Technical Program

Thursday, June 01, 2017

Session 15: Flip Chip and Embedding in Substrates
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Southern Hemisphere III

Session Co-Chairs:

Markus Leitgeb
AT&S
T +43-676-8955-4087
m.leitgeb@ats.net
Steffen Kroehnert
Nanium S.A.
T +49-171-5639472
steffen.kroehnert@nanium.com

Papers:

1. 8:00 AM - Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
Yves Martin - IBM Corporation
Swetha Kamlapurkar - IBM Corporation
Jae-Woong Nah - IBM Corporation
Nathan Marchack - IBM Corporation
Tymon Barwicz - IBM Corporation

2. 8:25 AM - Large Scale Cryogenic Integration Approach for Superconducting High-Performance Computing
Rabindra Das - MIT Lincoln Laboratory
Vladimir Bolkhovsky - MIT Lincoln Laboratory
Sergey Tolpygo - MIT Lincoln Laboratory
Pascale Gouker - MIT Lincoln Laboratory
Leonard Johnson - MIT Lincoln Laboratory
Eric Dauler - MIT Lincoln Laboratory
Mark Gouker - MIT Lincoln Laboratory

3. 8:50 AM - Dense and Highly Elastic Compressible MicroInterconnects (CMIs) for Electronic Microsystems
Paul K. Jo - Georgia Institute of Technology
Muneeb Zia - Georgia Institute of Technology
Joe L. Gonzalez - Georgia Institute of Technology
Muhannad S. Bakir - Georgia Institute of Technology

4. 10:00 AM - New Resin Materials for High Power Embedding
Michael Guyenot - Robert Bosch GmbH
Christiane Mager - Robert Bosch GmbH
Roumen Ratchev - Robert Bosch GmbH
Thomas Gottwald - Schweizer Electronic
Sascha Kreuer - Isola
A. Khoshamouz - Schweizer Electronic

5. 10:25 AM - Advanced Embedded Packaging for Power Devices
Naoki Hayashi - J-Devices Corporation
Miki Nakashima - J-Devices Corporation
Hiroshi Demachi - J-Devices Corporation
Shingo Nakamura - J-Devices Corporation
Tomoshige Chikai - J-Devices Corporation
Yukari Imaizumi - J-Devices Corporation
Fumihiko Taniguchi - J-Devices Corporation
Yoshihiko Ikemoto - J-Devices Corporation
Mitsuru Ooida - J-Devices Corporation
Akito Yoshida - J-Devices Corporation

6. 10:50 AM - Development of Large-Size CPU Package Structure Using Embedded Thin Film Capacitor Package Substrate
Masateru Koide - Fujitsu Advanced Technologies Limited
Kenji Fukuzono - Fujitsu Advanced Technologies Limited
Manabu Watanabe - Fujitsu Advanced Technologies Limited
Daisuke Mizutani - Fujitsu Laboratories, Ltd.
Tomoyuki Akahoshi - Fujitsu Laboratories, Ltd.
Hedehiko Fujisaki - Fujitsu Interconnect Technologies Ltd.
Seigo Yamawaki - Fujitsu Laboratories, Ltd.
Kei Fukui - Fujitsu Laboratories, Ltd.

7. 11:15 AM - Laminate Chip Embedding Technology - Impact of Material Choice and Processing for Very Thin Die Packaging
Angela Kessler - Infineon Technologies
Andreas Munding - Infineon Technologies
Thorsten Scharf - Infineon Technologies
Boris Plikat - Infineon Technologies
Klaus Pressel - Infineon Technologies