Technical Program

Thursday, June 01, 2017

Session 14: Heterogeneous Integration
8:00 AM - 11:40 AM
Committee: Advanced Packaging
joint with Assembly & Manufacturing Technology
Room: Southern Hemisphere II

Session Co-Chairs:

John Knickerbocker
IBM Corporation
T +1-914-945-3306
knickerj@us.ibm.com
Chunho Kim
Medtronic Corporation
T +1-480-377-3664
chunho.kim@medtronic.com

Papers:

1. 8:00 AM - A Versatile Platform Towards High Reliability Compact Package for Digital Chips
Christine Ferrandon - CEA-LETI
Laetitia Castagné - CEA-LETI
Brahim Kholti - CEA-LETI
Guillaume Waltener - CEA-LETI
Vincent Puyal - CEA-LETI
Romain Lemaire - CEA-LETI
Lionel Toffanin - ST Microelectronics
Jean-Charles Souriau - CEA-LETI
Gilles Simon - CEA-LETI
T. Lacrevaz - IMEP-LAHC Laboratory
J-P. Peltier - e2v semiconductors

2. 8:25 AM - Glass Based 3D-IPD Integrated RF ASIC in WLCSP
Teck Chong Lee - ASE
Long-Ching Wang - Marvell Semiconductor
Yung-Shun Chang - ASE
Sheng-Chi Hsieh - ASE
Pao-Nan Lee - ASE
Yu-Chang Hsieh - ASE
Che-Ming Hsu - ASE
Lijuan Zhang - Marvell Semiconductor
, - ASE

3. 8:50 AM - Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
Yu-Tao Yang - National Chiao Tung University
Ting-Yang Yu - National Chiao Tung University
Shu-Chiao Kuo - National Chiao Tung University
Tai-Yuan Huang - Unimicron
Kai-Ming Yang - Unimicron
Cheng-Ta Ko - Unimicron
Yu-Hua Chen - Unimicron
Tzyy-Jang Tseng - Unimicron
Kuan-Neng Chen - National Chiao Tung University

4. 10:00 AM - Heterogeneous Interposer Based Integration of Chips with Copper Pillars and C4 Balls to Achieve High Speed Interfaces for ADC Application
Andy Heinig - Fraunhofer IIS/EAS
Michael Dittrich - Fraunhofer IIS/EAS
Fabian Hopsch - Fraunhofer IIS/EAS
Robert Trieb - Fraunhofer IIS/EAS

5. 10:25 AM - “FlexTrate®” - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
Tak Fukushima - UCLA
Arsalan Alam - UCLA
Saptadeep Pal - UCLA
Zhe Wan - UCLA
Siva Jangam - UCLA
Goutham Ezhilarasu - UCLA
Adeel Bajwa - UCLA
Subramanian Iyer - UCLA

6. 10:50 AM - Metal Contamination Evaluation of Via-Last Cu TSV Process Using Notchless Si Etching and Wet Cleaning of the First Metal Layer
Naoya Watanabe - AIST
Hidekazu Kikuchi - LAPIS Semiconductor
Azusa Yanagisawa - LAPIS Semiconductor
Haruo Shimamoto - AIST
Katsuya Kikuchi - AIST
Masahiro Aoyagi - AIST
Akio Nakamura - LAPIS Semiconductor

7. 11:15 AM - A Highly-Miniaturized System Integration Approach for an IOT Contact-less Power Module
Srikrishna Sitaraman - Tyco Electronics
Shaoyong Wang - Tyco Electronics
Tony Contreras - Tyco Electronics
Jian Wang - Tyco Electronics
Mingjie Fan - Tyco Electronics
Yuming Song - Tyco Electronics
Terry Bowen - Tyco Electronics