Technical Program

Thursday, May 30, 2019

Session 16: Advanced Materials for High-Speed Electronics
8:00 AM - 11:40 AM
Committee: Materials & Processing

Session Co-Chairs:

Yoichi Taira
Keio University
T +81-3-3300-0489
taira@appi.keio.ac.jp
Yu-Hua Chen
Unimicron
T +886-3-5995899#2109
yh_chen@unimicron.com

Papers: