Technical Program

Wednesday, May 29, 2019

Session 11: Automotive and Harsh-Environment Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability

Session Co-Chairs:

Sandy Klengel
Fraunhofer Institute for Microstructure of Materials and Systems
T +49 1733592438
sandy.klengel@imws.fraunhofer.de
Vikas Gupta
Texas Instruments, Inc.
T +1-214-567-3160
gvikas@ti.com

Papers:

1. 1:30 PM - Improvement on Thermal-Aging Reliability of Ag Sinter Joining on Gold Surface Finished Substrates via a Preheating Treatment
Zheng Zhang - Osaka University
Chuantong Chen - Osaka University
Katsuaki Suganuma - Osaka University

2. 1:55 PM - Package Material Selection Criteria for High Temperature Automotive Applications
Rene Rongen - NXP Semiconductors
Amar Mavinkurve - NXP Semiconductors
Orla O'Halloran - NXP Semiconductors
Norman Owens - NXP Semiconductors
Yann Weber - NXP Semiconductors
Pascal Oberndorff - NXP Semiconductors
Mark Luke Farrugia - NXP Semiconductors
Erik van Olst - NXP Semiconductors
Michiel van Soestbergen - NXP Semiconductors

3. 2:20 PM - Solder Joint Reliability of Double-Side Mounted DDR Modules for Consumer and Automotive Applications
Dongji Dongji - Nvidia Corp.
Joe Hai - Nvidia Corp.
zhongming Wu - Nvidia Corp.
Manthos Economou - Nvidia Corp.
Dongji Xie

4. 3:30 PM - Reliability Investigation of Extremely Large Ratio Fan-Out Wafer-Level Package With Low Ball Density for Ultra-Short-Range Radar
PuShan Huang - MediaTek Inc.

5. 3:55 PM - Fatigue Behavior of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads
Karsten Meier - Dresden University of Technology
Maria Winkler - Dresden University of Technology
David Leslie - University of Maryland
Abhijit Dasgupta - University of Maryland
Karlheinz Bock - Dresden University of Technology

6. 4:20 PM - Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Automotive Electronics
Pradeep Lall - Auburn University
Tony Thomas - Auburn University
Jeff Suhling - Auburn University

7. 4:45 PM - Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs During Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loads
Simone Lauser - Robert Bosch GmbH
Theresia Richter - Robert Bosch GmbH
Rajan Ambat - Technical University of Denmark
Vadimas Verdingovas - Technical University of Denmark