Technical Program

Wednesday, May 30, 2018

Session 11: Automotive and Harsh-Environment Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability

Session Co-Chairs:

Sandy Klengel
Fraunhofer Institute for Microstructure of Materials and Systems
T +49 1733592438
Vikas Gupta
Texas Instruments, Inc.
T +1-214-567-3160


1. 1:30 PM - Improvement on thermal-aging reliability of Ag sinter joining on gold surface finished substrates via a preheating treatment
Zheng Zhang - Institute of Scientific and Industrial Research, Osaka Unive
Chuantong Chen - Institute of Scientific and Industrial Research, Osaka Unive
Katsuaki Suganuma - Institute of Scientific and Industrial Research, Osaka Unive

2. 1:55 PM - Package Material Selection Criteria for High Temperature Automotive Applications
Rene Rongen - NXP Semiconductors
Amar Mavinkurve - NXP Semiconductors
Orla O'Halloran - NXP Semiconductors
Norman Owens - NXP Semiconductors
Yann Weber - NXP Semiconductors
Pascal Oberndorff - NXP Semiconductors
Mark Luke Farrugia - NXP Semiconductors
Erik van Olst - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors

3. 2:20 PM - Solder Joint Reliability of Double-side Mounted DDR Modules for Consumer and Automotive Applications
Dongji Dongji - Nvidia Corp.
Joe Hai - Nvidia Corp.
zhongming Wu - Nvidia
Manthos Economou - Nvidia
Dongji Xie

4. 3:30 PM - Reliability Investigation of Extremely Large Ratio Fan-Out Wafer-Level Package with Low Ball Density for Ultra-Short-Range Radar
PuShan Huang - MediaTek Inc.

5. 3:55 PM - Fatigue Behaviour of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads
Karsten Meier - Technische Universität Dresden
Maria Winkler - Technische Universität Dresden
David Leslie - CALCE, University of Maryland
Abhijit Dasgupta - CALCE, University of Maryland
Karlheinz Bock - Technische Universität Dresden

6. 4:20 PM - Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Automotive Electronics
Pradeep Lall - Auburn University
Tony Thomas - Auburn University
Jeff Suhling - Auburn University

7. 4:45 PM - Electrochemical Impedance Spectroscopy (EIS) for monitoring the water load on PCBAs to predict electrochemical migration under DC loads
Simone Lauser - Robert Bosch GmbH
Theresia Richter - Robert Bosch GmbH
Rajan Ambat - Technical University of Denmark
Vadimas Verdingovas - Technical University od Denmark