Technical Program

Thursday, May 30, 2019

Session 18: Warpage and Material Performance
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
lall@auburn.edu
Karsten Meier
Technische Universit├Ąt Dresden
T +49 351 463 - 36 594
karsten.meier@tu-dresden.de

Papers:

1. 8:00 AM - Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages
Xuejun Fan - Lamar University
Rahul Joshi - Advanced Micro Devices, Inc.
Keith Newman - Advanced Micro Devices, Inc.
Lulu Ma - Lamar University

2. 8:25 AM - Study of Thermal Aging Behavior of Epoxy Molding Compound for Applications in Harsh Environments
Przemyslaw Gromala - Robert Bosch GmbH
Alexandru Prisacaru - Robert Bosch GmbH
Martin Fleischman - Robert Bosch GmbH
Erick Franieck - Robert Bosch GmbH
Adwait Inamdar - Robert Bosch GmbH
Agnes Veres - Robert Bosch Kft
Csaba Nemeth - Robert Bosch Kft
Yu-Hsiang Yang - University of Maryland
Bongtae Han - University of Maryland

3. 8:50 AM - Warpage Variation Analysis and Model Prediction for Molded Packages
Yuling Niu - Qualcomm Technologies, Inc.
Wei Wang - Qualcomm Technologies, Inc.
Zhijie Wang - Qualcomm Technologies, Inc.
Mark Schwarz - Qualcomm Technologies, Inc.
Ahmer Syed - Qualcomm Technologies, Inc.
Karthik Dhandapani - Qualcomm Technologies, Inc.

4. 10:00 AM - Peridynamics for Predicting Thermal Expansion Coefficient of Graphene
Erdogan Madenci - The University of Arizona
Atila Barut - The University of Arizona
Mehmet Dorduncu - The University of Arizona

5. 10:25 AM - Machine Learning Approach to Improve Accuracy of Warpage Simulations
Cheryl Selvanayagam - Singapore University of Technology and Design
Pham Luu Trung Duong - Singapore University of Technology and Design
Rathin Mandal - Advanced Micro Devices Inc.
Nagarajan Raghavan - Singapore University of Technology and Design

6. 10:50 AM - Study on Warpage of Fan-Out Panel Level Packaging (FO-PLP) Using Gen-3 Panel
Fa Xing Che - Institute of Microelectronics A*STAR
Kazunori Yamamoto - Institute of Microelectronics A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics A*STAR
Varsala Nagendra Sekhar - Institute of Microelectronics A*STAR

7. 11:15 AM - Mechanical Properties of Intermetallic Compounds at Elevated Temperature by Nanoindentation
Fan Yang - Wuhan University
Sheng Liu - Wuhan University
Zhaoxia Zhou - Loughborough University
Zhiwen Chen - Wuhan University
Li Liu - Wuhan University of Technology
Canyu Liu - Loughborough University
Changqing Liu - Loughborough University