Technical Program

Wednesday, May 31, 2017

Session 12: Advanced Optical Components and Modules
1:30 PM - 5:10 PM
Committee: Optoelectronics
Room: Americas Seminar

Session Co-Chairs:

Stephane Bernabe
CEA Leti
T +33 4 38 78 05 10
stephane.bernabe@cea.fr
Shogo Ura
Kyoto Institute of Technology
T +81-75-724-7424
ura@kit.ac.jp

Papers:

1. 1:30 PM - Low Loss Channel-Shuffling Polymer Waveguides: Design and Fabrication
Kohei Abe - Keio University
Yutaro Oizumi - Keio University
Yoichi Taira - Keio University
Takaaki Ishigure - Keio University

2. 1:55 PM - A Very High-Dense On-Board Optical Module Realizing >1.3 Tb/s/inch²
Kazuya Nagashima - Furukawa Electric
Toshinori Uemura - Furukawa Electric
Atsushi Izawa - Furukawa Electric
Yozo Ishikawa - Furukawa Electric
Hideyuki Nasu - Furukawa Electric

3. 2:20 PM - Design and Demonstration of a Photonic Integrated Glass Interposer for Mid-Board-Optical Engines
Marcel Neitz - Technical University Berlin
Markus Wöhrmann - Fraunhofer IZM
Ruiyong Zhang - Amphenol FCI
Mohamed Fikry - Amphenol FCI
Sebastian Marx - Technical University Berlin
Henning Schröder - Fraunhofer IZM

4. 3:30 PM - Optoelectronic Chip Assembly Process of Optical MCM
Masao Tokunari - IBM Corporation
Koji Masuda - IBM Corporation
Hsiang-Han Hsu - IBM Corporation
Takashi Hisada - IBM Corporation
Shigeru Nakagawa - IBM Corporation
Richard Langlois - IBM Corporation
Patrick Jacques - IBM Corporation
Paul Fortier - IBM Corporation

5. 3:55 PM - 3D Packaging of Embedded Opto-electronic Die and CMOS IC Based on Wet Etched Silicon Interposer
Chenhui Li - Eindhoven University of Technology
Barry Smalbrugge - Eindhoven University of Technology
Teng Li - Eindhoven University of Technology
Ripalta Stabile - Eindhoven University of Technology
Oded Raz - Eindhoven University of Technology

6. 4:20 PM - Self-Alignment with Copper Pillars Micro-Bumps for Positioning Optical Devices at Submicronic Accuracy
Yézouma Dieudonné Zonou - CEA-Leti
Stéphane Bernabe - CEA-Leti
Daivid Fowler - CEA-Leti
Mireille Francou - CEA-Leti
Olivier Castany - CEA-Leti
Philippe Arguel, - Laboratory for Analysis and Architecture of Systems, CNRS

7. 4:45 PM - Thermal Management Characterization of Microassemblied High Power Distributed-Feedback Broad Area Lasers Emitting at 975nm
Roberto Mostallino - III-V Lab
Michel Garcia - III-V Lab
Yannick Deshayes - University of Bordeaux
Alexandre Larrue - III-V Lab
Yannick Robert - III-V Lab
Eric Vinet - III-V Lab
Michel Lecomte - III-V Lab
Olivier Parillaud - III-V Lab
Michel Krakowski - III-V Lab
Laurent Bechou - University of Bordeaux