Technical Program

Wednesday, May 29, 2019

Session 2: Next-Generation Wirebonding and Die Attach
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com
Nathan Lower
Rockwell Collins, Inc.
T +1-319-295-6687
nathan.lower@rockwellcollins.com

Papers:

1. 8:00 AM - SB²-WB a New Process Solution for Advanced Wire-Bonding
Matthias Fettke - Pac Tech – Packaging Technologies GmbH
Andrej Kolbasow - Pac Tech – Packaging Technologies GmbH
Thorsten Teutsch - Pac Tech – Packaging Technologies GmbH

2. 8:25 AM - Smart Wire Bond Solutions for SiP and Memory Packages
Basil Milton - Kulicke and Soffa, Inc.
Aashish Shah - Kulicke and Soffa, Inc.
Hui Xu - Kulicke and Soffa, Inc.
Odal Kwon - Kulicke and Soffa, Inc.
Gary Schulze - Kulicke and Soffa, Inc.
Ivy Qin - Kulicke and Soffa, Inc.
Nelson Wong - Kulicke and Soffa, Inc.

3. 8:50 AM - Determination of Relationship Between Cu-Al IMC Kinetics and Bond Pad Characteristics
Subramani Manoharan - University of Maryland
Chandradip Patel - University of Maryland
Stevan Hunter - ON Semiconductor
Patrick McCluskey - University of Maryland

4. 10:00 AM - Au-Rich/Sn-Bi Interconnection in Chip-on-Module Package
Jin Wang - Tsinghua University
Qian Wang - Tsinghua University
Xinnan Hou - GalaxyCore Inc.
Ke Du - GalaxyCore Inc.
Lixin Zhao - GalaxyCore Inc.
Jian Cai - Tsinghua University

5. 10:25 AM - The Properties of Cu Sinter Paste for Pressure Sintering at Low Temperature
Jung-Lae Jo - Mitsui Mining & Smelting Co., Ltd.
Shinichi Yamauchi - Mitsui Mining & Smelting Co., Ltd.
Kei Anai - Mitsui Mining & Smelting Co., Ltd.
Takahiko Sakaue - Mitsui Mining & Smelting Co., Ltd.

6. 10:50 AM - Low Temperature Sintering of Dendritic Cu Based Pastes for Power Semiconductor Device Interconnection
Gang Li - Shenzhen Institutes of Advanced Technology
Rong Sun - Shenzhen Institutes of Advanced Technology
Ching-Ping Wong - Shenzhen Institutes of Advanced Technology

7. 11:15 AM - A New Development of Direct Bonding to Aluminum and Nickel Surfaces by Silver Sintering in Air Atmosphere
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Tamira Stegmann - Hochschule Aschaffenburg University of Applied Sciences
Erika Schwenk - Hochschule Aschaffenburg University of Applied Sciences
Monique Dubis - Hochschule Aschaffenburg University of Applied Sciences
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG