Technical Program

Wednesday, May 29, 2019

Session 2: Next-Generation Wirebonding and Die Attach
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com
Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
nathan.lower@rockwellcollins.com

Papers:

1. 8:00 AM - SB²-WB a New Process Solution for Advanced Wire-Bonding
Matthias Fettke - Pac Tech – Packaging Technologies GmbH
Andrej Kolbasow - Pac Tech – Packaging Technologies GmbH
Georg Friedrich - Pac Tech – Packaging Technologies GmbH
Anna Palys - Pac Tech – Packaging Technologies GmbH
Vinith Bejugam - Pac Tech – Packaging Technologies GmbH
Thorsten Teutsch - Pac Tech – Packaging Technologies GmbH

2. 8:25 AM - Smart Wire Bond Solutions for SiP and Memory Packages
Basil Milton - Kulicke and Soffa, USA
Aashish Shah - Kulicke and Soffa, USA
Hui Xu - Kulicke and Soffa, USA
Odal Kwon - Kulicke and Soffa, USA
Gary Schulze - Kulicke and Soffa, USA
Ivy Qin - Kulicke and Soffa, USA
Nelson Wong - Kulicke and Soffa, Singapore

3. 8:50 AM - Preparation and Application of Cu-Ag Composite Solder Preforms for Power Electronic Packaging
Li Liu - Wuhan University of Technology
Shengfa Liu - Wuhan University of Technology
Hui Xiang - Wuhan University of Technology
Dongxiao Zhang - Wuhan University of Technology
Zhaoxia Zhou - Loughborough University
Stuart Robertson - Loughborough University
Canyu Liu - Loughborough University
Changqing Liu - Loughborough University
Zhiwen Chen - Wuhan University

4. 10:00 AM - Au-Rich/Sn-Bi Interconnection in Chip-on-Module Package
Jin Wang - Tsinghua University
Qian Wang - Tsinghua University
Jian Cai - Tsinghua University
Xinnan Hou - GalaxyCore Inc.
Ke Du - GalaxyCore Inc.
Lixing Zhao - GalaxyCore Inc.

5. 10:25 AM - The Properties of Cu Sinter Paste for Pressure Sintering at Low Temperature
Jung-Lae Jo - Mitsui Mining & Smelting Co., Ltd.
Sinichi Yamauchi - Mitsui Mining & Smelting Co., Ltd.
Kei Anai - Mitsui Mining & Smelting Co., Ltd.
Takahiko Sakaue - Mitsui Mining & Smelting Co., Ltd.

6. 10:50 AM - Low Temperature Sintering of Dendritic Cu Based Pastes for Power Semiconductor Device Interconnection
Gang Li - Shenzhen Institutes of Advanced Technology
Jilei Fan - Shenzhen Institutes of Advanced Technology
Siyuan Liao - Shenzhen Institutes of Advanced Technology
Pengli Zhu - Shenzhen Institutes of Advanced Technology
Baotan Zhang - Shenzhen Institutes of Advanced Technology
Tao Zhao - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Ching-Ping Wong - Shenzhen Institutes of Advanced Technology

7. 11:15 AM - A New Development of Direct Bonding to Aluminum and Nickel Surfaces by Silver Sintering in Air Atmosphere
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG
Tamira Stegmann - Hochschule Aschaffenburg University of Applied Sciences
Erika Schwenk - Hochschule Aschaffenburg University of Applied Sciences
Monique Dubis - Hochschule Aschaffenburg University of Applied Sciences