Technical Program

Thursday, May 30, 2019

Session 15: High-Bandwidth Packaging
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

P. Markondeya Raj
Florida International University
T +1-404 558 2615
mpulugur@fiu.edu
Amit P. Agrawal
Microsemi Corporation
T +1-408-666-8452
amit.agrawal@microsemi.com

Papers:

1. 8:00 AM - Electrical Performance Limits of Fine-Pitch Interconnects for Heterogeneous Integration
Ahmet Durgun - Intel Corporation
Zhiguo Qian - Intel Corporation
Kemal Aygun - Intel Corporation
Ravi Mahajan - Intel Corporation
Tim Tri Hoang - Intel Corporation
Sergey Shumarayev - Intel Corporation

2. 8:25 AM - A High-Bandwidth Fine-Pitch 2.57Tbps/mm In-Package Communication Link Achieving 48fJ/Bit/mm Efficiency
Nicolas Pantano - IMEC
Geert Van der Plas - IMEC
Pieter Bex - IMEC
Philip Nolmans - IMEC
Dimitrios Velenis - IMEC
Marian Verhelst - KU Leuven
Eric Beyne - IMEC

3. 8:50 AM - A New SI-PI Co-Simulation Approach for Efficient Consideration of Coupling Between PDN and SDN
Heeseok Lee - Samsung Electronics Company, Ltd
Jisoo Hwang - Samsung Electronics Company, Ltd
Youngmin Shin - Samsung Electronics Company, Ltd

4. 10:00 AM - Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications
Chuei-Tang Wang - Taiwan Semiconductor Manufacturing Company Ltd.
Jeng-Shien Hsieh - Taiwan Semiconductor Manufacturing Company Ltd.
Victor C. Y. Chang - Taiwan Semiconductor Manufacturing Company Ltd.
Shih-Ya Huang - Taiwan Semiconductor Manufacturing Company Ltd.
T. Ko - Taiwan Semiconductor Manufacturing Company Ltd.
Han-Ping Pu - Taiwan Semiconductor Manufacturing Company Ltd.
Douglas Yu - Taiwan Semiconductor Manufacturing Company Ltd.

5. 10:25 AM - 28GHz Band Pass Filter Using Through Fused Silica Via (TFV) Technology
Renuka Bowrothu - University of Florida
Seahee Hwangbo - University of Florida
Yong Kyu Yoon - University of Florida
Anthony Ng'Oma - Corning, Inc.
Cheolbok Kim - Corning, Inc.

6. 10:50 AM - Innovative Packaging Solutions of 3D Double Side Molding With System in Package for IoT and 5G Application
Mike Tsai - Siliconware Precision Industries Co., Ltd.
Ryan Chiu - Siliconware Precision Industries Co., Ltd.
Dick Huang - Siliconware Precision Industries Co., Ltd.
Feng Kao - Siliconware Precision Industries Co., Ltd.
Eric He - Siliconware Precision Industries Co., Ltd.
J. Y. Chen - Siliconware Precision Industries Co., Ltd.
Simon Chen - Siliconware Precision Industries Co., Ltd.
Jensen Tsai - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.

7. 11:15 AM - Enhancing Efficiency of Antenna-in-Package (AiP) by Through-Silicon-Interposer (TSI) With Embedded Air Cavity and Polyimide Dielectric Micro-Substrate
Yunna Sun - Shanghai Jiao Tong University
Yunting Sun - Shanghai Jiao Tong University
Jiangbo Luo - Shanghai Jiao Tong University
Huiying Wang - Shanghai Jiao Tong University
Zhuoqing Yang - Shanghai Jiao Tong University
Yan Wang - Shanghai Jiao Tong University
Guifu Ding - Shanghai Jiao Tong University
Kwangwoo Han - Samsung