Technical Program

Thursday, May 30, 2019

Session 14: Fine-Pitch Solderless Bonding
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Chuan Seng Tan
Nanyang Technological University
T +65-67905636
tancs@alum.mit.edu
Tom Gregorich
Zeiss Semiconductor Manufacturing Technology
T +1 208-297-0138
tmgregorich@gmail.com

Papers:

1. 8:00 AM - Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
SivaChandra Jangam - University of California, Los Angeles
Adeel Bajwa - Kulicke & Soffa Industries, Inc.
Umesh Mogera - University of California, Los Angeles
Pranav Ambhore - University of California, Los Angeles
Tom Colosimo - Kulicke & Soffa Industries, Inc.
Bob Chylak - Kulicke & Soffa Industries, Inc.
Subramanian Iyer - University of California, Los Angeles

2. 8:25 AM - Low-Temperature Cu Interconnect With Chip-to-Wafer Hybrid Bonding
Guilian Gao - Xperi Corporation
Laura Mirkarimi - Xperi Corporation
Catharina Rudolph - Fraunhofer, IZM
Thomas Werner - Fraunhofer, IZM
Anke Hanisch - Fraunhofer, IZM
Thomas Workman - Xperi Corporation
Gill Fountain - Xperi Corporation
Jeremy Theil - Xperi Corporation
Gabe Guevara - Xperi Corporation
Ping Liu - Xperi Corporation
Bongsub Lee - Xperi Corporation

3. 8:50 AM - Cu Microstructure of High Density Cu Hybrid Bonding Interconnection
Seokho Kim - Samsung Electronics Company, Ltd.
Pilkyu Kang - Samsung Electronics Company, Ltd.
Taeyeong Kim - Samsung Electronics Company, Ltd.
Kyuha Lee - Samsung Electronics Company, Ltd.
Joohee Jang - Samsung Electronics Company, Ltd.
Kwangjin Moon - Samsung Electronics Company, Ltd.
Hoonjoo Na - Samsung Electronics Company, Ltd.
Sangjin Hyun - Samsung Electronics Company, Ltd.
Kihyun Hwang - Samsung Electronics Company, Ltd.

4. 10:00 AM - Low-Resistance and High-Strength Copper Direct Bonding in No-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper
Jing-Ye Juang - National Chiao Tung University
Kai-Cheng Shie - National Chiao Tung University
Po-Ning Hsu - National Chiao Tung University
Yu-Jin Li - National Chiao Tung University
K. N. Tu - University of California, Los Angeles
Chih Chen - National Chiao Tung University

5. 10:25 AM - Sub-10µm Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization
John P. Mudrick - Sandia National Laboratories
Jonatan A. Sierra-Suarez - Sandia National Laboratories
Matthew B. Jordan - Sandia National Laboratories
T. A. Friedmann - Sandia National Laboratories
Robert Jarecki - Sandia National Laboratories
M. David Henry - Sandia National Laboratories

6. 10:50 AM - Cu Pillar with Nanocopper Caps: The Next Interconnection Node Beyond Traditional Cu Pillar
Ramon Sosa - Georgia Institute of Technology
Kashyap Mohan - Georgia Institute of Technology
Antonia Antoniou - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Luu Nguyen - Texas Instruments Inc.

7. 11:15 AM - Cu-Cu Bonding by Low-Temperature Sintering of Self-Healable Cu Nanoparticles
Junjie Li - Huazhong University of Science and Technology
Qi Liang - Huazhong University of Science and Technology
Chen Chen - Huazhong University of Science and Technology
Tielin Shi - Huazhong University of Science and Technology
Guanglan Liao - Huazhong University of Science and Technology
Zirong Tang - Huazhong University of Science and Technology