945-2080
ksakuma@us.ibm.com
Ho-Young Son
SK Hynix
T +82-31-630-2858
hoyoung.son@sk.com

Papers: