Technical Program

Wednesday, June 02, 2010

Session 4: Pb-Free Solder and Intermetallic Compounds
8:00 AM - 11:40 AM
Committee: Materials & Processing
Champagne 2

Session Co-Chairs:

Chin C. Lee
University of California, Irvine
T +1-949-824-7462
F +1-949-824-3732
cclee@uci.edu

Eric Perfecto
IBM Corporation
T +1-845-894-4400
F +1-845-892-6635
perfecto@us.ibm.com

Papers:

1. 8:00 AM - Near-Eutectic Sn-Ag-Cu Solder Bumps Formation for Flip-Chip Interconnection by Electrodeposition
Yi Qin- Loughborough University
Changqing Liu- Loughborough University
G.D. Wilcox- Loughborough University
Kun Zhao- Heriot-Watt University
Changhai Wang- Heriot-Watt University

2. 8:25 AM - A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application
Hae-Yonng Cho- Hanyang University
Tae-Jin Kim- Hanyang University
Young Min Kim- Hanyang University
Sun-Chul Kim- Hanyang University
Jin-Young Park- Hanyang University
Young-Ho Kim- Hanyang University

3. 8:50 AM - Low Temperature Bonding to 304 Stainless Steel for High Temperature Electronic Packages
Chu-Hsuan Sha- University of California, Irvine
Chin C. Lee- University of California, Irvine

4. 10:00 AM - A Synchrotron Micro-Diffraction Investigation of Crystallographic Texture of High-Sn Alloy Films and Its Effects on Whisker Growth
Pylin Sarobol- Purdue University
Aaron Pedigo- Purdue University
John Blendell- Purdue University
Carol Handwerker- Purdue University
Peng Su- Cisco Systems, Inc.
Li Li- Cisco Systems, Inc.
Jie Xue- Cisco Systems, Inc.

5. 10:25 AM - Effect of Ag on Ripening Growth of Cu6Sn5 Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu
Moon Gi Cho- KAIST, Samsung Electronics
Yong Sung Park- KAIST
Sun-Kyoung Seo- KAIST
Kyung-Wook Paik- KAIST
Hyuck Mo Lee- KAIST

6. 10:50 AM - Effect of Electromigration on Intermetallic Compound Formation in Line-Type Cu/Sn/Cu and Cu/Sn/Ni Interconnects
L.D. Chen- Dalian University of Technology
M.L. Huang- Dalian University of Technology
S.M. Zhou- Dalian University of Technology

7. 11:15 AM - Acceptance Testing of BGA Ball Alloys
Aileen Allen- Hewlett Packard
Gregory Henshall- Hewlett Packard
Kris Troxel- Hewlett Packard
Jian Miremadi- Hewlett Packard
Elizabeth Benedetto- Hewlett Packard
Helen Holder- Hewlett Packard
Michael Roesch- Hewlett Packard