Technical Program

Thursday, May 30, 2019

Session 15: High-Bandwidth Packaging
8:00 AM - 11:40 AM
Committee: High-Speed, Wireless & Components

Session Co-Chairs:

P. Markondeya Raj
Florida International University
T +1-404 558 2615
mpulugur@fiu.edu
Amit P. Agrawal
Microsemi Corporation
T +1-408-666-8452
amit.agrawal@microsemi.com

Papers: