Technical Program

Thursday, June 01, 2017

Session 13: Interconnect Advances in FO & WLP
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Lei Shan
IBM Corporation
T +1-914-945-2304
Dingyou Zhang
Qualcomm Technologies, Inc.
T +1 858-845-5905


1. 8:00 AM - SLIMâ„¢ Advanced Fan-Out Packaging for High Performance Multi-die Solutions
David Hiner - Amkor Technology, Inc.
Moh Kolbehdari - Amkor Technology, Inc.
Michael Kelly - Amkor Technology, Inc.
Young Rae Kim - Amkor Technology, Inc.
Won Chul Do - Amkor Technology, Inc.
JaeHun Bae - Amkor Technology, Inc.
MinHwa Chang - Amkor Technology, Inc.
AhRa Jo - Amkor Technology, Inc.

2. 8:25 AM - 28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Kang Chen - STATS ChipPAC, Inc.
Linda Chua - STATS ChipPAC, Inc.
Won Kyung Choi - STATS ChipPAC, Inc.
Seng Guan Chow - STATS ChipPAC, Inc.
Seung Wook Yoon - STATS ChipPAC, Inc.

3. 8:50 AM - Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array
Rey Alvarado - Qualcomm Technologies, Inc.
Beth Keser - Qualcomm Technologies, Inc.
Tong Cui - Qualcomm Technologies, Inc.
Ahmer Syed - Qualcomm Technologies, Inc.
Steven Xu - Qualcomm Technologies, Inc.
Brian Roggeman - Qualcomm Technologies, Inc.

4. 10:00 AM - Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John Lau - ASM International
Ming Li - ASM International
DeWen Tian - ASM International
Nelson Fan - ASM International
Eric Kuah - ASM International
Wu Kai - ASM International
Zhang Li - Jiangyin Changdian Advanced Packaging Co., Ltd.
Kim Hwee Tan - Jiangyin Changdian Advanced Packaging Co., Ltd.
Rozalia Beica - Dow Chemical
Yu-Hua Chen - Unimicron
Margie Li - ASM International

5. 10:25 AM - A Novel 3D IC Wafer-Level Package for New Wave MEMS
Che-Hau Huang - Advanced Semiconductor Engineering, Inc
Ying-Te Ou - Advanced Semiconductor Engineering, Inc
Yung-Hui Wang - Advanced Semiconductor Engineering, Inc
Sebastian Schuler-Wakins - Robert Bosch GmbH
Ralf Reichenbach - Robert Bosch GmbH
David Polityko - Robert Bosch GmbH
Uwe Hansen - Robert Bosch GmbH

6. 10:50 AM - First Demonstration of Photoresist Cleaning for Fine Line RDL Yield Enhancement by an Innovative Ozone Treatment Process for Panel Fan-out and Interposers
Atul Gupta - MKS Instruments
Eric Snyder - MKS Instruments
Christiane Gottschalk - MKS Instruments
James Gunn - MKS Instruments
Kevin Wenzel - MKS Instruments
Hao Lu - Georgia Institute of Technology
Yuya Suzuki - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

7. 11:15 AM - Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package
Srinivasa Rao Vempati - Institute of Microelectronics, A*STAR
David Ho - Institute of Microelectronics, A*STAR
Mian Zhi Ding - Institute of Microelectronics, A*STAR
Ser Choong Chong - Institute of Microelectronics, A*STAR
Sharon Lim PS - Institute of Microelectronics, A*STAR
Tai Chong Chai - Institute of Microelectronics, A*STAR
Daniel Ismael - Institute of Microelectronics, A*STAR
Ye Yong Liang - Institute of Microelectronics, A*STAR