Technical Program

Wednesday, May 31, 2017

Session 2: TSV Process, Characterization and Applications
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Takafumi Fukushima
Tohoku University
T +81-22-795-6978
fukushima@lbc.mech.tohoku.ac.jp
Voya Markovich
Microelectronic Advanced Hardware Consulting, LLC
T +1-631-544-4625
vojarm@gmail.com

Papers: