Technical Program

Thursday, May 31, 2018

Session 14: Fine-Pitch Solderless Bonding
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Chuan Seng Tan
Nanyang Technological University
T +65-67905636
tancs@alum.mit.edu
Tom Gregorich
Zeiss Semiconductor Manufacturing Technology
T +1 208-297-0138
tmgregorich@gmail.com

Papers:

1. 8:00 AM - Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects using In-situ Formic Acid Vapor Treatment
SivaChandra Jangam - University of California, Los Angeles
Pranav Ambhore - University of California, Los Angeles
Adeel Bajwa - Kulicke and Soffa, Inc.
Subramanian Iyer - University of California, Los Angeles

2. 8:25 AM - Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
Guilian Gao - Xperi
Laura Mirkarimi - Xperi
Catharina Rudolph - Fraunhofer Institute for Reliability and Micro-Integration,
Thomas Werner - Fraunhofer Institute for Reliability and Micro-Integration,
Anke Hanisch - Fraunhofer Institute for Reliability and Micro-Integration,
Thomas Workman - Xperi
Gill Fountain - Xperi
Jeremy Theil - Xperi
Gabe Guevara - Xperi
Ping Liu - Xperi
Bongsub Lee - Xperi

3. 8:50 AM - Cu inter-diffusion behavior on wafer-to-wafer hybrid bonding
Seokho Kim - Samsung Electronics Company, Ltd.
Pilkyu Kang - Samsung Electronics Company, Ltd.
Taeyeong Kim - Samsung Electronics Company, Ltd.
Kyuha Lee - Samsung Electronics Company, Ltd.
Joohee Jang - Samsung Electronics Company, Ltd.
Jaehyung Park - Samsung Electronics Company, Ltd.
Hoechul Kim - Samsung Electronics Company, Ltd.
Hoonjoo Na - Samsung Electronics Company, Ltd.
Kwangjin Moon - Samsung Electronics Company, Ltd.
Kihyun Hwang - Samsung Electronics Company, Ltd.

4. 10:00 AM - Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper
Jing-Ye Juang - National Chiao Tung University
Kai-Cheng Shie - National Chiao Tung University
Yu-Jin Li - National Chiao Tung University
K. N. Tu - University of California at Los Angeles
Chih Chen - National Chiao Tung University

5. 10:25 AM - Sub-10µm Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization
John P. Mudrick - Sandia National Laboratories
Jonatan A. Sierra-Suarez - Sandia National Laboratories
Matthew B. Jordan - Sandia National Laboratories
T. A. Friedmann - Sandia National Laboratories
Robert Jarecki - Sandia National Laboratories
M. David Henry - Sandia National Laboratories

6. 10:50 AM - Cu pillar with nanocopper caps: the next interconnection node beyond traditional Cu pillar
Ramon Sosa - Georgia Institute of Technology
Kashyap Mohan - Georgia Institute of Technology
Antonia Antoniou - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

7. 11:15 AM - Cu-Cu bonding by low-temperature sintering of self-healable Cu nanoparticles
Junjie Li - Huazhong University of Science & Technology
Qi Liang - Huazhong University of Science & Technology
Chen Chen - Huazhong University of Science & Technology
Tielin Shi - Huazhong University of Science & Technology
Guanglan Liao - Huazhong University of Science & Technology
Zirong Tang - Huazhong University of Science & Technology