Technical Program

Thursday, May 30, 2019

Session 14: Fine-Pitch Solderless Bonding
8:00 AM - 11:40 AM
Committee: Interconnections

Session Co-Chairs:

Chuan Seng Tan
Nanyang Technological University
T +65-67905636
tancs@alum.mit.edu
Tom Gregorich
Zeiss Semiconductor Manufacturing Technology
T +1 208-297-0138
tmgregorich@gmail.com

Papers: