Technical Program

Thursday, May 31, 2018

Session 13: Technologies Enabling 3D and Heterogeneous Integration
8:00 AM - 11:40 AM
Committee: Packaging Technologies

Session Co-Chairs:

Peng Su
Juniper Networks
T +1-408-936-5855
pensu@juniper.net
Subhash L. Shinde
Notre Dame University
T +1-574-631-1425
sshinde@nd.edu

Papers:

1. 8:00 AM - Active interposer technology for chiplet-based advanced 3D system architectures
Perceval Coudrain - CEA-LETI
Jean Charbonnier - CEA-LETI
Rémi Vélard - CEA-LETI
Andrea Vinci - Intitek
Arnaud Garnier - CEA-LETI
Didier Lattard - CEA-LETI
Pascal Vivet - CEA-LETI
Fabienne Ponthenier - CEA-LETI
Alexis Farcy - STMicroelectronics
Thierry Mourier - CEA-LETI

2. 8:25 AM - Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect Fabric
Meng-Hsiang Liu - Center for Heterogeneous Integration and Performance Scaling (CHIPS), UCLA
Amir Hanna - Center for Heterogeneous Integration and Performance Scaling (CHIPS), UCLA
Yandong Luo - Center for Heterogeneous Integration and Performance Scaling (CHIPS), UCLA
Zhe Wan - Center for Heterogeneous Integration and Performance Scaling (CHIPS), UCLA
Subramanian Iyer - Center for Heterogeneous Integration and Performance Scaling (CHIPS), UCLA

3. 8:50 AM - Active Through-Silicon Interposer based 2.5D IC design, fabrication, assembly and test
Jayasanker Jayabalan - Institute of Microelectronics
Vivek Chidambaram - Institute of Microelectronics
Sharon Lim Pei Siang - Institute of Microelectronics
Wang Xiangyu - Institute of Microelectronics
Jong Ming Chinq - Institute of Microelectronics
Surya Bhattacharya - Institute of Microelectronics

4. 10:00 AM - System on Integrated Chips (SoIC) for Next-generation Advanced System Integration Technology
M.F. Chen - tsmc
W.C. Chiou - tsmc
F.C. Chen - tsmc
C.H. Yu - tsmc

5. 10:25 AM - Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic
Luke England - GLOBALFOUNDRIES
Calvin Lee - ASE

6. 10:50 AM - Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
Alain Phommahaxay - IMEC
Samuel Suhard - IMEC
Pieter Bex - IMEC
Serena Iacovo - IMEC
John Slabbekoorn - IMEC
Fumihiro Inoue - IMEC
Lan Peng - IMEC
Koen Kennes - IMEC
Erik Sleeckx - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

7. 11:15 AM - The Thermal Dissipation Characteristics of the Novel System-in-Package Technology (ICE-SiP) for Mobile Packages and 3D High-end Packages
TAEJOO HWANG - Samsung Electronics Co., Ltd.
Dan(Kyung Suk ) Oh - Samsung Electronics Co., Ltd.
Eunseok Song - Samsung Electronics Co., Ltd.
Jaechoon Kim - Samsung Electronics Co., Ltd.
Jangwoo Lee - Samsung Electronics Co., Ltd.
SeungKon Mok - Samsung Electronics Co., Ltd.
Kilsoo Kim - Samsung Electronics Co., Ltd.