Technical Program

Thursday, June 01, 2017

Session 15: Flip Chip and Embedding in Substrates
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Southern Hemisphere III

Session Co-Chairs:

Markus Leitgeb
AT&S
T +43-676-8955-4087
m.leitgeb@ats.net
Steffen Kroehnert
Nanium S.A. - Dresden Office
T +49-171-5639472
steffen.kroehnert@nanium.com

Papers: