Technical Program

Wednesday, May 31, 2017

Session 1: Fan-Out Packaging Process and Integration
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Southern Hemisphere II

Session Co-Chairs:

Beth Keser
Intel Corporation
Mike Ma
Amkor Technology Taiwan (ATT)
T +886-975-778628


1. 8:00 AM - Development of a Multi-Project Fan-Out Wafer Level Packaging Platform
Tanja Braun - Fraunhofer IZM
Stefan Raatz - Fraunhofer IZM
Steve Voges - Technical University Berlin
U. Maass - Fraunhofer IZM
Marius van Dijk - Fraunhofer IZM
H. Walter - Fraunhofer IZM
O. Hölck - Fraunhofer IZM
Karl-Friedrich Becker - Fraunhofer IZM
M. Töpper - Fraunhofer IZM
Rolf Aschenbrenner - Fraunhofer IZM
Markus Wöhrmann - Technical University Berlin

2. 8:25 AM - SLIM™, High Density Wafer Level Fan-Out Package Development with Submicron RDL
Youngrae Kim - Amkor
JaeHun Bae - Amkor
MinHwa Chang - Amkor
AhRa Jo - Amkor
Ji Hyun Kim - Amkor
SangEun Park - Amkor
David Hiner - Amkor
Mike Kelly - Amkor
WonChul Do - Amkor

3. 8:50 AM - Development of Novel High Density System Integration Solutions in FOWLP – Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages
André Cardoso - NANIUM
Alberto Martins - NANIUM
Hugo Barros - NANIUM
Elisabete Fernandes - NANIUM
Abel Janeiro - NANIUM
Paulo Cardoso - NANIUM
Leonor Dias - NANIUM

4. 10:00 AM - Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
Ying-Chih Lee - ASE
Wei-Hong Lai - ASE
Ian Hu - ASE
Meng-Kai Shih - ASE
Chin-Li Kao - ASE
David Tarng - ASE
Ching-Pin Hung - ASE

5. 10:25 AM - Embedded Si Fan-Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-bonding Processes
Daquan Yu - Huatian Technology
Zhenrui Huang - Huatian Technology
Zhiyi Xiao - Huatian Technology
Li Yang - Huatian Technology
Min Xiang - Huatian Technology

6. 10:50 AM - Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP
Wen-Wei Shen - ITRI
Yu-Min Lin - ITRI
Hsiang-Hung Chang - ITRI
Tzu-Ying Kuo - ITRI
Tao-Chih Chang - ITRI
Ang-Ying Lin - ITRI
Alvin Lee - Brewer Science
Jay Su - Brewer Science
Baron Huang - Brewer Science
Kuan-Neng Chen Chen - NCTU
Huan-Chun Fu

7. 11:15 AM - First Demonstration of Panel Glass Fan-out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration
Tailong Shi - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Yoichiro Sato - Asahi Glass Company
Lutz Parthier - SCHOTT
Frank Wei - DISCO
Cody Lee - DISCO
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Chintan Buch - Georgia Institute of Technology