Technical Program

Thursday, May 30, 2019

Session 17: Materials and Design for Reliability of Next-Generation Packages
8:00 AM - 11:40 AM
Committee: Applied Reliability

Session Co-Chairs:

Varughese Mathew
NXP Semiconductors
T +1-512-895-6293
varughese.mathew@nxp.com
Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com

Papers: