Technical Program

Thursday, May 31, 2018

Session 20: Fanout and Heterogeneous Integration
1:30 PM - 5:10 PM
Committee: Interconnections

Session Co-Chairs:

Jean-Charles Souriau
CEA Leti
T +33 4 38 78 98 13
jcsouriau@cea.fr
William Chen
Advanced Semiconductor Engineering, Inc.
T +1-408-250-4290
william.chen@aseus.com

Papers:

1. 1:30 PM - RDL-1st Fan-Out Panel Level Packaging (FOPLP) for Heterogeneous and Economical Packaging
Nagendra Sekhar Vasarla - Institute of Microelectronics (A*STAR)
Srinivasa Rao Vempati - Institute of Microelectronics (A*STAR)
F. X Che - Institute of Microelectronics (A*STAR)
Ser Choong Chong - Institute of Microelectronics (A*STAR)
Kazunori Yamamoto - Institute of Microelectronics (A*STAR)

2. 1:55 PM - Experiment of 22FDX® Chip Board Interaction (CBI) in Wafer Level Packaging Fan-Out (WLPFO)
JAE CHO - GLOBALFOUNDRIES
JENS PAUL - GLOBALFOUNDRIES
SIMONE CAPECCHI - GLOBALFOUNDRIES
FRANK KUECHENMEISTER - GLOBALFOUNDRIES
TA-CHIEN CHENG - GLOBALFOUNDRIES

3. 2:20 PM - FOWLP Design for Digital and RF Circuits
Teck Lim - Institute of Microelectronics

4. 3:30 PM - Next Generation of 2 to 7 Micron Ultra-small Microvias for 2.5D Panel Redistribution Layer by using Laser and Photolithography Technologies
Fuhan Liu - Georgia Tech
Chandrasekharan Nair - Georgia Institute of Technology
Atom Watanabe - Georgia Institute of Technology
Bart. H. DeProspo - Georgia Institute of Technology
Atsushi Kubo - Tokyo Ohka Kogyo Co., Ltd., Japan
Rao R. Tummala - Georgia Institute of Technology

5. 3:55 PM - Multiple RDL on Fan-Out Packages
Yi HANG Lin - Taiwan Semiconductor Manufacturing Company
T.M. Lai - Taiwan Semiconductor Manufacturing Company
P.N. Kavle - Taiwan Semiconductor Manufacturing Company
C.H. Lin - Taiwan Semiconductor Manufacturing Company
T.J. Fang - Taiwan Semiconductor Manufacturing Company
F.C. Hsu - Taiwan Semiconductor Manufacturing Company
S.M. Chen - Taiwan Semiconductor Manufacturing Company
P.Y. Lin - Taiwan Semiconductor Manufacturing Company
Shin Puu Jeng - Taiwan Semiconductor Manufacturing Company

6. 4:20 PM - Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integration
John Lau - ASM
Ming Li - ASM
Margie Li - ASM
Tong Chen - JCAP
Iris Xu - JCAP

7. 4:45 PM - Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
Matthias Wietstruck - IHP GmbH
Sebastian Schulze - IHP GmbH
Bernhard Rebhan - EVGroup
Peter Kerepesi - EVGroup
Helmut Kurz - EVGroup
Gerald Silberer - EVGroup
Josef Meiler - EVGroup
Selin Tolunay Wipf - IHP GmbH
Christian Wipf - IHP GmbH
Mehmet Kaynak - IHP GmbH