Technical Program

Thursday, June 01, 2017

Session 18: Warpage, Electromigration and Mechanical Characterization
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Southern Hemisphere V

Session Co-Chairs:

Xuejun Fan
Lamar University
T +1-409-880-7792
xuejun.fan@lamar.edu
Jiantao Zheng
Qualcomm Technologies, Inc.
T +1-858-658-5738
jiantaoz@qti.qualcomm.com

Papers: