Technical Program

Thursday, June 01, 2017

Session 14: Heterogeneous Integration
8:00 AM - 11:40 AM
Committee: Advanced Packaging
joint with Assembly & Manufacturing Technology
Room: Southern Hemisphere II

Session Co-Chairs:

John Knickerbocker
IBM Corporation
T +1-914-945-3306
knickerj@us.ibm.com
Chunho Kim
Medtronic Corporation
T +1-480-377-3664
chunho.kim@medtronic.com

Papers: