Technical Program

Thursday, June 01, 2017

Session 13: Interconnect Advances in FO & WLP
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

Lei Shan
IBM Corporation
T +1-914-945-2304
leis@us.ibm.com
Dingyou Zhang
Qualcomm Technologies, Inc.
T +1 858-845-5905
zhangdingyou04@gmail.com

Papers: