Technical Program

Thursday, June 01, 2017

Session 20: MEMS and Sensor Technologies
1:30 PM - 5:10 PM
Committee: Advanced Packaging Room: Southern Hemisphere II

Session Co-Chairs:

Joseph W. Soucy
T +1-617-258-2953
Allyson Hartzell
Veryst Engineering
T 781-433-0433 x330


1. 1:30 PM - Fabrication of 3D Hybrid Pixel Detector Modules Based on TSV Processing and Advanced Flip Chip Assembly of Thin Read Out Chips
Kai Zoschke - Fraunhofer IZM
Hermann Oppermann - Fraunhofer IZM
Pawel Grybos - AGH University of Science and Technology
Krzysztof Kasinski - AGH University of Science and Technology
Piotr Maj - AGH University of Science and Technology
Robert Szczygiel - AGH University of Science and Technology
Thomas Fritzsch - Fraunhofer IZM
Mario Rothermund - Fraunhofer IZM
Steve Voges - Technical University Berlin
Ulf Oestermann - Fraunhofer IZM
Klaus-Dieter Lang - Technical University Berlin

2. 1:55 PM - A Novel Technology for Creating Sensors and Actuators in Processor Packages
Feras Eid - Intel Corporation
Qing Ma - Intel Corporation
Sasha Oster - Intel Corporation
Georgios Dogiamis - Intel Corporation
Thomas Sounart - Intel Corporation
Johanna Swan - Intel Corporation

3. 2:20 PM - Stress-Compensating MEMS Sensor Assembly
Harald Etschmaier - ams AG
Anderson Singulani - ams AG
Coen Tak - ams AG
Kai Zoschke - Fraunhofer IZM
Hermann Oppermann - Fraunhofer IZM
Danny Jaeger - Fraunhofer IZM

4. 3:30 PM - 3D Monolithic Metal Orifice Plate For SERS Application: A Showcase of Low Cost MEMS Packaging
Ning Ge - Hewlett Packard Inc.
Steven Simske - Hewlett Packard Inc.
Jarrid Wittkopf - Hewlett Packard Inc.
Kevin Dooley - Hewlett Packard Inc.
Anita Rogacs - Hewlett Packard Inc.
Helen Holder - Hewlett Packard Inc.
Steven Barcelo - Hewlett Packard Inc.
Robert Ionescu - Hewlett Packard Inc.
Dennis Lazaroff - Hewlett Packard Inc.

5. 3:55 PM - A Phase Sensitive Measurement Technique for Boosted Response Speed of Graphene FET Gas Sensor
Yumeng Liu - UC Berkeley, BSAC
Takeshi Hayasaka - UC Berkeley, BSAC
Yong Cui - UC Berkeley, BSAC
Jiachen Yu - UC Berkeley, BSAC
Yoshihiro Kubota - UC Berkeley, BSAC
Huiliang Liu - UC Berkeley, BSAC
Xiaoqian Li - UC Berkeley, BSAC
Kaiming Hu - UC Berkeley, BSAC
Vaishno Dasika - Texas Instruments, Inc.
Luu Nguyen - Texas Instruments, Inc.
Liwei Lin - UC Berkeley, BSAC

6. 4:20 PM - Comparison of Packaging Concepts for High-Temperature Pressure Sensors at 500 °C
Nilavazhagan Subbiah - University of Freiburg, IMTEK
Surajit Ghosh - University of Freiburg, IMTEK
Juergen Wilde - University of Freiburg, IMTEK
Roderich Zeiser - University of Freiburg, IMTEK

7. 4:45 PM - High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors
Jinghui Xu - Institute of Microelectronics, A*STAR
Zhipeng Ding - Institute of Microelectronics, A*STAR
Vivek Chidambaram - Institute of Microelectronics, A*STAR
Hongmiao Ji - Institute of Microelectronics, A*STAR
Yuandong Gu - Institute of Microelectronics, A*STAR