Electronic Components and Technology Conference

Technical Program

Friday, June 04, 2010

Session 32: Fine Pitch Flip Chip
1:30 PM - 5:10 PM
Committee: Interconnections
Versailles 1 & 2

Session Co-Chairs:

Prema Palaniappan
Texas Instruments, Inc.
T +1-972-995-2189
F +1-972-995-2658
prema.palaniappan@ti.com 		Akitsu Shigetou
National Institute for Materials Science
T +81-29-860-4342
F +81-29-860-4669
shigetou.akitsu@nims.go.jp

Papers:

1. 1:30 PM - Reliability of Cu Pillar Bumps for Flip-Chip Packages with Ultra Low-k Dielectrics
Yiwei Wang- University of Texas, Austin
Kuan H. Lu- University of Texas, Austin
Jay Im- University of Texas, Austin
Paul S. Ho- University of Texas, Austin

2. 1:55 PM - Compliant, Copper Based Chip to Substrate Connections
Hyo-Chol Koo- Georgia Institute of Technology
C. Hunter Lightsey- Georgia Institute of Technology
Ping An- Georgia Institute of Technology
Paul A. Kohl- Georgia Institute of Technology

3. 2:20 PM - Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials
Kiyokazu Yasuda- Nagoya University

4. 3:30 PM - Cu Pillars on Substrates - A Low-Cost Alternative for the Next Generation of Flip Chip Packaging Technology
D. Gupta- Tessera, Inc.
H. Sato- Tessera, Inc.
Y. Nakadaira- Tessera, Inc.

5. 3:55 PM - A Package Demonstration with Solder Free Compliant Flexible Interconnects.
I. Shubin- Oracle
A. Chow- Oracle
J. Cunningham- Oracle
M. Giere- Oracle
N. Nettleton- Oracle
N. Pinckney- Oracle
J. Shi- Oracle
J. Simons- Oracle
R. Hopkins- Oracle
J. Mitchell- Oracle
D. Douglas- Oracle
E.M. Chow- Palo Alto Research Center (PARC)

6. 4:20 PM - Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability
Yong-Sung Park- KAIST
Yong-Min Kwon- KAIST
Jeong-Tak Moon- MK Electron Co., Ltd.
Young-Woo Lee- MK Electron Co., Ltd.
Jae-Hong Lee- MK Electron Co., Ltd.
Kyung-Wook Paik- MK Electron Co., Ltd.

7. 4:45 PM - Solidification Behavior of Lead Free and Tin Lead Solder Bumps
Robert Darveaux- Amkor Technology, Inc.
Corey Reichman- Amkor Technology, Inc.
Parul Agrawal- Amkor Technology, Inc.