Technical Program

Thursday, May 31, 2018

Session 17: Materials and Design for Reliability of Next-Generation Packages
8:00 AM - 11:40 AM
Committee: Applied Reliability

Session Co-Chairs:

Varughese Mathew
NXP Semiconductors
T +1-512-895-6293
varughese.mathew@nxp.com
Lakshmi N. Ramanathan
Microsoft Corporation
T +1-425-421-3838
laramana@microsoft.com

Papers:

1. 8:00 AM - Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging
Yu-Jin Li - National Chiao Tung University
Chih-Han Tseng - National Chiao Tung University
I-Hsin Tseng - National Chiao Tung University
Benson Lin - MediaTek Inc.
Chia-Cheng Chang - MediaTek Inc.
Chih Chen - National Chiao Tung University

2. 8:25 AM - WLCSP Package/PCB Design for Board Level Reliability Improvement
Jason Chiu - Taiwan Semiconductor Manufacturing Company
Kuo-Chin Chang - Taiwan Semiconductor Manufacturing Company
Pei-Haw Tsao - Taiwan Semiconductor Manufacturing Company
Steve Hsu - Taiwan Semiconductor Manufacturing Company
Mirng-Ji Lii - Taiwan Semiconductor Manufacturing Company

3. 8:50 AM - A Proven Method to Enhance RDL Crack Detectability in BLR for WLP by Design of Experiment and Simulation Techniques
David Gani - STMicroelectronics
Yong Chen - STMicroelectronics
Daniel Yap - STMicroelectronics
Wei Zhen Goh - STMicroelectronics

4. 10:00 AM - The how and why of biased humidity tests with copper wire
Amar Mavinkurve - NXP Semiconductors
Rene Rongen - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors
Orla O'Halloran - NXP Semiconductors
Mark Luke Farrugia - NXP Semiconductors
Leon Goumans - NXP Semiconductors
Erik van Olst - NXP Semiconductors

5. 10:25 AM - In-Situ Photoelastic Measurement of Temperature Dependent Stresses in Copper Through-Glass Via (TGV) Substrate
Chukwudi Okoro - Corning, Inc.
William Furnas - Corning, Inc.
Shrisudersan Jayaraman - Corning, Inc.
Scott Pollard - Corning, Inc.

6. 10:50 AM - Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead Free Solder Joints
Md Mahmudur Chowdhury - Auburn University
Mohd Aminul Hoque - Auburn University
Sinan Su - Auburn University
Sa'd Hamasha - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

7. 11:15 AM - Improving Reliability of Si Interconnect Fabric (Si-IF)
Niloofar Shakoorzadeh - University of California, Los Angeles
Siva Chandra Jangam - University of California, Los Angeles
Pranav Ambhore - University of California, Los Angeles
Han Chien - National Chiao Tung University, Taiwan
Amir Hannah - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles