Technical Program

Wednesday, May 31, 2017

Session 1: Fan-Out Packaging Process and Integration
8:00 AM - 11:40 AM
Committee: Advanced Packaging
Room: Southern Hemisphere II

Session Co-Chairs:

Beth Keser
Intel Corporation
T
beth.keser@intel.com
Mike Ma
Amkor Technology Taiwan (ATT)
T +886-988-105685
mike.ma@amkor.com

Papers: