Technical Program

Thursday, May 31, 2018

Session 15: High-Bandwidth Packaging
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

P. Markondeya Raj
Florida International University
T +1-404 558 2615
mpulugur@fiu.edu
Amit P. Agrawal
Microsemi Corporation
T +1-408-666-8452
amit.agrawal@microsemi.com

Papers:

1. 8:00 AM - Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration
Ahmet Durgun - Intel Corporation
Zhiguo Qian - Intel Corporation
Kemal Aygun - Intel Corporation
Ravi Mahajan - Intel Corporation
Tim Tri Hoang - Intel Corporation
Sergey Shumarayev - Intel Corporation

2. 8:25 AM - A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency.
Nicolas Pantano - IMEC
Geert Van der Plas - imec
Pieter Bex - IMEC
Philip Nolmans - imec
Dimitrios Velenis - IMEC
Marian Verhelst - KU Leuven
Eric Beyne - IMEC

3. 8:50 AM - A new SI-PI co-simulation approach for efficient consideration of coupling between PDN and SDN
Heeseok Lee - Samsung Electronics Company, Ltd
Jisoo Hwang - Samsung Electronics Company, Ltd
Youngmin Shin - Samsung Electronics Company, Ltd

4. 10:00 AM - Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications
Chuei-Tang Wang - tsmc
Jeng-Shien Hsieh - tsmc
Victor C. Y. Chang - tsmc
Shih-Ya Huang - tsmc
T. Ko - tsmc
Han-Ping Pu - tsmc
Douglas Yu - tsmc

5. 10:25 AM - 28GHz Band Pass Filter using Through Fused Silica Via (TFV) Technology
Renuka Bowrothu - University of Florida
Seahee Hwangbo - University of Florida
Yong Kyu Yoon - University of Florida
Anthony Ng'Oma - Corning Inc.
Cheolbok Kim - Corning Inc.

6. 10:50 AM - Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application
Mike Tsai - Siliconware Precision Industries Co. Ltd.
Ryan Chiu - Siliconware Precision Industries Co. Ltd.
Dick Huang - Siliconware Precision Industries Co. Ltd.
Feng Kao - Siliconware Precision Industries Co. Ltd.
Eric He - Siliconware Precision Industries Co. Ltd.
J. Y. Chen - Siliconware Precision Industries Co. Ltd.
Simon Chen - Siliconware Precision Industries Co. Ltd.
Jensen Tsai - Siliconware Precision Industries Co. Ltd.
Yu-Po Wang - Siliconware Precision Industries Co. Ltd.

7. 11:15 AM - Enhancing Efficiency of Antenna-in-Package (AiP) by Through-Silicon-Interposer (TSI) with Embedded Air Cavity and Polyimide Dielectric Micro-substrate
Yunna sun - Shanghai Jiao Tong University
Yating Sun Jiangbo Luo Zhuoqing Yang Yan Wang Guifu Ding