Technical Program
Wednesday, June 02, 2010
Session 2: 3D/TSV Innovation and Characterization
8:00 AM - 11:40 AM
Committee: Interconnections
Versailles 1 & 2
Session Co-Chairs:
|
James E. Morris Portland State University T +1-503-725-9588 F +1-503-725-3807 j.e.morris@ieee.org |
Gilles Poupon CEA LETI - MINATEC T +33-438-785-399 F +33-438-785-183 gilles.poupon@cea.fr |
Papers:
1. 8:00 AM - Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects
Kuan H. Lu- University of Texas, Austin
Suk-Kyu Ryu- University of Texas, Austin
Qiu Zhao- University of Texas, Austin
Xuefeng Zhang- University of Texas, Austin
Jay Im- University of Texas, Austin
Rui Huang- University of Texas, Austin
Paul S. Ho- University of Texas, Austin
2. 8:25 AM - THz-Wave Propagation Characteristics of TSV-Based Transmission Lines and Interconnects
Sanming Hu- Institute of Microelectronics, A*STAR
Yong-Zhong Xiong- Institute of Microelectronics, A*STAR
Jinglin Shi- Institute of Microelectronics, A*STAR
Lei Wang- Institute of Microelectronics, A*STAR
Bo Zhang- Institute of Microelectronics, A*STAR
Dan Zhao- Institute of Microelectronics, A*STAR
Teck Guan Lim- Institute of Microelectronics, A*STAR
Xiaojun Yuan- Institute of Microelectronics, A*STAR
3. 8:50 AM - Analysis of Carbon Nanotube Based Through Silicon Vias
Sukeshwar Kannan- University of Alabama
Anurag Gupta- University of Alabama
Bruce C. Kim- University of Alabama
Falah Mohammed- AN-Najah National University
Byoungchul Ahn- Yeungnam University
4. 10:00 AM - Terabit/s-Class 24-Channel Bidirectional Optical Transceiver Module Based on TSV Si Carrier for Board-Level Interconnects
Fuad E. Doany- IBM Corporation
Benjamin G. Lee- IBM Corporation
Clint L. Schow- IBM Corporation
Cornelia K. Tsang- IBM Corporation
Christian Baks- IBM Corporation
Young Kwark- IBM Corporation
Richard John- IBM Corporation
John U. Knickerbocker- IBM Corporation
Jeffrey A. Kash- IBM Corporation
5. 10:25 AM - 3-D Thin Film Interposer Based on TGV (Through Glass Vias): An Alternative to Si-Interposer
Michael Töpper- Fraunhofer IZM
Ivan Ndip- Fraunhofer IZM
Robert Erxleben- Fraunhofer IZM
Lars Brusberg- Fraunhofer IZM
Nils Nissen- Fraunhofer IZM
Henning Schröder- Fraunhofer IZM
Hidefumi Yamamoto- NEC Schott Components Corporation
Guido Todt- Schott Electronic Packaging GmbH
Herbert Reichl- Fraunhofer IZM
6. 10:50 AM - Development of CMOS-Process-Compatible Interconnect Technology for 3D Stacking of NAND Flash Memory Chips
X.Q. Shi- ASTRI
P. Sun- ASTRI
Y.K. Tsui- ASTRI
P.C. Law- ASTRI
S.K. Yau- ASTRI
C.K. Leung- ASTRI
Y. Liu- ASTRI
C.H. Chung- ASTRI
S.L. Ma- Peking University
M. Miao- Peking University
Y.F. Jin- Peking University
7. 11:15 AM - Design and Fabrication of a Reliability Test Chip for 3D-TSV
A.D. Trigg- Institute of Microelectronics, A*STAR
Li Hong Yu- Institute of Microelectronics, A*STAR
Xiaowu Zhang - Institute of Microelectronics, A*STAR
Chai Tai Chong- Institute of Microelectronics, A*STAR
Cheng Cheng Kuo- Institute of Microelectronics, A*STAR
Navas Khan- Institute of Microelectronics, A*STAR
Yu Daquan- Institute of Microelectronics, A*STAR