Technical Program

Wednesday, May 31, 2017

Session 11: Mechanical Modeling and Characterization of Interposers and Interconnections
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Southern Hemisphere IV

Session Co-Chairs:

Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925
knchiang@pme.nthu.edu.tw
Tony Mak
Wentworth Institute of Technology
T +1-334-625-8669
t.mak@ieee.org

Papers: