Technical Program

Wednesday, May 30, 2018

Session 12: Advanced Photonic Devices and Packaging
1:30 PM - 5:10 PM
Committee: Photonics

Session Co-Chairs:

Stephane Bernabe
CEA Leti
T +33 4 38 78 05 10
Ping Zhou
LDX Optronics, Inc.
T +1-865-981-8822


1. 1:30 PM - Micro-fabricated SERF Atomic Magnetometer for Weak Gradient Magnetic Field Detection
Xiang Yue - Key Lab of MEMS of Education Ministry,Southeast University
Jintang Shang Chen Ye

2. 1:55 PM - Highly reliable white LED chip fabricated by direct printing phosphor glass layer on LED wafer
Yang Peng - Huazhong University of Science and Technology
Yun Mou - Huazhong University of Science and Technology
Hao Wang - Huazhong University of Science and Technology
Mingxiang Chen - Huazhong University of Science and Technology
Xiaobing Luo - Huazhong University of Science and Technology

3. 2:20 PM - Collective curved CMOS sensor process: application for high-resolution optical design and assembly challenges.
Bertrand Chambion - CEA-LETI
Christophe Gaschet - CEA-LETI
Marc Lombard - CEA-LETI
Maïlys Fernandez - CEA-LETI
Fabien Zuber - CEA-LETI
Stéphane Caplet - CEA-LETI
Aurélie Vandeneynde - CEA-LETI
David Henry - CEA-LETI

4. 3:30 PM - Silicon Photonic 4X4 Switch with Flip-Chip Integrated Semiconductor Optical Amplifiers
Fuad Doany - IBM Research
Nicolas Dupuis - IBM Research
Russell Budd - IBM Research
Laurent Schares - IBM Research
Christian Baks - IBM Research
Daniel Kuchta - IBM Research
Benjamin Lee - IBM Research

5. 3:55 PM - Y-branched multimode / single-mode polymer optical waveguides for low-loss WDM MUX device: fabrication and characterization
Takaaki Ishigure - Keio University
Tomoki Nakayama - Keio University
Fukino Nakazaki - Keio University
Hiroki Hama - Keio University

6. 4:20 PM - Vertically stacked and directionally coupled cavity-resonator-integrated grating couplers for integrated-optic beam steering
Shogo Ura - Kyoto Institute of Technology
Junichi Inoue - Kyoto Instute of Technology
Kenji Kintaka - National Instute of Advanced Industrial Science and Technolo

7. 4:45 PM - CiB(Chip-in-Board) Optical Engine Module Using Advanced Fan-Out Package Technology
Sang yong PARK - NEPES Corporation
Jun Kyu LEE - NEPES Corporation
Young Tae KWON - NEPES Corporation
Jong Heon KIM - NEPES Corporation
Nam Chul KIM - NEPES Corporation
Chang Woo LEE - NEPES Corporation
Ju Hyun NAM - NEPES Corporation
Ji Ni SHIM - NEPES Corporation
Sung Hyuk Lee - NEPES Corporation