Technical Program

Friday, June 04, 2010

Session 34: Solder and Interconnect Enhancement
1:30 PM - 5:10 PM
Committee: Applied Reliability
Champagne 2

Session Co-Chairs:

Darvin R. Edwards
Texas Instruments, Inc.
T +1-972-995-3569
F +1-972-995-2658
rvin@ti.com

Mikel Miller
Texas Instruments, Inc.
T +1-972-995-5033
F
mikel@ti.com

Papers:

1. 1:30 PM - Reduction of Lead Free Solder Aging Effects Using Doped SAC Alloys
Zijie Cai- Auburn University
Yifei Zhang- Auburn University
Jeffrey C. Suhling- Auburn University
Pradeep Lall- Auburn University
R. Wayne Johnson- Auburn University
Michael J. Bozack- Auburn University

2. 1:55 PM - Effects of PCB Design Variations on Bend and ATC Performance of Lead-Free Solder Joints
Hongtao Ma- Cisco Systems, Inc.
Kuo-Chuan Liu- Cisco Systems, Inc.
Tae-Kyu Lee- Cisco Systems, Inc.
Dong Hyun Kim- Cisco Systems, Inc.

3. 2:20 PM - Effects of Microstructure Evolution on Damage Accumulation in Lead Free Solder Joints
Linlin Yang- Binghamton University
Liang Yin- Universal Instruments Corporation
Brian Roggeman- Universal Instruments Corporation
Peter Borgesen- Binghamton University

4. 3:30 PM - Improved Reliability of Sn-Ag-Cu-In Solder Alloy by the Addition of Minor Elements
A-Mi Yu- Inha University
Jae-Won Jang- Inha University
Jun-Ki Kim- KITECH
Jong-Hyun Lee- Seoul National University of Technology
Mok-Soon Kim- Inha University

5. 3:55 PM - Effects of Isothermal Aging and In-Situ Current Stress on the Reliability of Lead-Free Solder Joints
Anurag Bansal- Cisco Systems, Inc.
Tae-Kyu Lee- Cisco Systems, Inc.
Kuo-Chuan Liu- Cisco Systems, Inc.
Jie Xue- Cisco Systems, Inc.

6. 4:20 PM - Investigation of Bump Crack and Deformation on Pb-Free Flip Chip Packages
Jeremias Libres- Texas Instruments, Inc.
J. Carlos Arroyo- Texas Instruments, Inc.

7. 4:45 PM - Pd Effects on the Reliability in the Low Cost Ag Bonding Wire
Jong Soo Cho- MK Electron Co., Ltd.; Seoul National University
Kyeong Ah Yoo- MK Electron Co., Ltd.
Sung Jae Hong- MK Electron Co., Ltd.
Jeong Tak Moon- MK Electron Co., Ltd.
Yong Je Lee- Samsung Electronics
Wongil Han- Samsung Electronics
Hanki Park- Samsung Electronics
Seung Weon Ha- Samsung Electronics
Seong Bum Son- Seoul National University
Suk-Hoon Kang- Seoul National University
Kyu-Hwan Oh- Seoul National University