Technical Program

Thursday, May 30, 2019

Session 20: Fanout and Heterogeneous Integration
1:30 PM - 5:10 PM
Committee: Interconnections

Session Co-Chairs:

Jean-Charles Souriau
CEA Leti
T +33 4 38 78 98 13
jcsouriau@cea.fr
William Chen
Advanced Semiconductor Engineering, Inc.
T +1-408-250-4290
william.chen@aseus.com

Papers:

1. 1:30 PM - Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integration
John Lau - ASM Pacific Technology
Ming Li - ASM Pacific Technology
Margie Li - ASM Pacific Technology
Tong Chen - JCAP
Iris Xu - JCAP

2. 1:55 PM - Experiment of 22FDX® Chip Board Interaction (CBI) in Wafer Level Packaging Fan-Out (WLPFO)
Jae Cho - GLOBALFOUNDRIES
Jens Paul - GLOBALFOUNDRIES
Simone Capecchi - GLOBALFOUNDRIES
Frank Kuechenmeister - GLOBALFOUNDRIES
Ta-Chien Cheng - GLOBALFOUNDRIES

3. 2:20 PM - FOWLP Design for Digital and RF Circuits
Teck Lim - Institute of Microelectronics A*STAR
Soon Wee David Ho - Institute of Microelectronics A*STAR

4. 3:30 PM - Next-Generation of 2 to 7 Micron Ultra-Small Microvias for 2.5D Panel Redistribution Layer by Using Laser and Photolithography Technologies
Fuhan Liu - Georgia Institute of Technology
Chandrasekharan Nair - Georgia Institute of Technology
Atom Watanabe - Georgia Institute of Technology
Bart. H. DeProspo - Georgia Institute of Technology
Atsushi Kubo - Tokyo Ohka Kogyo Co., Ltd. Japan
Rao R. Tummala - Georgia Institute of Technology

5. 3:55 PM - Multiple RDL on Fan-Out Packages
Yi Hang Lin - Taiwan Semiconductor Manufacturing Company Ltd.
T.M. Lai - Taiwan Semiconductor Manufacturing Company Ltd.
P.N. Kavle - Taiwan Semiconductor Manufacturing Company Ltd.
C.H. Lin - Taiwan Semiconductor Manufacturing Company Ltd.
T.J. Fang - Taiwan Semiconductor Manufacturing Company Ltd.
F.C. Hsu - Taiwan Semiconductor Manufacturing Company Ltd.
S.M. Chen - Taiwan Semiconductor Manufacturing Company Ltd.
M.C. Yew - Taiwan Semiconductor Manufacturing Company Ltd.
C.S. Chen - Taiwan Semiconductor Manufacturing Company Ltd.
C.T. Yu - Taiwan Semiconductor Manufacturing Company Ltd.
Shin Puu Jeng - Taiwan Semiconductor Manufacturing Company Ltd.

6. 4:20 PM - Effects of Dielectric Curing Conditions on the Interfacial Adhesion of Cu RDL for Fan-Out Wafer Level Packaging
Gahui Kim - Andong National University
Kirak Son - Andong National University
Dogeun Kim - Andong National University
Seok-Hyun Lee - Samsung Electronics
Young-Bae Park - Andong National University

7. 4:45 PM - Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
Matthias Wietstruck - Innovations for High Performance Microelectronics
Sebastian Schulze - Innovations for High Performance Microelectronics
Bernhard Rebhan - EV Group, Inc.
Peter Kerepesi - EV Group, Inc.
Helmut Kurz - EV Group, Inc.
Gerald Silberer - EV Group, Inc.
Josef Meiler - EV Group, Inc.
Selin Tolunay Wipf - Innovations for High Performance Microelectronics
Christian Wipf - Innovations for High Performance Microelectronics
Mehmet Kaynak - Innovations for High Performance Microelectronics