Technical Program

Thursday, May 30, 2019

Session 17: Materials and Design for Reliability of Next-Generation Packages
8:00 AM - 11:40 AM
Committee: Applied Reliability

Session Co-Chairs:

Varughese Mathew
NXP Semiconductors
T +1-512-895-6293
varughese.mathew@nxp.com
Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com

Papers:

1. 8:00 AM - Highly (111)-Oriented Nanotwinned Cu for High Fatigue Resistance in Fan-Out Wafer-Level Packaging
Yu-Jin Li - National Chiao Tung University
Chih-Han Theng - National Chiao Tung University
I-Hsin Tseng - National Chiao Tung University
Benson Lin - MediaTek Inc.
Chia-Cheng Chang - MediaTek Inc.
Chih Chen - National Chiao Tung University

2. 8:25 AM - WLCSP Package/PCB Design for Board Level Reliability
Jason Chiu - Taiwan Semiconductor Manufacturing Company Ltd.
Kuo-Chin Chang - Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao - Taiwan Semiconductor Manufacturing Company Ltd.
Steve Hsu - Taiwan Semiconductor Manufacturing Company Ltd.
Mirng-Ji Lii - Taiwan Semiconductor Manufacturing Company Ltd.

3. 8:50 AM - Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics
Rajesh Sivasubramony - Binghamton University
Ashwin Zachariah - Binghamton University
M. Alhendi - Binghamton University
M. Yadav - Binghamton University
Peter Borgesen - Binghamton University
Mark Poliks - GE Global Research
Nancy Stoffel - GE Global Research
David Shaddock - GE Global Research
Liang Yin - GE Global Research

4. 10:00 AM - The How and Why of Biased Humidity Tests with Copper Wire
Amar Mavinkurve - NXP Semiconductors
Rene Rongen - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors
Orla O'Halloran - NXP Semiconductors
Mark Luke Farrugia - NXP Semiconductors
Leon Goumans - NXP Semiconductors
Erik van Olst - NXP Semiconductors

5. 10:25 AM - Twist Testing for Flexible Electronics
Justin Chow - Georgia Institute of Technology
Jeffrey Meth - DuPont
Suresh Sitaraman - Georgia Institute of Technology

6. 10:50 AM - Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints
Sa'd Hamasha - Auburn University
Mohd Aminul Hoque - Auburn University
Sinan Su - Auburn University
Md Mahmudur Chowdhury - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University
John L. Evans - Auburn University

7. 11:15 AM - Reliability Studies of Silicon Interconnect Fabric
Niloofar Shakoorzadeh - University of California, Los Angeles
Siva Chandra Jangam - University of California, Los Angeles
Kaysar Rahim - Global Foundries
Pranav Ambhore - University of California, Los Angeles
Han Chien - National Chiao Tung University
Amir Hannah - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles