Technical Program

Thursday, May 30, 2019

Session 13: Technologies Enabling 3D and Heterogeneous Integration
8:00 AM - 11:40 AM
Committee: Packaging Technologies

Session Co-Chairs:

Peng Su
Juniper Networks
T +1-408-936-5855
pensu@juniper.net
Subhash L. Shinde
Notre Dame University
T +1-574-631-1425
sshinde@nd.edu

Papers: