Technical Program

Thursday, June 01, 2017

Session 13: Interconnect Advances in FO & WLP
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Lei Shan
IBM Corporation
T +1-914-945-2304
Dingyou Zhang
T +1 8588455905


1. 8:00 AM - SLIMâ„¢ Advanced Fan-Out Packaging for High Performance Multi-die Solutions
David Hiner - Amkor
Moh Kolbehdari - Amkor
Michael Kelly - Amkor
Young Rae Kim - Amkor
Won Chul Do - Amkor
JaeHun Bae - Amkor
MinHwa Chang - Amkor
AhRa Jo - Amkor

2. 8:25 AM - 28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Kang Chen - STATS ChipPAC
Linda Chua - STATS ChipPAC
Won Kyung Choi - STATS ChipPAC
Seng Guan Chow - STATS ChipPAC
Seung Wook Yoon - STATS ChipPAC

3. 8:50 AM - Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array
Rey Alvarado - Qualcomm
Beth Keser - Qualcomm
Tong Cui - Qualcomm
Ahmer Syed - Qualcomm
Steven Xu - Qualcomm
Brian Roggeman - Qualcomm

4. 10:00 AM - Warpage and Thermal Optimization of Fan-Out Wafer-Level Packaging
John Lau - ASM
Ming Li - ASM
DeWen Tian - ASM
Nelson Fan - ASM
Eric Kuah - ASM
Wu Kai - ASM
Zhang Li - JCAP
Kim Hwee Tan - JCAP
Rozalia Beica - Dow Chemical
Yu-Hua Chen - Unimicron
Margie Li - ASM

5. 10:25 AM - A Novel 3D IC Wafer-Level Package for New Wave MEMS
Che-Hau Huang - ASE
Ying-Te Ou - ASE
Yung-Hui Wang - ASE
Sebastian Schuler-Wakins - ROBERT BOSCH
Ralf Reichenbach - ROBERT BOSCH
David Polityko - ROBERT BOSCH

6. 10:50 AM - First Demonstration of Photoresist Cleaning for Fine Line RDL Yield Enhancement by an Innovative Ozone Treatment Process for Panel Fan-out and Interposers
Atul Gupta - MKS Instruments
Eric Snyder - MKS Instruments
Christiane Gottschalk - MKS Instruments
James Gunn - MKS Instruments
Kevin Wenzel - MKS Instruments
Hao Lu - Georgia Institute of Technology
Yuya Suzuki - Georgia Institute of Technology
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

7. 11:15 AM - Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package
Srinivasa Rao Vempati - IME, A*STAR
David Ho - IME, A*STAR
Mian Zhi Ding - IME, A*STAR
Ser Choong Chong - IME, A*STAR
Sharon Lim PS - IME, A*STAR
Tai Chong Chai - IME, A*STAR
Daniel Ismael - IME, A*STAR
Ye Yong Liang - IME, A*STAR