Technical Program

Wednesday, May 31, 2017

Session 11: Mechanical Modeling and Characterization of Interposers and Interconnections
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Southern Hemisphere IV

Session Co-Chairs:

Kuo-Ning Chiang
National Tsinghua University
T +886-3-574-2925
Tony Mak
Wentworth Institute of Technology
T +1-334-625-8669


1. 1:30 PM - Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit
Bulong Wu - University of Maryland
Dae-Suk Kim - University of Maryland
Bongtae Han - University of Maryland
Alicja Palczynska - Robert Bosch GmbH
Przemyslaw Jakub Gromala - Robert Bosch GmbH
Alexandru Prisacaru - Robert Bosch GmbH

2. 1:55 PM - Semiconductor Power Package Bonding Interconnects Reliability Simulation under Transient Thermal Loads
Qiuxiao Qian - ON Semiconductor
Roger Stout - ON Semiconductor
Yong Liu - ON Semiconductor

3. 2:20 PM - Correlation of Dielectric Film Flex Fatigue Resistance and Package Resin Cracking Failure
Joseph Ross - IBM Corporation
Nicolas Pizzuti - IBM Corporation
Steven Ostrander - IBM Corporation
Kamal Sikka - IBM Corporation

4. 3:30 PM - Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation
Pradeep Lall - Auburn University
Nakul Kothari - Auburn University
John Deep - US Air Force Research Labs
Jason Foley - US Air Force Research Labs
Ryan Lowe - ARA Associates

5. 3:55 PM - Dynamic Stress Measurements of Electronic Devices During Active Operation
Markus Feisst - University of Freiburg, IMTEK
Eike Moeller - University of Freiburg, IMTEK
Jürgen Wilde - University of Freiburg, IMTEK

6. 4:20 PM - Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronic Packages
Aurore Quelennec - Université de Sherbrooke
Umar Shafique - Université de Sherbrooke
Éric Duchesne - IBM Corporation
Hélène Frémont - Université de Bordeaux
Dominique Drouin - Université de Sherbrooke

7. 4:45 PM - Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques
Nima E. Gorji - Dublin City University
Rajani K. Vijayaraghavan - Dublin City University
Brian K. Tanner - Durham University
Andreas N. Danilewsky - Albert Ludwigs University
Patrick J. McNally - Dublin City University