Technical Program

Wednesday, May 30, 2018

Session 2: Next-Generation Wirebonding and Die Attach
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com
Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
nathan.lower@rockwellcollins.com

Papers:

1. 8:00 AM - SBĀ²-WB a new process solution for advanced wire-bonding
Matthias Fettke - PacTech GmbH
Andrej Kolbasow - PacTech GmbH
Thorsten Teutsch - Pac Tech USA

2. 8:25 AM - Smart Wire Bond Solutions for SiP and Memory Packages
Basil Milton - Kulicke and Soffa, Inc.
Aashish Shah - Kulicke and Soffa, Inc.
Hui Xu - Kulicke and Soffa, Inc.
Odal Kwon - Kulicke and Soffa, Inc.
Gary Schulze - Kulicke and Soffa, Inc.
Ivy Qin - Kulicke and Soffa, Inc.
Nelson Wong - Kulicke and Soffa, Inc.

3. 8:50 AM - Determination of Relationship between Cu-Al IMC Kinetics and Bond Pad Characteristics
Subramani Manoharan - University of Maryland
Chandradip Patel - University of Maryland
Stevan Hunter - ON SEMICONDUCTOR
Patrick McCluskey - University of Maryland

4. 10:00 AM - Au-Rich/Sn-Bi Interconnection in Chip-on-Module Package
Jin Wang - Tsinghua University
Qian Wang - Tsinghua University
Xinnan Hou - GalaxyCore Inc.
Ke Du - GalaxyCore Inc.
Lixin Zhao - GalaxyCore Inc.
Jian Cai - Tsinghua University

5. 10:25 AM - The properties of Cu sinter paste for pressure sintering at low temperature
Jung-Lae Jo - Mitsui Mining & Smelting Co., Ltd.
Shinichi Yamauchi - Mitsui Mining & Smelting Co., Ltd.
Kei Anai - Mitsui Mining & Smelting Co., Ltd.
Takahiko Sakaue - Mitsui Mining & Smelting Co., Ltd.

6. 10:50 AM - Low temperature sintering of dendritic Cu based pastes for power semiconductor device interconnection
gang li - Shenzhen Institute of Advanced Technology
rong sun - Shenzhen Institute of Advanced Technology
Ching-Ping Wong - Shenzhen Institute of Advanced Technology

7. 11:15 AM - A new development of direct bonding to aluminum and nickel surfaces by silver sintering in air atmosphere
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Tamira Stegmann - Hochschule Aschaffenburg, University of Applied Sciences
Erika Schwenk - Hochschule Aschaffenburg, University of Applied Sciences
Monique Dubis - Hochschule Aschaffenburg, University of Applied Sciences
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG