Technical Program

Thursday, June 01, 2017

Session 17: Materials and Processes for Flexible and Wearable Devices
8:00 AM - 11:40 AM
Committee: Emerging Technologies
Room: Southern Hemisphere IV

Session Co-Chairs:

C. S. Premachandran
GLOBALFOUNDRIES
T +1-518-305-7317
premachandran.cs@globalfoundries.com
Ankur Agrawal
Intel Corporation
T
ankur.agrawal@intel.com

Papers:

1. 8:00 AM - Nanoparticle Based Printed Sensors on Paper for Detecting Chemical Species
Jack Lombardi - Binghamton University
Mark Poliks - Binghamton University
Ning Kang - Binghamton University
Shan Yan - Binghamton University
Jing Li - Binghamton University
Wei Zhao - Binghamton University
Jin Luo - Binghamton University
Chuan-Jian Zhong - Binghamton University
Ziang Pan - Binghamton University
Mihdhar Almihdhar - Stony Brook University
Benjamin Hsiao - Stony Brook University

2. 8:25 AM - Phototriggerable Transient Electronics: Materials and Concepts
Oluwadamilola Phillips - Georgia Institute of Technology
Jared Schwartz - Georgia Institute of Technology
Anthony Engler - Georgia Institute of Technology
Gerald Gourdin - Georgia Institute of Technology
Paul Kohl - Georgia Institute of Technology

3. 8:50 AM - Synthesis of a Soft Nanocomposite for Flexible, Wearable Bioelectronics
Fabrice Fondjo - Washington State University
Dong Sup Lee - Virginia Commonwealth University
Connor Howe - Virginia Commonwealth University
Woon-Hong Yeo - Virginia Commonwealth University
Jong-Hoon Kim - Washington State University

4. 10:00 AM - BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications
Mesut Inac - Technical University Berlin
Matthias Wietstruck - IHP Microelectronics
Alexander Göritz - IHP Microelectronics
Barbaros Cetindogan - IHP Microelectronics
Canan Baristiran-Kaynak - IHP Microelectronics
Steffen Marschmeyer - IHP Microelectronics
Mirko Fraschke - IHP Microelectronics
Thomas Voss - IHP Microelectronics
Andreas Mai - IHP Microelectronics
Mehmet Kaynak - IHP Microelectronics
Cristiano Palego - IHP Microelectronics

5. 10:25 AM - Enhanced Thermal Performance Polyimide (PI) for Improved Flexible Electronic Application
Manuela Loeblein - Nanyang Technological University
Theo Levert - Nanyang Technological University
Emiliano Pallecchi - Nanyang Technological University
Siu Hon Tsang - Nanyang Technological University
Edwin Hang Tong Teo - Nanyang Technological University

6. 10:50 AM - Nanolaminated CoNiFe Cores with Dip-Coated Fluoroacrylic Polymer Interlamination Insulation: Fabrication, Electrical Characterization, and Performance Reliability
Minsoo Kim - University of Pennsylvania
Jooncheol Kim - Georgia Institute of Technology
Mark G. Allen - University of Pennsylvania

7. 11:15 AM - Test-Protocol for Assessment of Flexible Power Sources in Foldable Wearable Electronics under Stresses of Daily Motion During Operation
Pradeep Lall - Auburn University
Hao Zhang - Auburn University