Technical Program

Thursday, June 01, 2017

Session 18: Warpage, Electromigration and Mechanical Characterization
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Southern Hemisphere V

Session Co-Chairs:

Xuejun Fan
Lamar University
T +1-409-880-7792
xuejun.fan@lamar.edu
Jiantao Zheng
Qualcomm Technologies, Inc.
T +1-858-658-5738
jiantaoz@qti.qualcomm.com

Papers:

1. 8:00 AM - Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments
Pradeep Lall - Auburn University
Shantanu Deshpande - Auburn University
Yihua Luo - Auburn University
Luu Nguyen - Texas Instruments

2. 8:25 AM - Interfacial Delamanination of Mold Compound in Fan-out Packages
V.N.N. Trilochan Rambhatla - Georgia Institute of Technology
David Samet - Georgia Institute of Technology
P Markondeya Raj - Georgia Institute of Technology
Satomi Kawamoto, - Georgia Institute of Technology
Rao R. Tummala - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

3. 8:50 AM - Non-Linear Viscoelastic Modeling of Epoxy Based Molding Compound for Large Deformations Encountered in Power Modules
Przemyslaw Gromala - Robert Bosch
Alexandru Prisacaru - Robert Bosch
Mateus Jeronimo - Robert Bosch
Hyun-Seop Lee - University of Maryland
Yong Sun - University of Maryland
Bongtae Han - University of Maryland

4. 10:00 AM - Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages
Shu-Shen Yeh - TSMC
Po-Yao Lin - TSMC
Kuang-Chun Lee - TSMC
Jin-Hua Wang - TSMC
Wen-Yi Lin - TSMC
Ming-Chih Yew - TSMC
Po-Chen Lai - TSMC
Shyue-Ter Leu - TSMC
Shin-Puu Jeng - TSMC

5. 10:25 AM - Wafer Form Warpage Characterization Based on Composite Factors Including Passivation Films, Re-Distribution Layers, Epoxy Molding Compound Utilized in Innovative Fan-Out Package
Cheng-Hsiang Liu - SPIL
Lu-Yi Chen - SPIL
Chang-Lun Lu - SPIL
Hung-Chi Chen - SPIL
Cheng-Yi Chen - SPIL
Shou-Chi Chang - SPIL

6. 10:50 AM - Co-Design for Low Warpage and High Reliability in Advanced Package with TSV-Free Interposer (TFI)
Faxing Che - IME, A*STAR
Masaya Kawano - IME, A*STAR
M.Z. Ding - IME, A*STAR
Yong Han - IME, A*STAR
S. Bhattacharya - IME, A*STAR

7. 11:15 AM - Finite Elements for Electromigration Analysis
Elena E. Antonova - Ansys
David C. Looman - Ansys